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SIPLACE Pro Fe ature Des cription Ausgabe 05/2014 Edit ion 157 9.3 New Functi ons (V11.2 ) 9.3.1 Twin Head / CPP Placeme nt Heads on SIPLACE CA - Series Addition ally to t he C&P2 0 M plac ement hea d, the CPP an d T…
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Figure 9-25: Process attributes for lines
9.2.31 Linking Documents to SIPLACE Pro Objects
It is now possible to link external documents and file system folders to the respective objects in all
SIPLACE Pro Desk Editors. For this, the Comments tab in the Object Properties has been
extended as follows.
Figure 9-26: Comments & Links
In the right part of the window one or more links may be created, edited and deleted for each
object. By double-clicking a link it will open.
Detailed information can be found in the Online Help for SIPLACE Pro.
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9.3 New Functions (V11.2)
9.3.1 Twin Head / CPP Placement Heads on SIPLACE CA-Series
Additionally to the C&P20 M placement head, the CPP and Twin Head (also Twin Head HF)
placement heads are supported on the SIPLACE CA-series placement machines as of this
SIPLACE Pro version with the following restrictions:
– Stationary cameras can only be installed on the locations 1 and 3.
– The Twin Head can only be installed on location 3.
– The CPP placement head is only supported in the high position on SIPLACE Wafer Systems.
CPP placement head
The CPP placement head can be used in Pick&Place mode and on SIPLACE Wafer Systems as
well. FlipChip and DieAttach modes are supported on the SIPLACE Wafer Systems. Dip modules
may be used.
The nozzle changer for the CPP placement head has 5 magazines for 20xx nozzles with 12
garages each and 1 magazine for 28xx nozzles with 9 garages. If desired, this configuration may
be changed, e.g. 6 magazines for 20xx nozzles.
The 33 component camera type is supported for placement in Pick&Place mode and the 30
component camera type on SIPLACE Wafer Systems.
Twin Head
The Twin Head is used in Pick&Place mode only.
The nozzle changer for the Twin Head has maximum 12 magazines with 2 garages each on the
locations 1 and 3 and maximum 10 magazines with 2 garages each on the locations 2 and 4.
The 33 and 25 component camera types are supported.
Available placement head configurations on SIPLACE CA-series
4*C&P20 M
2*C&P20 M in PA1 and 2*CPP in PA2
4*CPP
2*C&P20 M in PA1 and CPP / TH in PA2
2*CPP in PA1 and CPP / TH in PA2
9.3.2 C&P20 P Placement Head on SIPLACE X-Series S
The C&P20 P placement head was introduced for the SIPLACE X4i S placement machine in the
previous SIPLACE Pro version. As of the current SIPLACE Pro version, this placement head is
additionally supported on the SIPLACE X2 S, X3 S and X4 S placement machines.
The C&P20 P placement head is supported on the same locations as the C&P20 A placement
head and uses the same component camera types (23 and 41), too.
The 4xxx nozzle type is supported on all locations.
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9.3.3 WPC5/WPC6 on SIPLACE X-Serie S
SIPLACE Pro supports the option to put a WPC5/WPC6 with the new WPC 40 X X-table on the
X2 S, X3 S and X4 S placement machines. However, the hardware will not be released for series
production in this version.
The WPC5/WPC6 and the WPC 40 X table occupy the tracks 11 – 40. Other modules, such as
X-feeders / processing feeders may be set up on the tracks 1 – 10.
The WPC 40 X can be selected and configured for location 2 in the Setup Editor. A single
WPC5/WPC6 cannot be configured without the X-table. An XFCU must have been installed.
The Twin Head and CPP placement heads and the new CPP 20xx28xx 4, CPP 20xx 4 and
TwinFlexible nozzle changers are supported for this option.
SIPLACE Smart Pin Support supports the option on the X3 S and X4 S placement machines.
9.3.4 SIPLACE X4i S micron – Enhancements
CPP placement head and SIPLACE JTF-M feeder
As of this SIPLACE Pro version, the CPP placement head and the SIPLACE JTF-M feeder are
supported on the SIPLACE X4i S micron placement machine.
Placement process for component type 03015
When placing components of the 03015 type, the user is guided through a similar placement
process as for the 01005 component type on the SIPLACE X4i S micron placement machine.
If the 03015 placement process is selected in the Component Shape Editor, the required process
parameters such as cameras, nozzles, travel profiles and placement forces will be set
automatically.
9.3.5 Placement Process for Springs
The new Spring placement process can be selected in the Component Shape Editor.
Figure 9-27: Selecting Spring placement process