IPC-TM-650 EN 2022 试验方法--.pdf - 第376页
The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was voluntarily establis hed by T echni cal Committees of the IP…
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
test
method
defines
the
procedure
for
determining
the
Volumetric
Thermal
Expansion
of
polymer
coatings
on
inorganic
substrates,
such
as
polyimide
on
a
sili¬
con
wafer.
The
expansion
is
measured
using
an
apparatus
designed
for
the
determination
of
the
Pressure/Volume/
Temperature
behavior
of
solid
samples.
2
.0
Applicable
Documents
None
3
.0
Test
Specimens
See
Sample
Preparation
5.1
.
4
.0
Apparatus
or
Material
GNOMIX
PVT
or
equivalent
capable
of
providing
PVT
data
over
its
pressure
range
0-200
MPa
(2000
bar
or
29,000
psi),
and
from
ambient
tempera¬
tures
to
400℃.
5
.0
Procedure
5.1
Sample
Preparation
Samples
are
prepared
by
form¬
ing
a
25
mm
thick
film
on
a
wafer
and
lifting
the
specimen
free
according
to
manufacturer's
recommendations.
Sample
is
cut
and
folded
to
fit
in
the
sample
chamber
of
the
PVT
apparatus.
Number
2.4.41.4
Subject
Volumetric
Thermal
Expansion
Polymer
Coatings
on
Inorganic
Substrates
Date
Revision
7/95
Originating
Task
Group
Deposited
Dielectric
Task
Group
(C-13a)
5.2
Test
Procedure
The
film
sample
(1
to
2
grams
mass)
is
placed
in
a
rigid
stainless
steel
cell.
The
cell
is
surrounded
by
a
“sample
cup"
which
guarantees
a
hydrostatic
state
of
stress
in
the
sample
at
all
times.
Follow
the
testing
protocol
according
to
the
PVT
Operations
Manual
for
the
measurement
of
the
volumetric
expansion.
5.3
Test
Analysis
Report
the
volumetric
expansion
of
the
material
from
room
temperature
to
300℃
and
the
tempera¬
ture
of
any
observed
transitions.
6
.0
Notes
6.1
PressureA/olume/Temperature
(PVT)
Apparatus:
One
source
is
Gnomix,
3809
Birchwood
Drive
in
Boulder,
CO
(303)
444-3395.
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
procedure
establishes
the
performance
and
test
guidelines
for
the
break-off
torque
of
adhesives
used
by
placement
equipment
to
attach
surface
mounted
devices
to
printed
wiring
boards.
2
.0
Applicable
Documents
None
3
.0
Test
Specimen
•
Apply
a
1
.25
mm
[0.05
in]
diameter
circle
of
adhesive
0.1
mm
[0.004
in]
thick
to
a
FR-4
substrate.
•
Place
a
type
1
206
resistor
firmly
onto
the
circle
of
adhesive.
•
Cure
adhesive
according
to
manufacturers
directions.
4
.0
Equipment
4.1
Torque
Tester
A
Waters
Manufacturing
torque
watch
(or
equivalent)
with
a
0
to
1
40
or
0
to
280
Nmm
scale
is
to
be
used.
The
torque
gauge
must
have
a
separate
indicator
needle
to
register
maximum
torque.
4.1.1
Torque
Fixture
Use
torque
fixture
modified
per
sample
being
tested.
5
.0
Procedure
5.1
Sample
Placement
Place
the
samples
board
in
the
test
fixture.
Number
2.4.42
Subject
Torsional
Strength
of
Chip
Adhesives
Date
Revision
2/88
Originating
Task
Group
N/A
5.1.1
Zeroing
the
Gauge
Rotate
the
face
knob
of
the
tester
per
until
the
maximum
torque
indicator
needle
is
zeroed.
5.1
.2
Testing
Sample
Using
the
thumb
and
forefinger,
and
middle
finger
of
the
right
hand
slowly
rotate
the
torque
gauge
in
a
clockwise
direction
until
the
component
breaks
off.
5.1.3
Torquing
Techniques
Components
to
be
torqued
should
be
centered
inside
the
probe.
The
component
should
not
protrude
from
the
probe
when
testing
is
begun.
