IPC-TM-650 EN 2022 试验方法--.pdf - 第567页

ASTM D229 ASTM D149 The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 Sanders Road • Northbrook, IL 60062 Material in this T est M ethods Manual was vol untaril y establis hed by T echni cal Comm…

100%1 / 824
IPC-TM-650
Number Subject Date
Revision
Page 7 of 7
2.5.5.15
RelativePermittivityandLossTangentUsinga
06/22
Split-PostDielectricResonator
N/A
5.3.10
If another test frequency is selected, change the SPDR test fixture in accordance with the test frequency. Then repeat
steps 5.3.2 through 5.3.9.
6 Report
6.1
For room temperature tests, report the following:
6.1.1
Test environment (temperature, humidity);
6.1.2
Test frequency;
6.1.3
Report the values and the average values of the relative permittivity and loss tangent at test frequency;
6.1.4
The preconditioning of the specimen;
6.1.5
Any anomalies in the test or variations from this test method.
6.2
For variable temperature tests, report the following:
6.2.1
Test temperature (T) and base temperature (T
ref
);
6.2.2
Test frequency;
6.2.3
Dk(T)and Df(T)at test temperature (T);
6.2.4
TC
e
r
and TC tan
d
;
6.2.5
Dk(T
ref
) and Df(T
ref
);
6.2.6
If more than one test temperature is necessary, report the curve diagram of the relative permittivity and loss tangent in
accordance with the temperature variation ;
6.2.7
The preconditioning of the specimen;
6.2.8
Any anomalies in the test or variations from this test method.
7 Notes
7.1
Accuracy of measurements of a sample of thickness h.
7.2
Permittivitymeasurement:Δ
e
/
e
=±[0.0015+Δh/h].
7.3
Losstangent:Δtan
d
= ±2 × 10
−5
or ±0.03 × tan
d
whichever is higher.
7.4
Clean test heads, standard materials and fixtures regularly.
7.5
To prevent damage to the test fixture because of the variable temperature tests, verify the test system regularly with a
standard reference sample. For example, single-crystal quartz is used as standard reference sample of thickness 0.4 mm.
The deviation of the relative permittivity measurement between the test result and the nominal value of the standard
reference sample shall be less than ± 0.7 %, while the deviation of the loss tangent shall be less than ± 2 × 10
−5
.
ASTM D229
ASTM D149
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road Northbrook, IL 60062
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 3
IPC-TM-650
TEST
METHODS
MANUAL
Number
2.5.6
Subject
Dielectric
Breakdown
of
Rigid
Printed
Wiring
Material
Date
Revision
5/86
B
Originating
Task
Group
N/A
1
.0
Scope
This
method
describes
a
procedure
for
deter¬
mining
the
ability
of
rigid
insulating
materials
to
resist
break¬
down
parallel
to
laminations
(or
in
the
plane
of
the
material)
when
subjected
to
extremely
high
voltages
at
standard
AC
power
frequencies
of
50-60Hz.
As
for
most
electrical
properties,
values
obtained
on
most
materials
are
highly
dependent
on
the
moisture
content
and
tests
using
different
conditioning
cannot
be
compared.
Tests
in
other
mediums,
e.g.,
air
are
generally
impractical
due
to
its
relatively
low
breakdown.
This
method
is
based
on
the
test
technique
described
as
ASTM
D229.
2
.0
Applicable
documents
Standard
Method
of
Testing
Rigid
Sheet
and
Plate
Materials
Used
for
Electrical
Insulation
Standard
Test
Method
for
Dielectric
Breakdown
Voltage
and
Dielectric
Strength
of
Solid
Electrical
Insulating
Materials
at
Commercial
Power
Frequencies
3
.0
Test
Specimens
3.1
Number
Four
specimens
shall
be
tested.
When
speci¬
fied,
two
shall
be
in
the
machine
direction
and
two
in
the
transverse
direction
for
reinforced
materials.
3.2
Form
Specimens
shall
be
approximately
3.0
inch
X
2.0
inch
X
thickness
and
shall
be
prepared
by
shearing
or
sawing
the
specimen
from
the
test
sample.
Two
holes
0.188
inch
in
diameter
are
to
be
drilled
along
the
center
line
of
the
3.0
inch
dimension
and
midway
between
the
edges
in
the
2.0
inch
dimension,
with
a
spacing
of
1
.0
inch
±
.01
inch
center
to
center.
3.3
Location
The
specimens
may
be
cut
from
any
location
in
the
sheet
(except
from
the
outer
1.0
inch
of
full
size
sheets).
3.4
Foil
Clad
Material
Foil
clad
material
shall
have
all
metal
cladding
removed
by
etching
and
shall
be
thoroughly
cleaned
prior
to
conditioning
or
testing.
4.0
Apparatus/Materials
4.1
High
voltage
breakdown
tester
(generally
50KV
mini¬
mum)
with
current
rating
of
.5KVA
up
to
10KV
and
5
KVA
above
1
0KV
and
a
motorized
control
capable
of
a
500
volts/
second
rate
of
rise.
4.2
Oil
tank
filled
with
insulating
oil1
capable
of
exceeding
the
requirements
of
the
specification.
4.3
Tapered
pin
electrode
fixture
utilizing
two
American
Standard
#3
pins.
(Note
spherical
ends
on
the
pins
are
per¬
mitted
and
recommended
to
reduce
likelihood
of
breakdown
in
the
oil.)
