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SIPLACE Pro Fe ature Des cription Ausgabe 05/2014 Edit ion 134 Figure 9-1 : High Precision property 9.2.1.1 New Board Type and Grid Board Editor The ne w Grid Bo ard boar d type ( icon: ) has bee n intr oduced to su ppor…

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9 Feature Description SIPLACE Pro V11.xx
9.1 New Components (V11.1)
Component Designation Description
Head type C&P20 M (1xxx)
C&P20 P (4xxx)
Twin VHF (5xx)
For CA-series, X4 S micron and X4i S micron
For X4i S
For SX1/SX2 V2 (height: 38 mm; force up to
70 N)
Station software
version
707.0
DX-series: DX1, DX2 and DX4
SX-series: SX1/SX2, SX1/SX2 V2 and SX4
X-series: X2, X3, X4 and X4i
X-series S: X2 S, X3 S, X4 S, X4 S micron
X4i S and X4i S micron
CA-series: CA4 and CA4 eWLP (customer
project, no release for series
production)
Feeder type Multiple JEDEC Tray Feeder
14 und 18
JEDEC Tray Stack Feeder
X-Serie S und SX1/SX2 V2
X-Serie S und SX1/SX2 V2
Nozzle type 4xxx For X4i S with C&P20 P
Table 9-1: New components V11.1
9.2 New Functions (V11.1)
9.2.1 SIPLACE CA Series Placement Machines
SIPLACE Pro supports a new SIPLACE CA4 placement machine model of the CA-series (Chip
Assembly) on the 70x platform as of station software version 707.0. Additionally, the new SIPLACE
CA4 eWLP (embedded Wafer Level Process) placement machine is supported. However, this
machine type will not be released for series production in this version.
The new CA-series placement machines mainly differ from the previous CA-machines by the
following features:
– Placement heads with a high-resolution star axis are used to achieve high accuracy. For this,
the new C&P20 M placement head type has been introduced. In SIPLACE Pro this placement
head is referred to as C&P20 M 1xxx.
– Support of WLFO – Wafer Level Fan-Out on the SIPLACE CA4 eWLP placement machine as a
customer project (no release for series production).
The SIPLACE Wafer Systems 12 1&3 and 12 2&4 may be used for the placement of bare dies on
the CA-series placement machines.
The new Grid Board Editor has been introduced in SIPLACE Pro for the description of highly
regulated panels.
In the Component Shape Editor, the High Precision property may be set for component shapes
which will then be placed exclusively with the new C&P20 M 1xxx placement head.
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Figure 9-1: High Precision property
9.2.1.1 New Board Type and Grid Board Editor
The new Grid Board board type (icon: ) has been introduced to support a high number of
placement positions in a regular grid. Boards in the embedded Wafer Level Process (eWLP) may
be defined in the new Grid Board Editor.
NOTICE
The Grid Board Editor only contains features and options for the Grid Board board
type and does not replace the Board Editor!
First, the WLFO feature has to be enabled on the SIPLACE Pro Line Control GUI under Settings –
Global settings.
The editor opens by selecting the desired grid board in the Grid Board tab.
Figure 9-2: Grid Board Editor
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Only the top side of the board may be defined and placed in the Grid Board Editor.
The board contains a grid over which the placement of the packages is defined. The grid contains
the package list and a map of how the packages shall be positioned within a circle or a rectangle.
A new grid board can be created with the New Grid Board menu entry in the tree view context
menu.
Figure 9-3: Adding a grid board
A grid board can be added to the recipe in the Recipe Editor and Job Editor.
9.2.2 SIPLACE X2 S Placement Machine
SIPLACE Pro supports the new SIPLACE X2 S placement machine of SIPLACE X-series S. The
SIPLACE X2 S has two gantries and supports essentially the same configuration variants and
options as the SIPLACE X3 S with the following exception:
– Smart Pin Support is not supported.
9.2.3 SIPLACE X4 S micron Placement Machine
SIPLACE Pro supports the new SIPLACE X4 S micron placement machine that is based on the
SIPLACE X4 S machine type. However, SIPLACE X4 S micron achieves higher accuracy through
high-resolution measurements at the main axes and optimized accuracy of the travel parameters.
The SIPLACE X4 S micron supports essentially the same configuration variants and options as the
SIPLACE X4 S with the exception of the head configuration:
– The SIPLACE X4 S micron is exclusively equipped with the high-precision C&P20 M 1xxx
placement heads (4x) and the C&P20 Camera CA (41) component camera type.