00195941-03-UM SiplaceCA-EN.pdf - 第155页

User Manual SIPLACE CA 3 Technical Data Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS) 155 3.7.4.2 Flip Chip Segment 1 (z- direction) 3 Fig. 3.7 - 7 Flip Chip Segment 1 (z-dire ction) (1) The x-axis of the flip chip s…

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3 Technical Data User Manual SIPLACE CA
3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN
154
3.7.3.5 Pickup Process
During the pickup process the die is passed on to the tool or the nozzle on the flip unit. After that
the flip unit passes the die on to the placement head (flip chip process) or to the die attach unit
(die attach process).
After another rotation process the die attach unit provides the die for pickup by the placement
head.
The following equipment is required for this step:
Flip unit
Die attach unit (optional)
3.7.4 Details of the Pick & Transfer Process
3.7.4.1 Flip Chip Segment 1 (Nozzle)
3
Fig. 3.7 - 6 Flip Chip Segment 1 (Nozzle)
(1) The wafer X-Y travels to the next chip
(2) The flip chip rotary unit segment 1 turns to the handover position "Die Attach".
During the rotation (from the camera "free Position") the picture recognition of the next chip
is carried out. 3
Wafer
Camera
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.7 SIPLACE Wafer System (SWS)
155
3.7.4.2 Flip Chip Segment 1 (z-direction)
3
Fig. 3.7 - 7 Flip Chip Segment 1 (z-direction)
(1) The x-axis of the flip chip swivel segment 1 is moved to the transfer position.
3 Technical Data User Manual SIPLACE CA
3.7 SIPLACE Wafer System (SWS) Edition 08/2011 EN
156
3.7.4.3 Die Attach Transfer Position
3
Fig. 3.7 - 8 Die Attach Transfer Position
(1) The die attach rotates to the transfer position.
(2) The SIPLACE head picks the chip up from the die attach segment and rotates to the next star
position.
(3) At the same time the X axis retracts the segment nr. 1 back into the home position.
(4) The flip chip unit - segment nr. 1 rotates to the transfer position and picks up the next chip.
NOTE 3
While using the die attach unit only the segment nr.1 of the flip chip unit is ative.