IPC-TM-650 EN 2022 试验方法--.pdf - 第377页

MIL-F-14256 QQ-S-571 The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was voluntarily establis hed by T echni cal…

100%1 / 824
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
procedure
establishes
the
performance
and
test
guidelines
for
the
break-off
torque
of
adhesives
used
by
placement
equipment
to
attach
surface
mounted
devices
to
printed
wiring
boards.
2
.0
Applicable
Documents
None
3
.0
Test
Specimen
•
Apply
a
1
.25
mm
[0.05
in]
diameter
circle
of
adhesive
0.1
mm
[0.004
in]
thick
to
a
FR-4
substrate.
•
Place
a
type
1
206
resistor
firmly
onto
the
circle
of
adhesive.
•
Cure
adhesive
according
to
manufacturers
directions.
4
.0
Equipment
4.1
Torque
Tester
A
Waters
Manufacturing
torque
watch
(or
equivalent)
with
a
0
to
1
40
or
0
to
280
Nmm
scale
is
to
be
used.
The
torque
gauge
must
have
a
separate
indicator
needle
to
register
maximum
torque.
4.1.1
Torque
Fixture
Use
torque
fixture
modified
per
sample
being
tested.
5
.0
Procedure
5.1
Sample
Placement
Place
the
samples
board
in
the
test
fixture.
Number
2.4.42
Subject
Torsional
Strength
of
Chip
Adhesives
Date
Revision
2/88
Originating
Task
Group
N/A
5.1.1
Zeroing
the
Gauge
Rotate
the
face
knob
of
the
tester
per
until
the
maximum
torque
indicator
needle
is
zeroed.
5.1
.2
Testing
Sample
Using
the
thumb
and
forefinger,
and
middle
finger
of
the
right
hand
slowly
rotate
the
torque
gauge
in
a
clockwise
direction
until
the
component
breaks
off.
5.1.3
Torquing
Techniques
Components
to
be
torqued
should
be
centered
inside
the
probe.
The
component
should
not
protrude
from
the
probe
when
testing
is
begun.
5.1.4
Taking
Reading
After
the
component
has
been
torqued
off,
a
reading
of
break-off
torque
shall
be
taken
from
the
face
of
the
torque
tester.
This
reading
is
shown
by
the
maximum
torque
indicator
needle.
5.1.5
Completion
of
Torquing
Repeat
until
5
components
of
the
same
type
have
been
torqued
off.
6
.0
Notes
Do
not
raise
or
lower
the
gauge
while
turning.
If
the
gauge
is
lowered
the
increased
friction
against
the
board
will
yield
inaccurate
readings.
If
the
gauge
is
lifted
it
will
lose
contact
with
the
component
and
yield
an
inaccurate
reading
as
well.
MIL-F-14256
QQ-S-571
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
The
object
of
this
test
is
to
determine
the
com¬
ponent
hold-down
capability
of
the
adhesive
material
at
wave
soldering
temperatures
due
to
material
softening
or
degrada¬
tion.
Test
coupons
are
assembled
using
the
adhesive
material
and
1206
size
chip
resistors.
The
test
coupons
are
preheated
then
floated
on
a
solder
pot,
after
which
the
loss
of
any
com¬
ponents
is
noted.
2
.0
Applicable
Documents
Flux,
Soldering,
Liquid
(Rosin
based)
Solder,
Tin
Alloy,
Tin-lead
Alloy,
and
Lead
Alloy
3
.0
Test
Specimens
1
.
Bare
FR-4
Test
Coupon-approximately
50.8
mm
[2.0
in
]
square
2
.
1206
sized
surface
mount
chip
resistors
4
.0
Apparatus
Solder
pot
Sn
60
Sn
62
Sn
63
per
QQ-S-
571
—
temperature
controlled
to
provide
260
±
5
℃.
5
.0
Procedures
5.1
Test
Coupon
Fabrication
A
single
test
coupon
is
made
by
applying
20
adhesive
dots
or
rectangles
on
to
a
bare
FR-4
coupon.
The
thermal
cure
adhesive
dots
shall
be
sten¬
ciled
providing
a
dot
0.1
mm
[0.004
in]
thick
and
1.27
mm
[0.050
in]
in
diameter.
The
ultraviolet
cured
adhesive
deposits
shall
be
stenciled
into
a
2.0
x
0.76
mm
[0.080
x
0.030
in]
rectangular
slit
of
0.1
mm
[0.004
in]
thickness.
Number
2.4.42.1
Subject
High
Temperature
Mechanical
Strength
Retention
of
Adhesives
Date
Revision
3/88
Originating
Task
Group
N/A
over
the
UV
adhesive
rectangles
such
that
equal
adhesive
volumes
are
observed
at
both
component
sides.
The
assembly
is
then
cured
per
manufacturers
recommended
conditions.
5.2
Solder
Float
The
test
coupon
is
fluxed
with
a
type
R
per
MIL-F-I4256
flux
and
excess
drained
off.
The
coupon
is
then
held
approximately
12.7
mm
[0.5
in]
above
the
dross-free
solder
pot
surface
for
60
±5
seconds
with
the
component
side
facing
the
solder
surface.
