00196693-03_UM_SX4DX4_SR706_EN.pdf - 第94页
2 Operational safety User Manual SIPLACE SX4/DX4 2.12 ESD guidelines From software version SC.706.xx Version 06/2012 EN 94 2.12.3 Handling ESD modules Do not touch e lectronic modules unless it is ab solute ly essential …
User Manual SIPLACE SX4/DX4 2 Operational safety
From software version SC.706.xx Version 06/2012 EN 2.12 ESD guidelines
93
2.12 ESD guidelines
2.12.1 What does ESD mean?
Almost all of the modules in use today are equipped with highly integrated MOS blocks and com-
ponents. The manufacturing techniques used mean that these electronic components are ex-
tremely sensitive to overvoltage and thus to electrostatic discharge.
The abbreviation for such modules is 'ESD' (Electrostatic Sensitive Device). ’ESD’ is used inter-
nationally. The following symbol on cabinet rating plates, racks or packaging indicates that com-
ponents which are sensitive to electrostatic discharge have been used and thus that the modules
concerned are also touch-sensitive.
ESDs can be destroyed by voltages and power levels that are far below the level
that can be perceived by humans. Such voltages occur if a person touches a com-
ponent or module without earthing themselves. Components that are exposed to
such overvoltages do not generally appear to be defective immediately - incorrect
behavior starts after the component or module has been in operation for some time.
2.12.2 Important measures to protect against static charging
Most plastics can easily become charged and must therefore be kept away from at-risk com-
ponents.
Always ensure that people, the workplace and packaging are safely earthed when handling
electrostatic sensitive components.
2 Operational safety User Manual SIPLACE SX4/DX4
2.12 ESD guidelines From software version SC.706.xx Version 06/2012 EN
94
2.12.3 Handling ESD modules
Do not touch electronic modules unless it is absolutely essential to do so in order to carry out other
work. If it is necessary, make sure that you do not touch the pins or printed conductors when you
pick up flat modules.
Do not touch components unless
you are constantly earthed by an ESD wrist strap or
you are wearing ESD shoes or ESD shoe earthing strips on an ESD floor.
Always discharge yourself before you touch an electronic module. To do this, simply touch a con-
ductive and earthed object immediately before you touch the module (such as unpainted parts of
a switch cabinet, a water pipe, etc.).
Do not allow modules with chargeable and highly insulating materials to touch one another, e.g.
plastic films, insulating table surfaces or items of clothing made from synthetic fibers.
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not move the assemblies near to data view devices, monitors or television units. Keep a min-
imum distance of > 10 cm to monitors.
2.12.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
Always use an earthed soldering iron if you carry out any soldering work.
2.12.5 Dispatching ESD modules
Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User Manual SIPLACE SX4/DX4 3 Technical data and assemblies
From software version SC.706.xx Version 06/2012 EN 3.1 Performance data
95
3 Technical data and assemblies
3.1 Performance data
3.1.1 Machine performance
3
Placement head types SIPLACE SpeedStar (C&P20)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
Placement performance
The placement performance is influenced by the different head combinations and head positions, plus the con-
veyor configurations. Individual options and customized applications also influence the placement performance.
On request, SIPLACE can calculate the actual performance of your product on your machine configuration.
IPC value [components/h]
According to the vendor-neutral conditions of the IPC 9850 standard published by the Association of Connecting
Electronics Industries.
SIPLACE benchmark value [components/h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the condi-
tions set out in the SIPLACE scope of service and supply.
Theoretical maximum output value [components/h]
The theoretical maximum output value is calculated from the most favorable conditions for each machine type
and setting, and corresponds to the theoretical conditions normally used in the industry.
SIPLACE SX4
Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value
C&P20 / C&P20 C&P20 / C&P20 102,000 125,000 135,500
C&P20 / C&P20 CPP_L/CPP_L 91,500 103,500 123,750
C&P20 / C&P20 TH / TH 61,200 70,500 80,500
C&P20 / C&P20 CPP_H/TH 72,500 84,900 98,500
CPP_L/CPP_L CPP_L/CPP_L 82,000 94,000 112,000
CPP_L/CPP_L CPP_H/TH 64,000 68,400 87,000
CPP_L/CPP_L TH / TH 51,200 54,300 69,000
SIPLACE DX4
Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value
C&P20 / C&P20 C&P20 / C&P20 102,000 125,000 135,500
CPP_H = Multistar CPP in high assembly position
CPP_L = Multistar CPP in low assembly position