00195941-03-UM SiplaceCA-EN.pdf - 第146页

3 Technical Data User Manual SIPLACE CA 3.6 Overview of Modules Edition 08/2011 EN 146 3.6 Overview of Modules 3.6.1 Overview of M odules in SIPLACE CA4 3 3 Fig. 3.6 - 1 CA4 machine with SWS - overview of modules (1) Mac…

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User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.5 Line Concept
145
The machine is equipped with both SIPLACE wafer systems and with changeover tables and can
therefore produce the entire product with SMDs and bare dies, in one production cycle.
The SIPLACE CA even demonstrates a higher throughput performance than previous placement
systems for products which are only placed with bare dies.
Since this new concept combines at least two production lines to form a single lines (SMD and
bare die placement), the investment costs and cost of ownership can be reduced significantly.
In the medium term the customer can switch production from IC package placement to bare die
placement, in order to improve handling times, product costs and product dimensions.
3 Technical Data User Manual SIPLACE CA
3.6 Overview of Modules Edition 08/2011 EN
146
3.6 Overview of Modules
3.6.1 Overview of Modules in SIPLACE CA4
3
3
Fig. 3.6 - 1 CA4 machine with SWS - overview of modules
(1) Machine frame (2) PCB conveyor
(flexible dual conveyor)
(3) Extension kit on the PCB input side (4) Component trolley docking unit,
tape cutter, used tape channel
(5) Gantry 1 with placement head (6) Gantry 2 with placement head
(7) Extension kit on the PCB output side (8) Gantry 3 with placement head
(9) Monitor screen (2x) (10) Keyboard (2x)
(11) Gantry 4 with placement head (12)SIPLACE Wafer System (SWS) at location
2
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.6 Overview of Modules
147
3.6.2 Overview of Modules in SIPLACE CA3
3
Fig. 3.6 - 2 CA3 machine with SWS - overview of modules
(1) Machine frame (2) PCB conveyor
(flexible dual conveyor)
(3) Extension kit on the PCB input side (4) Component trolley docking unit,
tape cutter, used tape channel
(5) Gantry 1 with placement head (6) Extension kit on the PCB output side
(7) Gantry 3 with placement head (8) Monitor screen (2x)
(9) Keyboard (2x) (10)Gantry 4 with placement head
(11) SIPLACE Wafer System (SWS) at location
2