The
coupon
is
then
brought
into
contact
with
the
clean
solder
surface
and
allowed
to
float
for
10
+
1-0
seconds
while
being
lightly
but
continuously
agi¬
tated.
After
cooling,
the
remaining
flux
residue
is
cleaned
from
the
surface
and
the
coupon
examined
for
severely
displaced
components.
A
component
is
severely
displaced
if:
1.
No
longer
on
the
test
coupon.
2.
It
is
rotated
more
than
30
degrees
from
its
original
posi¬
tion.
3.
It
is
lifted
or
tilted
away
from
the
board's
surface
leaving
a
gap
between
either
component
termination
and
the
board
of
more
than
1
mm
[0.040
in].
A
suitable
thickness
shim
may
be
used
in
this
determination.
5.
3
Evacuation
Any
evidence
of
severely
displaced
com¬
ponents
on
the
processed
test
coupons
shall
be
noted.
6.0
Notes
None
The
chip
resistors
are
first
centered
over
then
securely
pressed
into
the
adhesive
deposits.
The
resistors
are
aligned
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 3
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
test
is
carried
out
to
determine
the
reflow
properties
of
the
solder
paste.
The
ability
of
the
prealloyed
solder
particles
in
the
paste
to
reflow
into
a
sphere
on
a
non¬
wettable
substrate
is
determined
under
defined
test
condi¬
tions.
2
.0
Applicable
Documents
None
3
.0
Test
Specimen
Frosted
glass
microscope
slide,
alu¬
mina
substrate
or
glass/epoxy
printed
circuit
board
with
a
thickness
of
0.60
to
0.80
mm
and
a
minimum
length
and
width
dimension
of
76
mm
and
25
mm,
respectively.
4
.0
Equipment/Apparatus
4.1
Metal
Stencils
4.1.1
Stencil
for
Type
1-4
Stencil
76
mm
x
25
mm
x
0.2
mm
provided
with
at
least
3
round
holes
of
6.5
mm
diameter
apertures
with
a
minimum
distance
between
centers
of
10
mm.
4.1.2
Stencil
for
Type
5-6
Stencil
76
mm
x
25
mm
x
0.1
mm
provided
with
at
least
3
round
holes
of
1
.5
mm
diameter
apertures
with
a
minimum
distance
between
centers
of
10
mm.
4.2
Spatula
4.3
Solder
bath
not
less
than
100
mm
x
100
mm
x
75
mm
deep
containing
solder
suitable
to
maintain
a
temperature
of
25℃
above
the
liquidus
temperature
of
the
solder
paste
being
evaluated.
4.4
Flat
hot
plate
4.5
Surface
temperature
thermometer
4.6
Magnifying
glass
with
a
1
0
to
20
times
magnification.
5
.0
Procedure
5.1
Preparation
Number
2.4.43
Subject
Solder
Paste
~~
Solder
Bal
1
Test
Date
1/95
Revision
Originating
Task
Group
Solder
Paste
Task
Group
(5-24b)
5.1.1
Set
the
temperature
of
the
solder
bath
or
hot
plate
at
a
temperature
of
25℃
+/-3℃
above
the
liquidus
temperature
of
the
solder
alloy.
5.1.2
Homogenize
the
solder
paste
by
hand
stirring
with
a
spatula.
5.1.3
Condition
the
paste
to
uniform
temperature
of
25°
C
+/-2℃.
5.1.4
Prepare
two
test
specimens
with
either/or
both
sten¬
cils
listed
above
(4.1
.1
and
4.1
.2).
The
solder
paste
should
be
squeeged
with
the
spatula
to
fill
and
level
each
hole.
5.2
Test
5.2.1
Test
Conditions
5.2.
1.1
Test
one
specimen
within
15
+/-5
minutes
after
placement
of
solder
paste
on
test
coupon.
5.2.1.
2
Test
the
second
specimen
4
hours
+/-15
minutes
after
placement
of
solder
paste
on
test
coupon.
Storage
for
4
hours
shall
be
at
25℃
+/-3℃
and
50
+/-1
0%
RH.
5.2.2
Conditioning
Heating
Equipment
5.2.2.
1
Clean
the
surface
of
the
solder
bath
with
the
scraper.
5.2.2.2
Remove
all
foreign
material
from
the
surface
of
the
hot
plate
to
ensure
proper
control.
5.2.3
Solder
Reflow
Reflow
specimens
by
one
of
the
fol¬
lowing
two
methods.
5.2.3.
1
Lower
the
substrate,
in
a
horizontal
position
with
the
paste
deposit
on
top,
into
the
solder
bath
at
a
speed
of
25
+/-
2
mm/second
until
the
substrate
is
50%
submerged.
It
is
important
that
good
thermal
contact
is
achieved
between
the
molten
solder
and
the
substrate.
As
soon
as
the
solder
has
melted,
withdraw
the
substrate
from
the
solder
bath
maintain¬
ing
it
in
a
horizontal
position.
The
total
time
on
the
solder
bath
shall
not
exceed
20
seconds.