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SIPLACE Pro Fe ature Des cription Ausgabe 05/2014 Edit ion 156 Figure 9- 25 : Process attribut es for lines 9.2.31 Linking Docume nts to SIPLACE Pro Objects It is no w possible t o link external doc um ents and fi le sys…
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From the tool bar a dialog box can be called in which all existing process attributes are listed. From
this list one or multiple process attributes may be selected to be entered for the board side or line.
Figure 9-23: Process attribute dialog box
9.2.30.2 Process Attributes in Data Maintenance Tool
The Data Maintenance Tool has been enhanced so that the process attributes can be assigned
quickly and easily to multiple objects without having to handle each object separately.
Additionally, the Line object type can now be handled in the Data Maintenance Tool.
Process attributes for boards and lines can be added or removed via the Change Attribute
function.
For both actions, the user can enter a process attribute manually or select one from the list with
available process attributes in the system.
If boards are handled, the user also has to select if the top side, bottom side or both board sides
shall be treated.
Figure 9-24: Process attributes for boards
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Figure 9-25: Process attributes for lines
9.2.31 Linking Documents to SIPLACE Pro Objects
It is now possible to link external documents and file system folders to the respective objects in all
SIPLACE Pro Desk Editors. For this, the Comments tab in the Object Properties has been
extended as follows.
Figure 9-26: Comments & Links
In the right part of the window one or more links may be created, edited and deleted for each
object. By double-clicking a link it will open.
Detailed information can be found in the Online Help for SIPLACE Pro.
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9.3 New Functions (V11.2)
9.3.1 Twin Head / CPP Placement Heads on SIPLACE CA-Series
Additionally to the C&P20 M placement head, the CPP and Twin Head (also Twin Head HF)
placement heads are supported on the SIPLACE CA-series placement machines as of this
SIPLACE Pro version with the following restrictions:
– Stationary cameras can only be installed on the locations 1 and 3.
– The Twin Head can only be installed on location 3.
– The CPP placement head is only supported in the high position on SIPLACE Wafer Systems.
CPP placement head
The CPP placement head can be used in Pick&Place mode and on SIPLACE Wafer Systems as
well. FlipChip and DieAttach modes are supported on the SIPLACE Wafer Systems. Dip modules
may be used.
The nozzle changer for the CPP placement head has 5 magazines for 20xx nozzles with 12
garages each and 1 magazine for 28xx nozzles with 9 garages. If desired, this configuration may
be changed, e.g. 6 magazines for 20xx nozzles.
The 33 component camera type is supported for placement in Pick&Place mode and the 30
component camera type on SIPLACE Wafer Systems.
Twin Head
The Twin Head is used in Pick&Place mode only.
The nozzle changer for the Twin Head has maximum 12 magazines with 2 garages each on the
locations 1 and 3 and maximum 10 magazines with 2 garages each on the locations 2 and 4.
The 33 and 25 component camera types are supported.
Available placement head configurations on SIPLACE CA-series
4*C&P20 M
2*C&P20 M in PA1 and 2*CPP in PA2
4*CPP
2*C&P20 M in PA1 and CPP / TH in PA2
2*CPP in PA1 and CPP / TH in PA2
9.3.2 C&P20 P Placement Head on SIPLACE X-Series S
The C&P20 P placement head was introduced for the SIPLACE X4i S placement machine in the
previous SIPLACE Pro version. As of the current SIPLACE Pro version, this placement head is
additionally supported on the SIPLACE X2 S, X3 S and X4 S placement machines.
The C&P20 P placement head is supported on the same locations as the C&P20 A placement
head and uses the same component camera types (23 and 41), too.
The 4xxx nozzle type is supported on all locations.