5.1.4
Taking
Reading
After
the
component
has
been
torqued
off,
a
reading
of
break-off
torque
shall
be
taken
from
the
face
of
the
torque
tester.
This
reading
is
shown
by
the
maximum
torque
indicator
needle.
5.1.5
Completion
of
Torquing
Repeat
until
5
components
of
the
same
type
have
been
torqued
off.
6
.0
Notes
Do
not
raise
or
lower
the
gauge
while
turning.
If
the
gauge
is
lowered
the
increased
friction
against
the
board
will
yield
inaccurate
readings.
If
the
gauge
is
lifted
it
will
lose
contact
with
the
component
and
yield
an
inaccurate
reading
as
well.
MIL-F-14256
QQ-S-571
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
The
object
of
this
test
is
to
determine
the
com¬
ponent
hold-down
capability
of
the
adhesive
material
at
wave
soldering
temperatures
due
to
material
softening
or
degrada¬
tion.
Test
coupons
are
assembled
using
the
adhesive
material
and
1206
size
chip
resistors.
The
test
coupons
are
preheated
then
floated
on
a
solder
pot,
after
which
the
loss
of
any
com¬
ponents
is
noted.
2
.0
Applicable
Documents
Flux,
Soldering,
Liquid
(Rosin
based)
Solder,
Tin
Alloy,
Tin-lead
Alloy,
and
Lead
Alloy
3
.0
Test
Specimens
1
.
Bare
FR-4
Test
Coupon-approximately
50.8
mm
[2.0
in
]
square
2
.
1206
sized
surface
mount
chip
resistors
4
.0
Apparatus
Solder
pot
Sn
60
Sn
62
Sn
63
per
QQ-S-
571
—
temperature
controlled
to
provide
260
±
5
℃.
5
.0
Procedures
5.1
Test
Coupon
Fabrication
A
single
test
coupon
is
made
by
applying
20
adhesive
dots
or
rectangles
on
to
a
bare
FR-4
coupon.
The
thermal
cure
adhesive
dots
shall
be
sten¬
ciled
providing
a
dot
0.1
mm
[0.004
in]
thick
and
1.27
mm
[0.050
in]
in
diameter.
The
ultraviolet
cured
adhesive
deposits
shall
be
stenciled
into
a
2.0
x
0.76
mm
[0.080
x
0.030
in]
rectangular
slit
of
0.1
mm
[0.004
in]
thickness.
Number
2.4.42.1
Subject
High
Temperature
Mechanical
Strength
Retention
of
Adhesives
Date
Revision
3/88
Originating
Task
Group
N/A
over
the
UV
adhesive
rectangles
such
that
equal
adhesive
volumes
are
observed
at
both
component
sides.
The
assembly
is
then
cured
per
manufacturers
recommended
conditions.
5.2
Solder
Float
The
test
coupon
is
fluxed
with
a
type
R
per
MIL-F-I4256
flux
and
excess
drained
off.
The
coupon
is
then
held
approximately
12.7
mm
[0.5
in]
above
the
dross-free
solder
pot
surface
for
60
±5
seconds
with
the
component
side
facing
the
solder
surface.
The
coupon
is
then
brought
into
contact
with
the
clean
solder
surface
and
allowed
to
float
for
10
+
1-0
seconds
while
being
lightly
but
continuously
agi¬
tated.
After
cooling,
the
remaining
flux
residue
is
cleaned
from
the
surface
and
the
coupon
examined
for
severely
displaced
components.
A
component
is
severely
displaced
if:
1.
No
longer
on
the
test
coupon.
2.
It
is
rotated
more
than
30
degrees
from
its
original
posi¬
tion.
3.
It
is
lifted
or
tilted
away
from
the
board's
surface
leaving
a
gap
between
either
component
termination
and
the
board
of
more
than
1
mm
[0.040
in].
A
suitable
thickness
shim
may
be
used
in
this
determination.
5.
3
Evacuation
Any
evidence
of
severely
displaced
com¬
ponents
on
the
processed
test
coupons
shall
be
noted.
6.0
Notes
None
The
chip
resistors
are
first
centered
over
then
securely
pressed
into
the
adhesive
deposits.
The
resistors
are
aligned