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SIPLACE Pro Fe ature Des cription Ausgabe 05/2014 Edit ion 158 9.3.3 WPC5/WPC6 on SIPLA CE X - Serie S SIPLACE Pro suppor ts the option to p ut a W PC5/W PC6 with th e new WPC 40 X X- table on the X2 S, X3 S and X4 S pla…
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9.3 New Functions (V11.2)
9.3.1 Twin Head / CPP Placement Heads on SIPLACE CA-Series
Additionally to the C&P20 M placement head, the CPP and Twin Head (also Twin Head HF)
placement heads are supported on the SIPLACE CA-series placement machines as of this
SIPLACE Pro version with the following restrictions:
– Stationary cameras can only be installed on the locations 1 and 3.
– The Twin Head can only be installed on location 3.
– The CPP placement head is only supported in the high position on SIPLACE Wafer Systems.
CPP placement head
The CPP placement head can be used in Pick&Place mode and on SIPLACE Wafer Systems as
well. FlipChip and DieAttach modes are supported on the SIPLACE Wafer Systems. Dip modules
may be used.
The nozzle changer for the CPP placement head has 5 magazines for 20xx nozzles with 12
garages each and 1 magazine for 28xx nozzles with 9 garages. If desired, this configuration may
be changed, e.g. 6 magazines for 20xx nozzles.
The 33 component camera type is supported for placement in Pick&Place mode and the 30
component camera type on SIPLACE Wafer Systems.
Twin Head
The Twin Head is used in Pick&Place mode only.
The nozzle changer for the Twin Head has maximum 12 magazines with 2 garages each on the
locations 1 and 3 and maximum 10 magazines with 2 garages each on the locations 2 and 4.
The 33 and 25 component camera types are supported.
Available placement head configurations on SIPLACE CA-series
4*C&P20 M
2*C&P20 M in PA1 and 2*CPP in PA2
4*CPP
2*C&P20 M in PA1 and CPP / TH in PA2
2*CPP in PA1 and CPP / TH in PA2
9.3.2 C&P20 P Placement Head on SIPLACE X-Series S
The C&P20 P placement head was introduced for the SIPLACE X4i S placement machine in the
previous SIPLACE Pro version. As of the current SIPLACE Pro version, this placement head is
additionally supported on the SIPLACE X2 S, X3 S and X4 S placement machines.
The C&P20 P placement head is supported on the same locations as the C&P20 A placement
head and uses the same component camera types (23 and 41), too.
The 4xxx nozzle type is supported on all locations.
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9.3.3 WPC5/WPC6 on SIPLACE X-Serie S
SIPLACE Pro supports the option to put a WPC5/WPC6 with the new WPC 40 X X-table on the
X2 S, X3 S and X4 S placement machines. However, the hardware will not be released for series
production in this version.
The WPC5/WPC6 and the WPC 40 X table occupy the tracks 11 – 40. Other modules, such as
X-feeders / processing feeders may be set up on the tracks 1 – 10.
The WPC 40 X can be selected and configured for location 2 in the Setup Editor. A single
WPC5/WPC6 cannot be configured without the X-table. An XFCU must have been installed.
The Twin Head and CPP placement heads and the new CPP 20xx28xx 4, CPP 20xx 4 and
TwinFlexible nozzle changers are supported for this option.
SIPLACE Smart Pin Support supports the option on the X3 S and X4 S placement machines.
9.3.4 SIPLACE X4i S micron – Enhancements
CPP placement head and SIPLACE JTF-M feeder
As of this SIPLACE Pro version, the CPP placement head and the SIPLACE JTF-M feeder are
supported on the SIPLACE X4i S micron placement machine.
Placement process for component type 03015
When placing components of the 03015 type, the user is guided through a similar placement
process as for the 01005 component type on the SIPLACE X4i S micron placement machine.
If the 03015 placement process is selected in the Component Shape Editor, the required process
parameters such as cameras, nozzles, travel profiles and placement forces will be set
automatically.
9.3.5 Placement Process for Springs
The new Spring placement process can be selected in the Component Shape Editor.
Figure 9-27: Selecting Spring placement process
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Thus, the force 0,000 N is entered in the Edit tab and the Creep distance field is disabled. A value
may be entered for Spring compression.
Figure 9-28: Entering spring compression
This process is valid together with the station software as of the 707.x version and for the
C&P20 A, C&P20 M, C&P20 P and CPP placement heads.
9.3.6 Multiple Measurements with CPP Placement Head
Multiple measurements can be performed with the CPP placement head via the stationary camera
in Pick&Place mode. Thus, the component range has been extended.
9.3.7 Reading Barcodes on All Stations in the Line
The measuring steps to read the PCB barcodes with the PCB camera are always sent to all
stations in the line although some stations would already receive the barcodes through WDTL or by
reading them with an external barcode reader.
Additionally, the simulation has been optimized for the following special case:
Example
The line consists of three stations with an AOI system (Automatic Optical Inspection) in front of
station 3. The board has only one PCB barcode on the top side but panel barcodes / placement
positions on both sides. At the stations 1 and 3, external barcode readers are installed that can
only read from the bottom.
Figure 9-29: Example: stations in the line
The placement of the board bottom side is simulated as follows:
– The PCB barcode on the board top side is read by the external barcode reader in station 1.
– The panel barcodes are read by the PCB camera in PA1.
– All barcodes are passed over to station 2 through WDTL.
– At station 3 the PCB barcode is read by the external barcode reader and the panel barcodes
are passed over through WDTL.
For placement of the board top side it has to be considered that an external barcode reader is
installed at station 3 which can only read from the bottom. Thus, it cannot be used for placing the
board top side.