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SIPLACE Pro Fe ature Des cription Ausgabe 05/2014 Edit ion 133 9 Featur e Descr ipt ion SI PLACE Pro V 11.xx 9.1 New Components ( V11.1 ) Component Design ation Descripti on Head t yp e C&P20 M ( 1xxx ) C&P20 P (…

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8.4.18 3 Panel Fiducials in the Board Editor

As of this SIPLACE Pro version, the 3 Panel Fiducials required object property can be set for a

board in the Fiducials tab in the Board Editor.

Figure 8-47: Board Editor – Fiducials object property

If this property is enabled, the Optimizer checks if at least three fiducials are available. If less than

three fiducials are available, the Optimizer displays an error message.

The property will be saved on the board and is valid for both board sides.

Detailed information can be found in the Online Help for SIPLACE Pro.

8.5 New Functions (V10.1 SP1)

● New nozzle types 1008 and 1009.

● New travel profile "38 – Place Down 01005 Component Capacitor".

● Automatic adding of the bottom side of the board.

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9 Feature Description SIPLACE Pro V11.xx

9.1 New Components (V11.1)

Component Designation Description

Head type C&P20 M (1xxx)

C&P20 P (4xxx)

Twin VHF (5xx)

For CA-series, X4 S micron and X4i S micron

For X4i S

For SX1/SX2 V2 (height: 38 mm; force up to

70 N)

Station software

version

707.0

DX-series: DX1, DX2 and DX4

SX-series: SX1/SX2, SX1/SX2 V2 and SX4

X-series: X2, X3, X4 and X4i

X-series S: X2 S, X3 S, X4 S, X4 S micron

X4i S and X4i S micron

CA-series: CA4 and CA4 eWLP (customer

project, no release for series

production)

Feeder type Multiple JEDEC Tray Feeder

14 und 18

JEDEC Tray Stack Feeder

X-Serie S und SX1/SX2 V2

Nozzle type 4xxx For X4i S with C&P20 P

Table 9-1: New components V11.1

9.2 New Functions (V11.1)

9.2.1 SIPLACE CA Series Placement Machines

SIPLACE Pro supports a new SIPLACE CA4 placement machine model of the CA-series (Chip

Assembly) on the 70x platform as of station software version 707.0. Additionally, the new SIPLACE

CA4 eWLP (embedded Wafer Level Process) placement machine is supported. However, this

machine type will not be released for series production in this version.

The new CA-series placement machines mainly differ from the previous CA-machines by the

following features:

– Placement heads with a high-resolution star axis are used to achieve high accuracy. For this,

the new C&P20 M placement head type has been introduced. In SIPLACE Pro this placement

head is referred to as C&P20 M 1xxx.

– Support of WLFO – Wafer Level Fan-Out on the SIPLACE CA4 eWLP placement machine as a

customer project (no release for series production).

The SIPLACE Wafer Systems 12 1&3 and 12 2&4 may be used for the placement of bare dies on

the CA-series placement machines.

The new Grid Board Editor has been introduced in SIPLACE Pro for the description of highly

regulated panels.

In the Component Shape Editor, the High Precision property may be set for component shapes

which will then be placed exclusively with the new C&P20 M 1xxx placement head.

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Figure 9-1: High Precision property

9.2.1.1 New Board Type and Grid Board Editor

The new Grid Board board type (icon: ) has been introduced to support a high number of

placement positions in a regular grid. Boards in the embedded Wafer Level Process (eWLP) may

be defined in the new Grid Board Editor.

NOTICE

The Grid Board Editor only contains features and options for the Grid Board board

type and does not replace the Board Editor!

First, the WLFO feature has to be enabled on the SIPLACE Pro Line Control GUI under Settings –

Global settings.

The editor opens by selecting the desired grid board in the Grid Board tab.

Figure 9-2: Grid Board Editor