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User Manual SIPLACE SX4/DX4 3 Technical data and assemblies From software version SC.706.xx Version 06/2012 EN 3.5 Placement head 113 3.5.1.1 Description The SIPLACE SpeedSt ar (C &P20) functions according to the Col…
3 Technical data and assemblies User Manual SIPLACE SX4/DX4
3.5 Placement head From software version SC.706.xx Version 06/2012 EN
112
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Fig. 3.5 - 2 SIPLACE SpeedStar - function group part 2
(1) C&P component camera, type 23, 6 x 6, digital
(2) Intermediate distributor board
(3) Star motor
(4) Handle
(5) Component sensor
(6) Star with 20 nozzles
User Manual SIPLACE SX4/DX4 3 Technical data and assemblies
From software version SC.706.xx Version 06/2012 EN 3.5 Placement head
113
3.5.1.1 Description
The SIPLACE SpeedStar (C&P20) functions according to the Collect&Place principle, i.e. twenty
components are picked up by the placement head within a single cycle. At the pick-up and place-
ment position the component sensor checks that the component is present at the nozzle. On their
way to the placement position the components are optically centered and rotated into the required
placement angle. Finally forced air sets down the component gently and accurately on the board.
The C&P20 head makes a significant increase in the placement head performance possible and
therefore in the performance of the placement machine. The compact design of the C&P20 head
also facilitates very short cycle times. In this case, the star axis is at an angle to the PCB level.
This geometry allows the segments to be arranged in a very small space.
The component camera is still integrated into the C&P20 head. This saves additional traveling
distances to external centering cameras. Each segment also has its own DP drive for rotating the
nozzle. The nozzles are therefore no longer rotated into the correct position at a single head sta-
tion. They can be rotated into their placement position at any time and independently of one an-
other.
Each segment has a separate vacuum generator. This greatly reduces the time taken to switch
between vacuum and air kiss. It also allows a vacuum check to be carried out in the holding circuit
for each individual nozzle.
The Z drive for the segments is implemented with a linear motor with linear path measuring sys-
tem, and is thus extremely precise. In the pick-up/placement position, the Z drive moves the seg-
ments up or down in the vertical direction.
3 Technical data and assemblies User Manual SIPLACE SX4/DX4
3.5 Placement head From software version SC.706.xx Version 06/2012 EN
114
3.5.1.2 Technical data with component camera, type 23 (default)
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Component range
a
a) Please note that the component range that can be placed is also affected by the pad geometry, the custom-
er-specific standards and the packaging tolerances.
01005 to 2220, Melf, SOT, SOD
Component specification
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
4 mm
0.25 mm
0.1 mm
0.4 mm
0.2 mm
0.4 mm x 0.2 mm
6 mm x 6 mm
1 g
Programmable set-down force, variable increments 1.5 N to 4.5 N
Nozzle types 10xx, 11xx, 12xx
X/Y accuracy
b
b) The accuracy value, measured using the vendor-neutral IPC standard.
± 41 μm/3, ± 55 μm/4
Angular accuracy ± 0.5°/3± 0.7°/4
Component range 95%
Illumination level 5
Possible illumination level settings 256
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