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SIPLACE Pro Fe ature Des cription Ausgabe 05/2014 Edit ion 31 3 Featur e Descr ipt ion SIPL A CE Pro V5.xx 3.1 Features in combinati on w ith Stati on Software 60 4 (V5.0 xx) 3.1.1 Higher placement perf ormance o f C&…
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2.11 Features of the LC GUI (V4.1)
2.11.1 Integration of SIPLACE P(ro Optimizer Messages in the Line Control GUI
In the LC GUI you can start the optimizer messages via the context menu and work with them.
2.11.2 Integrity Check without Repartitioning of Placement Steps
With the new download mode – Avoid redistributing components – the user is not forced anymore
to empty the line if there are certain changes on the board. The sequence of the head steps is kept.
The production is not interrupted and time is saved because the machine or line does not need to
be emptied.
In SIPLACE Pro 4.1 this new mode – Avoid redistributing components – is activated by default. But
if components need to be repartioned even though this mode is activated, a message is displayed
to inform the user that a repartitioning is necessary.
Following changes do not result in a repartitioning:
– Modification of the angle on the board or in the feeder
– Modification of the placement position on the board or pickup position in the feeder
– Other feeder module (change from tape feeder to linear feeder)
You activate this new option in the configuration menu of the LC GUI (Tools -> Configuration).
Die Aktivierung dieser neuen Option erfolgt in der Konfiguration der LC-GUI (Extras ->
Konfiguration).
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3 Feature Description SIPLACE Pro V5.xx
3.1 Features in combination with Station Software 604 (V5.0 xx)
3.1.1 Higher placement performance of C&P20 heads of X series
With station software 604 the placement performance of C&P20 Heads of the X Series machine
types increases. This means for example for an X4 with four C&P20 Heads an increased
placement performance from 80,000 to 90,000 cph. But this performance increase is only working
together with the new hardware components (axis card A364, …).
3.1.2 Increased Machine Performance due to Reduced Board Clamping during
Transport
In SIPLACE Pro 5.0 you can edit in the line editor the transport space from 0 – 40 mm. This means
the board is transported as soon as the transport space has entered the reached value.
For stations with station software 40x/50x the default value is 40 mm. For stations with station
software 601 – 603 the default vaules are 40 mm or 20 mm.
3.1.3 01005 Placement for X Series and D Series
SIPLACE Pro 5.0 enables 01005 placement for the X series and D series. For successful 01005
placement you have to mark the check box in the component shape editor.
For 01005 placement following hardware and software requirements are essential. In addition, for
the nozzles special segments are required for the C&P heads.

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01005 Placement
X series D series
Station X1, X2, X3, X4 D2, D4
Station computer
software
602, 603, 604 604
Nozzles 1005 (for C&P20 head of X series) 905 (für C&P12 Kopf der D-Serie)
Camera SST 23 (for C&P20 head) SST 38 (für C&P12 Kopf)
Feeder 3x8 mm S 01005,
8 mm X
3x8 mm S 01005,
8 mm X
Component
shape
96, 97 96, 97
Travel profile 33 – Place Down 01005 Component
34 - Place Down 01005 Component
Slow
35 – Pickup Down Contactless 01005
33 – Place Down 01005 Component
34 - Place Down 01005 Component
Slow
35 – Pickup Down Contactless 01005
NOTICE
In SIPLACE Pro the component shapes 96 and 97 are pre-configurated for 01005
placement.
3.1.4 New Dip Module for X Series
The new dip module "Linear Dipping Unit X" is running on all X series stations with station software
604.
The new dip module has to be setup manually on the new changeover table and is only running on
X tables with station software 604.
Please consider following restrictions when using the dip module:
● For each placement head SIPLACE Pro allows only one dip module.
● The user has to setup the dip module manually. The optimizer does the setup of the dipped
component automatically.
● SIPLACE Pro does not check the geometry of the component in the dipping area.
● And it is not checked if the placement head can reach the dip module.