IPC-TM-650 EN 2022 试验方法--.pdf - 第382页
IPC-TM-650 T est Methods Manual The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was voluntarily establis hed by …
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
test
is
to
determine
the
ability
of
a
printed
pattern
of
solder
paste
to
retain
a
probe
placed
in
the
solder
paste
by
measuring
the
force
required
to
separate
the
probe
from
the
paste.
Time
between
printing
and
probe
placement
are
progressively
increased
to
simulate
variables
in
a
manu¬
facturing
process.
2
.0
Applicable
Documents
None
3
.0
Test
Specimen
A
representative
sample
of
this
paste
should
then
be
printed
out,
using
a
stencil,
onto
clean
plain¬
glass
slides.
At
least
six
paste
deposits
should
be
printed
per
required
time
data-point.
The
final
deposits
must
be
circular,
6.3
mm
in
diameter
and
0.25
mm
thick.
Mark
the
test
speci¬
men
in
a
suitable
manner
to
identify
the
sample
and
the
time
after
printing
when
tackiness
is
to
be
measured.
The
prepared
samples
shall
be
stored
at
25℃
±
2
℃
and
50℃
土
1
0%
rela¬
tive
humidity
(RH)
until
evaluated.
The
samples
shall
not
be
stored
in
an
enclosed
cabinet
or
container,
which
allows
the
solder
paste
solvent
vapors
to
saturate
the
environment
sur¬
rounding
the
printed
paste,
thus
preventing
natural
drying
of
the
material.
4
.0
Equipment/Apparatus
A
Chatillon
tackiness
tester
or
other
equipment
may
be
used,
providing
it
is
capable
of
accu¬
rately
measuring
force
when
tested
at
a
similar
velocity.
The
equipment
shall
have
a
stainless
steel
test
probe
with
a
nomi¬
nal
5.1
mm
±
0.13
mm
diameter
bottom
surface,
which
is
smooth,
flat,
and
aligned
parallel
to
the
plane
of
the
subject
test
specimen.
The
probe
shall
contact
the
test
specimen
at
a
controlled
speed
and
apply
a
controlled,
fixed
initial
contact
force.
Finally,
a
means
shall
be
provided
to
withdraw
the
test
probe
from
the
surface
of
the
test
specimen
at
a
controlled
speed
and
record
the
peak
force
required
to
break
contact
with
the
test
specimen.
5
.0
Procedure
Place
the
specimen
slide
under
the
test
probe
and
center
the
probe
over
one
of
the
three
printed
pat¬
terns.
Bring
the
test
probe
in
contact
with
the
printed
paste
specimen
at
a
rate
of
2.5
mm/min.
土
0.5
mm/min.
and
apply
a
force
of
300
g
±
30
g
to
the
specimen.
Within
five
seconds
Number
2.4.44
Subject
Solder
Paste
—
Tack
Test
Date
Revision
3/98
Reaffirmed
Originating
Task
Group
Solder
Paste
Task
Group
(5-24b)
following
application
of
this
force,
withdraw
the
probe
from
the
specimen
at
a
rate
of
2.5
mm/min.
±
0.5
mm/min.
and
record
the
peak
force
required
to
break
the
contact.
Take
at
least
five
additional
measurements
under
the
same
test
conditions
and
average
all
the
readings.
Record
both
the
tack
force
and
time
following
paste
printing.
5.1
Evaluation
Initial
measurements
are
to
be
taken
imme¬
diately
after
printing.
Subsequent
measurements
of
force
shall
be
taken
as
needed
to
best
define
the
rise
and
decline
of
the
tack
force.
Tackiness
data
should
be
presented
in
graph
form,
provided
that
the
graph
with
tack
force
is
plotted
as
a
func¬
tion
of
time
after
printing.
The
data
can
also
be
reported
as
follows:
1.
Time
to
reach
80%
of
the
peak
value.
2.
The
peak
tack
force
in
grams
with
the
expected
variation.
3.
Time
over
which
the
peak
value
is
maintained
or
for
the
tack
force
to
decline
to
80%
of
its
peak
value.
