JX-350_EPU使用说明书.pdf - 第222页
Glossary A − 1 Glo ssary − List of contained terms AT C Bad mark reader BGA, F BGA BOC alignment BOC m ark Centering Component data Component shape ( “ Comp Shape ”) Coordinate Current memory Data compat ibility Directo …
Appendix
Glossary ............................................................ A-1
Glossary
A−1
Glossary
− List of contained terms
ATC
Bad mark reader
BGA, FBGA
BOC alignment
BOC mark
Centering
Component data
Component shape (“Comp
Shape”)
Coordinate
Current memory
Data compatibility
Directory
EPU
Extension
Feed
Feeder (and similar units)
Feeder bank
Head (unit)
HMS
HOD
I/O safety direction setting
IC mark
IFS-NX
IS
IS Lite
JaNets
Land
Lead
Machine coordinate origin
Mounter
MTC
MTS
Nozzle
OCC
Off-line
On-demand production
On-line
Origin
Origin return
Pick data
Picking
Pin reference
Pitch
Placement
Placement data
Placement station
PLCC
Program
PWB data
PWB origin
QFP
S-VCS
Shape reference
SOJ
SOP
Square chip
Support pin
Support table
Teaching
Tray holder
Tray station
VCS
Verify
Vision data
Glossary
A−2
•
ATC
An abbreviation for Auto Tool Changer
In JX-350 unit, nozzles that are suited to the component size are mounted on the head
in order to conduct component picking and placement. This is the storage place for
these nozzles.
•
Bad mark reader
A bad mark reader is: on a gang processing PWB, a mark (bad mark) is affixed to a
specific part of the circuit that the user does not want to execute placement, the
coordinates of the bad mark are entered into Bad mark position of PWB data, and during
production, the bad mark reader moves to the coordinate position entered by the PWB
data, and the LED sensor checks the presence of bad mark, and as a result, the
component will not be placed for a circuit that has a bad mark.
PWBs available for this system are gang processing PWBs. PWBs of single PWB
processing are not applicable. Use a bad mark with the diameter of 2.5 mm φ or larger,
and the color must be distinct in its light and shade.
Use of a white bad mark is preferable for a PWB of which color is relatively strong, such
as Glass Epoxy PWB while use of a blackish bad mark for a PWB of which color is light
such as ceramic PWB. A bad mark reader is also an option on shipping at factory.
•
BGA, and FBGA
An abbreviation for Ball Grid Array, and Fine pitch BGA.
Solder bumps (balls) are arrayed in a grid pattern on the component placement surface.
This arrangement has a feature of having resistance against deformation and easiness
of handling.
Since they were recently employed in
Intel's peripheral circuits for personal
computer, they are adopted in the field of
personal computer in a significant
upsurge.
•
BOC alignment
This function recognizes the BOC mark
and calculates the correction rate by means of BOC mark.
When to use BOC mark for placement, BOC Alignment must be acquired. Otherwise,
placement position will be slipped when teaching of placement position is conducted.
•
BOC mark
An abbreviation for Board Offset Correction mark.
A mark or marks provided on PWB to correct slippage between the periphery used in
PWB positioning or machine processing part such as positioning pin hole and the pad
(land).
In JX-350 unit, two or three points of marks may be specified. Use of two points can
correct rotation and expansion/contraction. If three points are used, X and Y distortion
can be corrected in addition to the above.