IPC-TM-650 EN 2022 试验方法--.pdf - 第70页
Degree 1 Degree 2 Degree 1 Degree 2 IPC-TM-650 Page 2 of 3 Number 2.1.10 Subject Visual Inspection for Undissolved Dicyandiamide Date 12/94 Revision A Appendix A: [Photos of dicy in lowest, medium, high, and extreme leve…
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.2.4
Dimensional
Stability,
Flexible
Dielectric
Materials
5/98
C
Twenty-four
hour
stabilization
is
referee
method.
5.2
Method
A
Dimensional
stability
of
unclad
material
due
to
thermal
exposure
—
standard
condition.
(1)
Place
test
specimen
unconstrained
in
an
oven
maintained
at
150℃
±
2
℃
for
30
±
2
minutes.
(2)
Cool
specimen
to
standard
conditions
of
23℃
±
2
℃
and
50%
±
5%
RH
for
24
hours
minimum
(see
5).
(3)
Remeasure
separation
of
holes/lines
and
record
as
final
measurement
after
thermal
exposure
(F).
5.3
Method
B
Dimensional
stability
of
metal
clad
dielectrics
due
to
metal
removal.
(1)
Chemically
erode
the
metal
away
except
for
the
target
areas,
which
can
have
up
to
13
mm
x
13
mm
square
metal,
using
an
etchant
that
has
no
detrimental
effect
on
either
the
dielectric
or
adhesive.
Wash
and
dry.
The
test
specimen
should
be
unconstrained
during
the
etching,
washing,
and
drying
operation.
(2)
Stabilize
test
specimen
for
24
hours
at
23℃
±
2
℃
and
50%
±
5%
RH
(see
5.1).
(3)
Remeasure
separation
of
holes/lines
and
record
as
final
measurement
after
etching
(F2).
5.4
Method
C
Dimensional
stability
of
dielectric
due
to
thermal
exposure
and
metal
removal,
using
specimens
from
Method
B.
Place
unconstrained
etched,
conditioned,
and
measured
specimen
from
Method
B
in
an
oven
maintained
at
150℃
土
2
℃
for
30
±
2
minutes.
(2)
Stabilize
specimen
at
23℃
±
2
℃
and
50%
±
5%
RH
for
24
hours
and
remeasure
separation
of
holes
(see
5.1).
(3)
Remeasure
separation
of
holes/lines
and
record
as
final
after
etching
and
thermal
exposure
(F3).
5.5
Calculate
the
linear
dimensional
changes
as
follows:
(Start
with
initial
reading
(I)
from
5.1)
(A—B)f
-
(A-B)|
(O-D)F
-
(C-D)|
，八
c、
+
e
c、
(A-C)f
-
(
A-C)|
(B-D)f
-
(
B-D)|
(A-C)|
*
(B-D)!
I
.U.
—
2
Where:
M.D.
=
%
change
in
machine
dimension.
T.D.
=
%
change
in
transverse
dimension.
I
=
Initial
Reading.
F
二
Final
Reading
(Either
F1
,
F2,
or
F3).
A-B
=
Distance
Between
Points
A
&
B.
A-C
=
Distance
Between
Points
A
&
C.
C-D
=
Distance
Between
Points
C
&
D.
B-D
=
Distance
Between
Points
B
&
D.
6
Notes
The
alternate
method
for
marking
clad
samples
allows
the
use
of
scribed
lines.
Caution
must
be
used
to
pro¬
tect
scribed
lines
during
etch
operation.
x
100
x
100
Degree 1
Degree 2
Degree 1
Degree 2
IPC-TM-650
Page 2 of 3
Number
2.1.10
Subject
Visual
Inspection
for
Undissolved
Dicyandiamide
Date
12/94
Revision
A
Appendix
A:
[Photos
of
dicy
in
lowest,
medium,
high,
and
extreme
levels.]
Degree 3
Degree 4
Degree 4
Degree 2
Degree 4
Degree 5
IPC-TM-650
Page 3 of 3
Number
2.1.10
Subject
Visual
Inspection
for
Undissolved
Dicyandiamide
Date
12/94
Revision
A
DEGREES
OF
DICYANDIAMIDE
(DICY)
CRYSTALS