6.0
Notes
6.1
Test
Equipment
Sources
The
equipment
sources
described
in
6.1.1
and
6.1.2
represent
those
currently
known
to
the
industry.
Users
of
this
test
method
are
urged
to
submit
additional
source
names
as
they
become
available
so
that
this
list
can
be
kept
as
current
as
possible.
6.1.1
AMETEK/Chatillon
8600
Somerset
Drive
Largo,
FL
33773
Phone:
1
(800)
527-9999
6.1.2
Malcom
Instruments
Corp.
26226
Industrial
Blvd.
Hayward,
GA
94545
Phone:
1
(510)
293-0580
IPC-TM-650 Test Methods Manual
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
Determine
the
ability
of
a
solder
paste
to
wet
an
oxidized
copper
surface
and
to
qualitatively
examine
the
amount
of
spatter
of
the
solder
paste
during
reflow.
2
.0
Applicable
Documents
None
2.4.43
Solder
Paste
—
Solder
Ball
Test
3
.0
Test
Specimen
7
.6
cm
x
2.5
cm
x
0.8
mm
specimen
of
1
ounce
oxygen-free
high
conductivity
(OFHC)
copper.
4
.0
Equipment/Materials/Apparatus
Flat
hot
plate
Specimen
tongs
Beaker
400
cc
Magnifying
glass
with
1
0
times
magnification
Liquid
copper
cleaner
Deionized
water
Isopropyl
alcohol
Solvent
for
residual
flux
removal
4.1
Stencil
76
mm
x
25
mm
x
0.2
mm
provided
with
at
least
3
round
holes
or
6.5
mm
diameter
aperature
with
a
minimum
between
centers
of
10
mm.
5
.0
Procedure
5.1
Preparation
5.1.1
The
specimen
shall
be
cleaned
with
a
liquid
copper
cleaner,
washed
thoroughly
with
water,
rinsed
with
isopropyl
alcohol,
dried
and
then
placed
in
boiling
deionized
water
for
10
minutes
and
air
dried
5.2
Test
Number
2.4.45
Subject
Solder
Paste
—
Wetting
Test
Date
Revision
1/95
Originating
Task
Group
Solder
Paste
Task
Group
(5-24b)
5.2.2
Reflow
using
the
procedure
outlined
in
paragraph
523.2
of
IPC-TM-650,
Test
Method
2.4.43.
5.2.3
After
reflow,
the
residual
flux
shall
be
removed
with
a
suitable
solvent.
5.3
Evaluation
When
examined
visually
at
1
0X,
the
solder
shall
uniformly
wet
the
copper
and
there
should
be
no
evi¬
dence
of
dewetting
or
non-wetting
of
the
copper
and
there
shall
be
no
solder
spatter
around
the
printed
dots.
5.2.1
Place
stencil
on
test
specimen
and
print
solder
paste
test
pattern.
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 4
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
1.1
Purpose
This
method
is
suitable
for
determining
the
volume
permittivity,
(dielectric
constant)
and
loss
tangent
(dis¬
sipation
factor)
of
insulating
materials
at
1
MHz.
It
is
not
dependent
on
either
direct
or
indirect
measurement
of
speci¬
men
thickness
and
therefore
is
very
useful
for
thin
films
and
laminates
but
may
also
be
used
on
specimens
up
to
approxi¬
mately
6.35
mm
[0.25
in]
thick.
It
is
useful
for
all
ranges
of
permittivity
and
for
loss
tangent
as
low
as
0.0005
providing
the
range
and
accuracy
of
the
bridge
used
are
adequate.
1.2
Description
of
Method
The
two
fluid
method
utilizes
air
as
one
fluid
and
a
suitable
liquid,
normally
Dow
200
1
.0CS
silicone
fluid,
as
the
second.
Using
an
established
value
for
the
permittivity
of
air,
the
values
for
the
permittivity
of
the
fluid
and
the
sample
may
easily
be
calculated.
The
cell
spacing
is
fixed
during
all
readings
but
does
not
need
to
be
known
accu¬
rately
for
the
series
of
readings
required.
