IPC-TM-650 EN 2022 试验方法--.pdf - 第701页
IPC -601 2 Material in this T est M ethods Manual was voluntarily establis hed by T echni cal Committees of IPC. Thi s mat erial is a dvisory only and its use or adaptation is entirely voluntary . IPC disclaims all lia b…
IPC-TM-650
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
To
determine
the
resistance
of
the
laminate
to
thermal
stress
in
both
the
etched
and
unetched
state.
2
.0
Applicable
Documents
Methods
2.3.6, 2.3.7,
2.3.7.
1
3
.0
Apparatus
3.1
Solder
pot
capable
of
maintaining
the
temperature
on
the
applicable
specification
sheet
for
the
material
±
2°F
and
accepting
a
2
x
2
inch
test
specimen
or
equivalent.
3.2
Dow
Corning
Fluid
#704
or
equivalent.
4
.0
Test
Specimens
4.1
One
(1)
test
specimen
2x2
inch
will
be
cut
from
each
sample
sheet
for
the
unetched
specimen.
Number
2.6.8.
1
Subject
Thermal
Stress,
Laminate
Date
Revision
9/91
—
Originating
Task
Group
N/A
4.3
The
edges
of
the
2
x
2
inch
specimen
shall
be
sanded.
5
.0
Procedure
5.1
Etch
specimen
required
for
thermal
stress
etched
according
to
IPC-TM-650,
Methods
2.3.6, 2.3.7,
or
2.
3.7.1.
5.2
Apply
silicon
fluid
to
side
of
specimen
that
will
be
in
contact
with
solder.
5.3
Float
the
specimen
on
the
solder
for
the
time
and
at
the
temperature
specified
on
the
applicable
specification
sheet
for
the
material.
5.4
The
clad
or
unclad
surface
should
show
no
evidence
of
charring,
loss
of
surface
resin,
softening
delamination,
blister¬
ing,
or
weave
exposure.
4.2
One
(1)
test
specimen
2x2
inch
from
each
sample
sheet
for
the
etched
specimen.
IPC-6012
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
Page 1 of 1
ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
®
221
5
Sanders
Road
Northbrook,
IL
60062-6135
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
describes
a
procedure
which
may
be
conducted
to
determine
if
a
printed
wiring
board
is
con¬
structed
to
withstand
the
dynamic
vibrational
stresses
that
may
be
encountered
during
field
service.
This
test
method
provides
specific
parameters
for
one
application
in
order
to
present
the
proper
procedures.
Specific
test
conditions
must
be
agreed
upon
by
the
customer
and
the
vendor.
2
Applicable
Documents
Qualification
and
Performance
Specification
for
Rigid
Printed
Boards
3
Test
Specimen
The
preproduction
or
production
printed
wiring
board.
4
Apparatus
4.1
Vibration
A
vibration
system
capable
of
producing
an
input
of
25
G's
over
a
frequency
range
from
20
Hz
to
2000
Hz
to
20
Hz
performed
in
1
6
minutes.
4.2
Mounting
Fixtures
4.3
The
test
fixture
must
be
designed
such
that
resonant
vibration
inherent
in
the
fixture
within
the
frequency
range
specified
for
the
test
shall
be
minor.
The
magnitude
of
the
applied
vibration
should
be
monitored
on
the
test
fixture
near
the
specimen
mounting
points.
Number
2.6.9
Subject
Vibration,
Rigid
Printed
Wiring
Date
Revision
05/04
B
Originating
Task
Group
Rigid
Printed
Board
Performance
Task
Group
(D-33a)
4.4
The
test
specimen
shall
be
restrained
from
movement
by
fixturing
at
all
four
edges
and
with
the
flat
surface
of
the
boards
mounted
perpendicular
to
the
axis
of
vibration.
5
Test
Procedures
5.1
The
boards
shall
successfully
pass
the
interconnection
resistance
test
in
accordance
with
I
PC-60
12
before
and
after
the
vibration
test.
5.2
The
boards
shall
be
subjected
to
both
a
cycling
and
a
resonance
dwell
test.
5.2.1
The
cycling
test
shall
consists
of
one
sweep
from
20
Hz
to
2000
Hz
to
20
Hz
performed
in
16
minutes.
The
input
acceleration
(G's)
over
the
20-2000-20
Hz
frequency
range
shall
be
maintained
at
15
G's.
5.2.2
The
boards
shall
be
subjected
to
a
30-minute
reso¬
nance
dwell
with
25
G's
input
or
a
maximum
of
100
G's
out¬
put
measured
at
the
geometric
center
of
the
board.
5.3
Evaluation
Examine
boards
for
warp
or
delamination
and
interconnection
resistance
after
exposure
to
the
vibration
test.
