00195941-03-UM SiplaceCA-EN.pdf - 第203页
User Manual SIPLACE CA 3 Technical Data Edition 08/2011 EN 3.8 Placement Heads 203 3.8.5.4 T echnical Dat a 3 6 segment Collect&Place CA head wi th high-resoluti on com- ponent camera, type 29, 27 x 27, digital d (se…
3 Technical Data User Manual SIPLACE CA
3.8 Placement Heads Edition 08/2011 EN
202
The star rotates about the star axis with its 6 segments. The segments hold the sleeves.
There is a nozzle seated on every sleeve, which sucks up the components, and transports
them from the pickup/placement position (1) to the reject position (2), to the optical centering
position (4) or to the turning position (5).
The Z axis performs a vertical movement. Every sleeve that is in the bottom star position (1)
is raised or lowered by this axis, thus picking up the components from the feeder modules
and setting them down on the PCB. The Z axis is an "intelligent axis". It "notes" the pickup
height of each feeder module track and the placement height for each component. This can
speed up the placement process. The programmed placement force remains constant.
The DP axis rotates the optically centered component to the desired placement angle. The
sequences of movements of the rotation and translation axes are controlled by control cir-
cuits. Position and speed sensors send the actual values for the axis movement to the axis
control. The nominal and actual values are compared and used to determine the force and
speed parameters for the servo amplifier, and thus the axis movement to be performed. The
vacuum values at the nozzle are constantly checked throughout the entire pickup and place-
ment process in order to keep the placement error rate as low as possible.
User Manual SIPLACE CA 3 Technical Data
Edition 08/2011 EN 3.8 Placement Heads
203
3.8.5.4 Technical Data
3
6 segment Collect&Place CA head with high-resolution com-
ponent camera, type 29, 27 x 27, digital
d
(see section 3.13.4, page 228)
Range of components
a
a) Please note that the component range that can be placed is also affected by the pad geometry, the customer-spe-
cific standards and the packaging tolerances.
0201 to 27 mm x 27 mm
Component specifications
Maximum height
Min. lead pitch
Min. lead width
Min. ball pitch
min. ball diameter
Min. dimensions
Maximum dimensions
Max. weight
8,5 mm
0,3 mm
0,15 mm
0,13 mm
b
0,35 mm
c
0,08 m
b
0,2 mm
c
0,6 mm x 0,3 mm
27 mm x 27 mm
5 g
b) for component < 18 mm x 18 mm;
c) for component < 18 mm x 18 mm;
d) C&P6CA with SWS on request
Nozzle types 8 xx, 9 xx
X/Y accuracy (SMD) ± 45 µm/3,± 60 µm/4
X/Y accuracy (CA) ± 35 µm/3, ± 47 µm/4
Angular accuracy ± 0.2°/3,± 0.3°/4
3 Technical Data User Manual SIPLACE CA
3.8 Placement Heads Edition 08/2011 EN
204
3.8.6 SIPLACE TwinHead for High-Precision IC Placement
NOTE 3
The TwinHead can only be used, if
– There are 2 gantries available in the same placement area and
– no SWS is used in the same placement area.
3
Fig. 3.8 - 12 TwinHead for high precision IC placement
3
(1) Pick&Place module - the TwinHead consists of 2 Pick&Place modules (P&P1 and P&P2)
(2) DP axis
(3) Z axis drive
(4) Incremental distance measuring system for the Z axis