Since
specimens
do
not
require
any
electrodes
to
be
applied
and
since
many
specimens
can
be
measured
at
one
time
without
changing
any
spacings
or
machine
settings,
the
method
is
not
only
very
accurate
but
very
rapid.
The
method
has
been
used
for
measurement
of
PTFE
and
epoxy
glass
laminates
and
flexible
films,
e.g.,
polyimide.
Reproducibility
lab
to
lab
is
excellent
for
permittivity
provided
minimal
precautions
are
observed
and
bridge
accuracy
is
appropriate.
On
most
materials,
the
effects
of
small
changes
in
moisture
or
temperature
are
larger
than
any
error
due
to
the
method.
Lab
to
lab
correlation
on
stable
material
such
as
PTFE
have
shown
results
to
be
consistently
within
0.005
or
(0.20%).
2
.0
Applicable
Document
3
.0
Test
Specimens
Number
2.5.5.3
Subject
Permittivity
(Dielectric
Constant)
and
Loss
Tangent
(Dissipation
Factor)
of
Materials
(Two
Fluid
Cell
Method)
Date
12/87
Revision
C
Originating
Task
Group
N/A
3.1
Number
Unless
otherwise
specified
in
the
material
specification,
one
specimen
is
adequate
for
materials
which
are
uniform,
e.g.,
unreinforced
plastics.
For
woven
reinforced
materials
where
resin
content
may
vary,
at
least
2
specimens,
representing
the
thinnest
and
thickest
part
of
the
sample,
should
be
tested.
For
material
with
random
reinforcement,
a
minimum
of
three
specimens
from
the
edge
and
center
of
the
sheet
are
recommended
to
characterize
variation
within
the
sheet.
3.2
Form
Individual
specimens
shall
be
81
.3
mm
±
1.3
mm
x
81
.3
to
101
.6
mm
[3.2
in
±
0.05
in
x
3.2
in
to
4.0
in]
x
thick¬
ness.
For
materials
under
0.254
mm
[0.010
in],
individual
specimens
should
be
stacked
to
a
minimum
of
0.381
mm
[0.015
in]
to
maximize
accuracy.
Thinner
specimen
buildups
may
be
used
if
the
correlation
with
the
0.381
mm
[0.015
in]
specimen
is
within
the
required
accuracy
for
the
particular
equipment,
cell
spacing
and
material
being
tested.
3.3
Foil
Clad
Materials
All
foil
clad
materials
shall
have
the
metal
cladding
completely
removed
by
etching
and
shall
be
rinsed
and
dried
prior
to
conditioning.
3.4
Marking
Mark
each
specimen
in
the
upper
left
corner
with
an
engraving
pencil
or
an
ink
which
is
not
soluble
in
the
Dow
Corning
200
fluid.
4
.0
Apparatus/Materials
4
J
1
MHz
Capacitance
Bridge
with
0-200
(or
0-1
00)
pf
range.1
4.2
Cell
Balsbaugh
LD-32
or
equivalent
(see
Figure
1)
three
terminal
cell.
Note:
For
accuracy
of
1
%
or
better,
room
tem¬
perature
must
not
vary
more
than
1
℃
during
measurements.
Temperature
control
is
necessary
if
laboratory
variation
exceeds
these
limits.
1
.
Capacitance
Bridge
—
Suggested
is
Boonton
76A
automatic
capacitance
bridge.
This
model
has
adequate
capacitance
range
and
adequate
conductance
resolu¬
tion
(0.001
microsiemen)
to
permit
measurement
of
dissipation
factors
down
to
approximately
0.0005.
Other
bridges,
e.g.,
Boonton
75D,
are
also
adequate
for
low
loss
materials
and
some
other
bridges
may
be
suitable
for
higher
loss
materials,
such
as
epoxy
where
dissipation
factors
exceed
0.01
and
resolution
of
0.01
microsiemen
or
even
0.1
microsiemen
may
be
adequate.
2.
Balsbaugh
LD-3
Gillian
and
Co,,
Watertown,
MA,
(617)
624-5688
or
Zincast
Corporation,
44
Homestead
Ave.,
Stanford,
CT
06902,
(203)
359-0109