4.4
High
voltage
test
leads
(leads
rated
in
excess
of
machine
capacity
are
recommended).
4.5
Constant
temperature
water
bath,
capable
of
50℃
±
2
℃,
filled
with
distilled
water.
4.6
Beaker
or
pan
filled
with
ambient
temperature
distilled
water.
4.7
Racks
for
supporting
specimens
in
the
50℃
water
bath
(with
all
specimen
surfaces
exposed).
4.8
Timer
0-60
seconds.
4.9
Lint
free
paper
towels.
5.0
Procedure
5.1
Preconditioning
Unless
otherwise
specified
the
speci¬
men
shall
be
conditioned
for
48
hours
(+2
hours
-0
hours)
in
distilled
water
maintained
at
50℃
±
2
℃.
Following
this
step
the
specimen
shall
be
immersed
in
ambi¬
ent
temperature
distilled
water
for
30
minutes
minimum,
4
hours
maximum,
to
allow
the
specimens
to
achieve
tempera¬
ture
equilibrium
without
a
substantial
change
in
moisture
con¬
tent.
1
.
Insulating
Oil:
Transfer
oil
such
as
Shell
Dial
Ax
may
be
used.
Use
of
dibutyl
phthalate
is
acceptable
but
it
may
cause
failure
of
the
adhesives
used
for
plastic
tanks.
1 Scope and Purpose
1.1 Scope
This method subjects unpopulated test speci-
mens (samples) to sudden, extreme changes in temperature
in order to evaluate the quality of interconnects formed during
the manufacturing processes.
1.2 Purpose
This method be used to simulate the
thermodynamic effects of extreme temperature variations. The
use of this method is intended to be able to capture ‘‘infant
mortality’’ types of manufacturing defects.
1.2.1
This method may provide for qualification, quality con-
formance testing and lot acceptance.
2 Applicable Documents
Terms and Definitions
Generic Standard on Printed Board Design
Acceptability of Printed Boards
Standard for Printed Board Handling and Storage
Specification for Base Materials for Rigid and Mul-
tilayer Printed Boards
Specification for Base Materials for High Speed/
High Frequency Applications
Qualification and Performance Specification for
Rigid Printed Boards
Qualification and Performance Specification for
Flexible Printed Boards
Qualification and Performance Specification for
High Frequency (Microwave) Printed Boards
Guidelines for Microsection Preparation
Test Methods Manual
1
2.1.1 Microsectioning - Microsectioning, Manual and Semi
or Automatic Method
2.6.27 Assembly Simulation - Thermal Stress, Convection
Reflow Assembly Simulation
3 Terms and Definitions
3.1 Thermal Shock (Unpopulated Printed Board)
A tem-
perature cycle with a change rate of 1 °C or more per second
as measured on the surface of the test specimen, for at least
the center 60% of each transition, during the heating and
cooling portions.
3.2 Thermal Cycle (Unpopulated Printed Board)
A tem-
perature cycle that has a sample change rate of less than 1 °C
per second as measured on the surface of the test specimen,
for at least the center 60% of each transition, during the heat-
ing and cooling portions. While no minimum temperature
change rate is specified, a change rate of at least 10 °C per
minute is expected for qualification testing.
4 Test Specimen
4.1 Design/Construction Criteria
4.1.1
The test specimen be the D coupon in accor-
dance with the requirements of IPC-2221 Appendix A, or
alternate coupon(s) AABUS.
4.1.2
The test specimen(s) be constructed with holes
contained in the printed board it represents as follows:
Through holes: D coupons
be constructed with both
the largest plated-through holes (PTHs) and the smallest
plated-through vias.
Propagated structures: D coupons
be constructed
with and represent all applicable blind, buried, or filled
through hole (propagated) via structures as defined in IPC-
2221 Appendix A. D coupons contain two nets (structures).
Multiple D coupons are used for designs with more than two
structures.
4.1.2.1
The test specimen(s) contain the representa-
tive ground and power planes of the printed board design.
4.1.3
The test specimen(s) allow for microsection
evaluation of all the applicable, representative PTHs and vias
defined in 4.1.2 after exposure to the conditions of this Test
Method. IPC-9241 provides guidance on the proper prepara-
tion of a metallographic sample (microsection) of a printed
board.
3000 Lakeside Drive, Suite 105N
Bannockburn, IL 60015-1249
IPC-TM-650
TEST METHODS MANUAL
Number
2.6.7.2
Subject
Thermal Shock, Thermal Cycle and Continuity
Date
3/2020
Revision
C
Originating Task Group
Thermal Stress Test Methodology Subcommittee
(D-32)
Association
Connecting
Electronics
Industries
shall
IPC-T-50
IPC-2221
IPC-A-600
IPC-1601
IPC-4101
IPC-4103
IPC-6012
IPC-6013
IPC-6018
IPC-9241
IPC-TM-650
shall
shall
shall
shall
shall
shall
Material
/n
this
Test
Methods
Manual
was
voluntarily
established
by
Technical
Committees
of
I
PC.
This
material
/s
advisory
only
and
"s
use
or
adaptation
s
entirely
voluntary.
IPC
disclaims
all
liability
of
any
kind
as
to
the
use,
application,
or
adaptation
of
this
material.
Users
are
also
wholly
responsible
for
protecting
themselves
against
all
claims
or
liabilities
for
patent
infringement.
Equipment
referenced
/s
for
the
convenience
of
the
user
and
does
not
imply
endorsement
by
IPC.
Page
1
of
5