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SIPLACE Pro Fe ature Des cription Ausgabe 05/2014 Edit ion 171 A warnin g will be displa yed if the p lacem ent list cont ains c omponent p lacem ent positi ons for which no matc hing referenc e desi gnator can b e found…
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If several components are listed for one reference designator in the BOM file, the first component
will be added to the placement list. Additional components will be added as alternative components
in the order they are listed in the BOM file.
The following dialog box will be displayed when the BOM file is opened:
Figure 9-43: Configuring the BOM file
The columns that contain the reference designators and the part numbers have to be set and
confirmed in the corresponding select lists.
Error messages and warnings are listed in the Warnings / Errors tab.
Figure 9-44: Error messages and warnings
An error message will be displayed if a reference designator is defined several times or if a
component placement position is specified in the BOM file that cannot be found in the placement
list. The BOM file must then be corrected (via the Notepad button) before the BOM Merger can
continue working.
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A warning will be displayed if the placement list contains component placement positions for which
no matching reference designator can be found in the BOM file. Either the concerned placement
list can then be corrected in SIPLACE Pro Desk or the concerned component placement positions
can be omitted.
By clicking the Reevaluate button, the corrected entries will be transferred and checked by the
BOM Merger.
Before the new data gets inserted into the placement list via the Import button, a copy of the
placement list may be optionally created by clicking the Make a back-up copy of Placement List
button.
9.3.18 Aligning (LED) Components
If the corresponding hardware has been installed, components can be aligned with the new LED
Offset Camera (47) 19x19 camera type. Surface features such as e.g. illuminated areas of LED
components, can then be centered corresponding to the placement position. This function is
supported together with the CPP placement head as of this SIPLACE Pro version.
Example Process with LED component:
The LED component is picked up and put on a glass plate on camera 47. First, it will be measured
from the bottom by this camera and then from the top by the PCB camera. The result of the
measurement from the bottom is starting basis for the measurement from the top. Thus, an offset
of the illuminated area to the component connections is determined. After that, the LED component
will be picked up from the glass plate and be placed with the determined offset so that the
illuminated area is centered corresponding to the placement position and not, as usual, aligned to
the connection leads.
The function can be enabled in the Align column under the Placement List – Placements tab in
the Placement List Editor.
Figure 9-45: Enabling alignment
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The LED Offset Camera (47) 19x19 flip chip camera has to be selected in the Setup Editor.
Figure 9-46: Selecting camera type
NOTICE
Camera types 47 and 25 have to be installed at the same place. I.e., these camera types
cannot be installed at the same location simultaneously.