IPC-TM-650 EN 2022 试验方法--.pdf - 第103页

T a ble 1 T est Report on Solder P aste Enter ap propriate information in top portion of report and com plete report by entering the test results or checkm arks in the appropriate spaces. Inspection Pu rpos e: QPL I.D. N…

100%1 / 824
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 2
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
procedure
determines
the
percent
metal
content
for
solder
paste.
2
.0
Applicable
Documents
None
3
.0
Test
Specimen
50
grams
of
solder
paste
4
.0
Equipment/Apparatus
Balance
Crucible
or
Beaker
Heat
Source
Flux
Solvent
5
.0
Procedure
5.1
Preparation
5.1.1
Weigh
1
0
to
50
grams
(to
the
nearest
0.01
gram)
of
solder
paste
into
a
tared
vessel
suitable
for
melting
the
solder
paste.
5.2
Test
5.2.1
Melt
the
solder
at
approximately
25℃
above
liquidus
of
the
alloy,
remove
from
heat
and
allow
solder
to
solidify.
5.2.2
Extract
melt
from
residual
flux
with
a
suitable
solvent,
dry
and
weigh
metal
to
within
0.01
grams
to
determine
%
metal
content.
5.3
Evaluation
Weight
of
extracted
metal
Weight
of
original
sample
x
1
00
=
%
Metal
Number
2.2.20
Subject
Solder
Paste
Metal
Content
by
Weight
Date
1/95
Revision
Originating
Task
Group
Solder
Paste
Task
Group
(5-24b)
Enter
the
results
in
Table
1
'Test
Report
on
Solder
Paste.'
Table 1 Test Report on Solder Paste
Enter appropriate information in top portion of report and complete report by entering the test results or checkmarks in the appropriate spaces.
Inspection Purpose: QPL I.D. Number:
__ Qualification Manufacturer’s Identification:
__ Quality Conformance A Manufacturer’s Batch Number:
__ Quality Conformance B Date of Manufacture:
__ Shelf-Life Extension Original Use-By Date:
__ Performance Revised Use-By Date:
Date Inspection Completed: Overall Results: __ Pass __ Fail
Inspection Performed by:
Witnessed by:
Inspections
User’s Actual
Requirement Test Result P/F (*) Tested by & Date
Material
Visual
Metal Content
Viscosity
Solder Ball
Slump
Alloy
Flux
Powder Size
% In Top Screen
% In Next Screen
% In Bottom Screen
% In Receiver Bottom
Max. Powder Size
Powder Shape
Tack
Wetting
* P/F = PASS/FAIL; enter P if test results are within tolerance of actual requirement; otherwise, enter F
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.2.20
Solder
Paste
Metal
Content
by
Weight
1/95
IPC-DD-135
Figure 1 Cross-Section Planarization Diagram
Figure 2 Top View of Planarization Structure
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 4
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
The
object
of
a
planarity
measurement
is
to
deter¬
mine
the
effectiveness
of
a
polymer
thin
film
in
smoothing
topological
features
created
by
underlying
layers
of
circuitry
or
etch
patterns.
In
this
case,
the
polymer
thin
film
is
a
dielectric
material
for
use
in
High
Density
Interconnect
(HDI)
and
microvia
technologies.
1.1
Test
Structure
Schematics
given
in
Figure
1
(end
view)
and
Figure
2
(top
view)
depict
the
essential
features
of
a
rec¬
ommended
test
structure
for
measuring
the
planarity
as
a
function
of
feature
size.
]
Trace
Widths
10
mm
|
0.1
mm
，
0.2
mm
0.4
mm
Direction
of
Scan
0.8
mm
1.6
mm
3.2
mm
.
6.4
mm
I
PC-2-2-21
-2
Number
2.2.21
Subject
Planarity
of
Dielectrics
for
High
Density
Interconnection
(HDI)/Microvia
Technology
Date
Revision
11/98
Originating
Task
Group
HDI
Test
Methods
Task
Group
(D-42a)
In
the
finished
test
structure,
''d"
is
the
step
height
over
the
circuit
trace
after
the
polymer
has
been
deposited
and
cured.
The
planarity
is
dependent
on
the
trace
height,
"b/'
the
poly¬
mer
coating
thickness,
llc,"
and
the
trace
width,
"a.”
Rather
than
fully
characterizing
this
relationship
for
each
polymer
coating,
it
is
best
to
use
simplified
standard
procedures
for
measurement
and
for
comparing
different
types
of
coatings.
Planarity
is
also
affected
by
the
proximity
of
the
line
feature
being
used
for
measurement
to
any
neighboring
topological
feature
in
the
test
structure.
Planarity
is
generally
much
lower
for
isolated
features.
Therefore,
in
order
to
consider
the
"worst
case"
conditions,
isolated
lines
are
preferred
in
the
test
structure.
To
satisfy
this
requirement,
no
neighboring
fea¬
tures
can
be
within
fewer
than
15
line
widths
of
the
line
in
question.
The
test
pattern
in
Figure
2
is
recommended
as
one
that
pro¬
vides
planarity
characterization
over
a
broad
range
of
feature
sizes.
All
lines
are
isolated
in
accord
with
the
above
guideline.
It
is
recommended
planarity
be
determined
over
the
complete
range
of
these
widths
(but
the
specific
nominal
values
within
that
range
are
not
important).
Normally,
one
finds
the
planar¬
ity
is
high
over
narrow
lines,
but
it
progressively
rolls
off
in
pro¬
ceeding
toward
wider
ones.
The
roll-off
rate
is
important,
and
it
varies
from
polymer
to
polymer.
Thus
any
report
of
planarity
must
include
the
line
width
measured
and,
preferably,
a
plot
of
planarity
versus
line
width
should
be
reported.
2
Applicable
Documents
Qualification
for
Deposited
Organic
Interlayer
Dielectric
Materials
for
Multi-Chip
Modules
3
Test
Specimens
3.1
Prepare
Test
Coupons
Prepare
the
surface
of
the
test
structure
for
polymer
deposition
in
accordance
with
the
pro¬
cedure
recommended
by
the
manufacturer
of
the
dielectric
coating
(follow
all
procedures
for
cleaning
the
surface
and
for
deposition
of
a
coupling
agent
if
one
is
recommended).
Coat
the
polymer
resin
in
accordance
with
the
manufacturer's
rec¬
ommended
procedure
to
provide
an
average
film
thickness
of
63.5
pm
(±
1
0%)
for
1
8
pm
copper
over
the
substrate
surface
when
the
cure
is
completed.
Cure
the
polymer
thin
film
using