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User Manual SIPLACE SX4/DX4 3 Technical data and assemblies From software version SC.706.xx Version 06/2012 EN 3.5 Placement head 127 3.5.3.1 Description This sophisticated placemen t head consist s of tw o placement h e…
3 Technical data and assemblies User Manual SIPLACE SX4/DX4
3.5 Placement head From software version SC.706.xx Version 06/2012 EN
126
3.5.3 SIPLACE TwinStar for high precision IC placement (SX4 only)
3
Fig. 3.5 - 9 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
User Manual SIPLACE SX4/DX4 3 Technical data and assemblies
From software version SC.706.xx Version 06/2012 EN 3.5 Placement head
127
3.5.3.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether. Both heads work using the Pick&Place principle. The TwinStar is suitable for processing
complex and large components. Two components are picked up by the placement head, optically
centered on the way to the placement position and rotated into the necessary placement angle.
They are then placed gently and accurately onto the PCB with a controlled blast of air.
New nozzles (type 5xx) have been developed for the TwinStar. With an adapter you can also use
the nozzles of type 4xx from the Pick&Place head and nozzles of type 8xx and 9xx from the Col-
lect&Place heads.
3.5.3.2 Technical data
Optical centering with Stationary P&P component camera
(type 33) 55 x 45, digital
(see section 3.8.3
, page 144)
Stationary P&P component camera
(type 25) 16 x 16, digital
(see section 6.8, page 332)
Component range
a
0402 to SO, PLCC, QFP, BGA, spe-
cial components, bare dies, flip-
chips
0201 to SO, PLCC, QFP, sockets,
plugs, BGA, special components,
bare dies, flip-chips, shields
3 Technical data and assemblies User Manual SIPLACE SX4/DX4
3.5 Placement head From software version SC.706.xx Version 06/2012 EN
128
Component specification
b
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
c
25 mm (higher available on request)
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 mm x 0.5 mm
55 mm x 45 mm (single measure-
ment)
For use with two nozzles
50 mm x 50 mm or
69 mm x 10 mm
For use with one nozzle
78 mm x 78 mm or
110 mm x 10 mm
up to 200 mm x 110 mm (with
restrictions)
100 g
25 mm (higher available on request)
0.25 mm
0.1 mm
0.14 mm
0.08 mm
0.6 mm x 0.3 mm
16 mm x 16 mm (single measure-
ment)
55 mm x 55 mm (multiple measure-
ment)
100 g
Programmable set-down
force
1.0 N - 15 N
2.0 N - 30 N
d
1.0 N - 15 N
2.0 N - 30 N
d
Nozzle types
e
5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
gripper
5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
gripper
Nozzle spacing for the two
Pick&Place heads
70.8 mm 70.8 mm
X/Y accuracy
f
± 26 μm / 3, ± 35 μm / 4 ± 22 μm / 3, ± 30 μm / 4
Angular accuracy ± 0.05° / 3, ± 0.07° / 4 ± 0.05° / 3, ± 0.07° / 4
Component camera type 33 25
Illumination level 6 6
Possible illumination level
settings
256
6
256
6
a) Please note that the component range that can be placed is also affected by the pad geometry, the custom-
er-specific standards and the packaging tolerances.
b) If the C&P head and TwinStar are combined in the same placement area, the maximum dimensions may be
restricted.
c) If standard nozzles are used
d) SIPLACE high force head, section 6.7
, page 331.
e) Over 300 different nozzles and 100 gripper types available, extensive nozzle database available online.
f) The accuracy value, measured using the vendor-neutral IPC standard.