00196693-03_UM_SX4DX4_SR706_EN.pdf - 第95页
User Manual SIPLACE SX4/DX4 3 Technical data and assemblies From software version SC.706.xx Version 06/2012 EN 3.1 Performance data 95 3 T echnical dat a and assemblies 3.1 Performance dat a 3.1.1 Machine performance 3 P…
2 Operational safety User Manual SIPLACE SX4/DX4
2.12 ESD guidelines From software version SC.706.xx Version 06/2012 EN
94
2.12.3 Handling ESD modules
Do not touch electronic modules unless it is absolutely essential to do so in order to carry out other
work. If it is necessary, make sure that you do not touch the pins or printed conductors when you
pick up flat modules.
Do not touch components unless
you are constantly earthed by an ESD wrist strap or
you are wearing ESD shoes or ESD shoe earthing strips on an ESD floor.
Always discharge yourself before you touch an electronic module. To do this, simply touch a con-
ductive and earthed object immediately before you touch the module (such as unpainted parts of
a switch cabinet, a water pipe, etc.).
Do not allow modules with chargeable and highly insulating materials to touch one another, e.g.
plastic films, insulating table surfaces or items of clothing made from synthetic fibers.
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not move the assemblies near to data view devices, monitors or television units. Keep a min-
imum distance of > 10 cm to monitors.
2.12.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
Always use an earthed soldering iron if you carry out any soldering work.
2.12.5 Dispatching ESD modules
Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User Manual SIPLACE SX4/DX4 3 Technical data and assemblies
From software version SC.706.xx Version 06/2012 EN 3.1 Performance data
95
3 Technical data and assemblies
3.1 Performance data
3.1.1 Machine performance
3
Placement head types SIPLACE SpeedStar (C&P20)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
Placement performance
The placement performance is influenced by the different head combinations and head positions, plus the con-
veyor configurations. Individual options and customized applications also influence the placement performance.
On request, SIPLACE can calculate the actual performance of your product on your machine configuration.
IPC value [components/h]
According to the vendor-neutral conditions of the IPC 9850 standard published by the Association of Connecting
Electronics Industries.
SIPLACE benchmark value [components/h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the condi-
tions set out in the SIPLACE scope of service and supply.
Theoretical maximum output value [components/h]
The theoretical maximum output value is calculated from the most favorable conditions for each machine type
and setting, and corresponds to the theoretical conditions normally used in the industry.
SIPLACE SX4
Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value
C&P20 / C&P20 C&P20 / C&P20 102,000 125,000 135,500
C&P20 / C&P20 CPP_L/CPP_L 91,500 103,500 123,750
C&P20 / C&P20 TH / TH 61,200 70,500 80,500
C&P20 / C&P20 CPP_H/TH 72,500 84,900 98,500
CPP_L/CPP_L CPP_L/CPP_L 82,000 94,000 112,000
CPP_L/CPP_L CPP_H/TH 64,000 68,400 87,000
CPP_L/CPP_L TH / TH 51,200 54,300 69,000
SIPLACE DX4
Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value
C&P20 / C&P20 C&P20 / C&P20 102,000 125,000 135,500
CPP_H = Multistar CPP in high assembly position
CPP_L = Multistar CPP in low assembly position
3 Technical data and assemblies User Manual SIPLACE SX4/DX4
3.1 Performance data From software version SC.706.xx Version 06/2012 EN
96
3.1.2 Placement data
3.1.2.1 SIPLACE SX4
3
Component range
a
01005 to max. 200 mm x 110 mm
Component height C&P20
CPP
b
CPP
c
TH
4 mm
6 mm
8.5 mm to 11.5 mm
25 mm (greater height on request)
X/Y accuracy
d
C&P20 ± 41 μm (3), ± 55 μm (4) Component camera, type 23 (6 x 6)
C&P20 ± 41 μm (3), ± 55 μm (4) Component camera, type 41 (6 x 6)
CPP ± 41 μm (3), ± 55 μm (4) Component camera, type 30 (27 x 27)
CPP ± 34 μm (3), ± 45 μm (4) Component camera, type 33 (55 x 45)
TH ± 26 μm (3), ± 35 μm (4) Component camera, type 33 (55 x 45)
TH ± 22 μm (3), ± 30 μm (4) Component camera, type 25 (16 x 16)
Angular accuracy C&P20 ± 0.5° (3), ± 0.7° (4) Component camera, type 23 (6 x 6)
C&P20 ± 0.5° (3), ± 0.7° (4) Component camera, type 41 (6 x 6)
CPP
e
± 0.4° (3), ± 0.5° (4) Component camera, type 30 (27 x 27)
CPP
f
± 0.5° (3), ± 0.7° (4) Component camera, type 30 (27 x 27)
CPP ± 0.2° (3), ± 0.3° (4) Component camera, type 33 (55 x 45)
TH ± 0.05° (3), ± 0.07° (4) Component camera, type 33 (55 x 45)
TH ± 0.05° (3), ± 0.07° (4) Component camera, type 25 (16 x 16)
a) Please note that the component range that can be placed is also affected by the pad geometry, the customer-specific stan-
dards, the component packaging tolerances and the component tolerances.
b) CPP head: in low installation position (stationary component camera not possible).
c) CPP head: in high installation position
d) The accuracy value, measured using the vendor-neutral IPC standard.
e) Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
f) Component dimensions smaller than 6 mm x 6 mm.