6
Notes
None
IPC-T-50
IPC-CH-65
J-STD-001
IEC-TC-91
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 5
IPC-TM-650
TEST
METHODS
MANUAL
Number
2.6.9.1
Subject
Test
to
Determine
Sensitivity
of
Electronic
Assemblies
to
Ultrasonic
Energy
Date
Revision
1/95
Originating
Task
Group
Ultrasonic
Cleaning
Task
Group
(5-31
e)
1
.0
Scope
The
purpose
of
this
test
method
is
to
provide
a
consistent
procedure
to
test
the
sensitivity
of
electronic
components
to
ultrasonic
energy.
There
has
been
a
reluctance
in
the
elec¬
tronics
industry
to
use
ultrasonic
energy
for
printed
board
assemblies
cleaning
because
of
the
possibility
of
damage
to
wire
bonds
in
active,
hermetically
sealed
components
or
other
damage
that
might
cause
latent
failures.
Recent
work
has
shown
that
electronic
components
have
a
low
potential
for
damage
from
ultrasonics
(See
6.1)
under
conditions
seen
in
most
cleaning
processes.
In
addition,
MIL-
STD-2000
Rev.
A
and
J
-STD
001
now
allow
for
the
use
of
ultrasonic
cleaning,
as
does
the
proposal
for
IEC
TC91
Inter¬
national
Standards
based
on
an
updated
revision
of
the
J-STD-001
.
1.1
Definitions
Ultrasound:
All
sound
in
frequencies
above
the
range
of
human
hearing.
For
the
purpose
of
ultrasonic
cleaning,
fre¬
quencies
between
1
8-800
kHz
are
in
commercial
use.
In
the
lower
frequency
ranges,
fluid
cavitation
is
the
primary
agitation
method.
In
the
higher
frequency
ranges,
microstreaming
(i.e.,
fluid
pumping)
is
believed
to
be
the
form
of
mechanical
agitation.
Frequency:
The
number
of
periodic
oscillations,
vibrations
of
waves
per
unit
of
time,
usually
expressed
in
cycles
per
sec¬
ond.
Generator:
An
electronic
system
which
converts
the
50
or
60
Hz
power
line
electricity
into
an
ultrasonic
frequency
drive
sig¬
nal
which
powers
the
transducers
in
their
resonant
frequency
range.
Transducers:
Convert
electrical
energy
from
the
generator
into
mechanical
(vibratory)
energy,
producing
high
intensity
sound
waves
in
a
liquid
and
causing
cavitation.
Transducers
are
pri¬
marily
of
two
types.
Piezoelectric:
Piezoelectric
ceramics,
which
change
dimen¬
sions
in
the
presence
of
an
electric
field.
Thickness
varies
in
response
to
an
applied
voltage.
Conversion
efficiency
=
70-90%
Magnetostrictive:
Made
of
nickel
or
its
alloys,
it
changes
length
when
placed
in
a
magnetic
field.
Conversion
efficiency
二
20-50%
Cavitation:
The
rapid
formation
and
oscillation
or
violent
col¬
lapse
of
microscopic
bubbles
or
cavities
in
a
liquid,
produced
by
introducing
high
frequency
(ultrasonic)
sound
waves
into
a
liquid.
The
agitation
from
countless
implosions
of
these
bubbles
create
a
highly
effective
scrubbing
of
both
exposed
and
hidden
surfaces
of
parts
immersed
in
the
cleaning
solution.
Degas:
The
act
of
removing
entrained
gas
from
cleaning
fluid.
Gas
bubbles
tend
to
absorb
ultrasonic
energy,
thereby
decreasing
the
amount
of
energy
available
for
cleaning.
2
.0
Applicable
Documents
2.1
Institute
for
Interconnecting
and
Packaging
Elec¬
tronic
Circuits
(IPC)
Terms
and
Definitions
for
Interconnecting
and
Packaging
Electronic
Assemblies
Guidelines
for
Cleaning
of
Printed
Boards
and
Assemblies
2.2
Joint
Industry
Standards
Requirements
for
Soldered
Electrical
and
Elec¬
tronic
Assemblies
2.3
Military
MIL-STD-2000
Rev.
A
Standard
Require¬
ments
for
Soldered
Electrical
and
Electronic
Assemblies
2.4
Other
Publications
Proposed
International
Standard
(based
on
J-STD-001)
International
Requirements
for
Soldered
Electrical
and
Electronic
Assemblies
Using
Surface
Mount
and
Related
Assembly
Technologies
3
.0
Test
Specimens
The
board
mounted
components
to
be
tested
should
be
the
exact
type
and
configuration
the
tester
intends
to
use
in
pro¬
duction.
A
statistically
valid
number
of
each
type
and
package
style
of
component
of
interest
should
be
tested.
For
example,
if
actual
production
boards
are
used
for
testing
and
only
one
of
a
particular
component
is
contained
on
the
board,
then
a
statistically
valid
number
of
boards
will
have
to
be
tested.
If,
instead
of
production
boards,
dummy
boards
are
used,
they