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SIPLACE Pro Fe ature Des cription Ausgabe 05/2014 Edit ion 135 Only the t op side of the boa rd m ay be defined and plac ed in the Grid Board Edi tor . The board c ontains a grid over whic h the plac ement of the pack ag…
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Figure 9-1: High Precision property
9.2.1.1 New Board Type and Grid Board Editor
The new Grid Board board type (icon: ) has been introduced to support a high number of
placement positions in a regular grid. Boards in the embedded Wafer Level Process (eWLP) may
be defined in the new Grid Board Editor.
NOTICE
The Grid Board Editor only contains features and options for the Grid Board board
type and does not replace the Board Editor!
First, the WLFO feature has to be enabled on the SIPLACE Pro Line Control GUI under Settings –
Global settings.
The editor opens by selecting the desired grid board in the Grid Board tab.
Figure 9-2: Grid Board Editor
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Only the top side of the board may be defined and placed in the Grid Board Editor.
The board contains a grid over which the placement of the packages is defined. The grid contains
the package list and a map of how the packages shall be positioned within a circle or a rectangle.
A new grid board can be created with the New Grid Board menu entry in the tree view context
menu.
Figure 9-3: Adding a grid board
A grid board can be added to the recipe in the Recipe Editor and Job Editor.
9.2.2 SIPLACE X2 S Placement Machine
SIPLACE Pro supports the new SIPLACE X2 S placement machine of SIPLACE X-series S. The
SIPLACE X2 S has two gantries and supports essentially the same configuration variants and
options as the SIPLACE X3 S with the following exception:
– Smart Pin Support is not supported.
9.2.3 SIPLACE X4 S micron Placement Machine
SIPLACE Pro supports the new SIPLACE X4 S micron placement machine that is based on the
SIPLACE X4 S machine type. However, SIPLACE X4 S micron achieves higher accuracy through
high-resolution measurements at the main axes and optimized accuracy of the travel parameters.
The SIPLACE X4 S micron supports essentially the same configuration variants and options as the
SIPLACE X4 S with the exception of the head configuration:
– The SIPLACE X4 S micron is exclusively equipped with the high-precision C&P20 M 1xxx
placement heads (4x) and the C&P20 Camera CA (41) component camera type.
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9.2.4 SIPLACE X4i S micron Placement Machine
SIPLACE Pro supports the new SIPLACE X4i S micron placement machine that is based on the
SIPLACE X4i S machine type. This new machine type achieves high accuracy through high-
resolution measurements at the main axes and by being equipped with the C&P20 M placement
head. The performance of the machine still complies with that of the SIPLACE X4i S.
The SIPLACE X4i S micron supports essentially the same configuration variants and options as the
SIPLACE X4i S with the exception of the head configuration:
– The SIPLACE X4i S micron is exclusively equipped with the high-precision C&P20 M
placement heads (4x) and the SST 41 component camera type.
9.2.5 SIPLACE SX1/SX2 V2 Placement Machine with Twin VHF – Placement of Tall
Components
SIPLACE Pro supports a new model of the SIPLACE SX1/SX2 V2 placement machine. This
placement machine differs from the previous model by the fact that one gantry is positioned 12 mm
higher as the other one. At this gantry only the new Twin VHF placement head (Very High Force
Twin Head) can be used. In SIPLACE Pro this placement head is referred to as Twin VHF 5xx.
Components up to a height of 38 mm can be placed with a force of 70 N with the Twin VHF 5xx
placement head. Such components may be transported by the WPC5 and WPC6. The maximum
height of component + magazine is 45 mm.
The Twin VHF 5xx placement head supports the same nozzle types as the Twin Head.
The Non Stop module may be used for the tall components.
Restrictions arise due to interfering edges, limitations of the turning circle and the component
weight.
9.2.6 SIPLACE X4i S Placement Machine with C&P20 P Placement Head
A new C&P20 P placement head has been introduced. In SIPLACE Pro this placement head is
referred to as C&P20 P 4xxx. Increased placement performance and robustness are achieved with
this placement head. The C&P20 P 4xxx placement head is supported on the SIPLACE X4i S
placement machine.
The C&P20 P 4xxx placement head has new DP drives and a new nozzle interface. Therefore, new
nozzles (type 4xxx), new nozzle magazines with 20 garages and a new nozzle changer support are
required.
The following nozzle types are supported:
– Rubber nozzles: Typ 4032-4036; 4133, 4135, 4235
– Ceramic nozzles: Typ 4004; 4103, 4105-4109
9.2.7 Station Software Version 707.x
SIPLACE Pro supports the 707.x station software version on the X-, X S-, SX-, DX- and CA-series
placement machines