IPC-TM-650 EN 2022 试验方法--.pdf - 第321页

ASTM D 3386 Figure 1 T e m p e r a t u r e ( C ) A 0 B 2 0 0 Ex t e n s i o n The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M …

100%1 / 824
Figure 1 DMA Modulus Plot
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 5
Temperature
IPC-24244-1
5.1.2
Specimens
shall
be
cut
to
the
specified
size
using
appropriate
procedures
and
equipment
to
minimize
thermal
shock
and
mechanical
stress.
Method
A
specimens
shall
have
their
edges
smooth
and
burr-free
by
means
of
sanding
or
equivalent
(to
allow
the
specimen
to
rest
flat
on
the
mounting
stage).
Method
B
specimens
shall
be
rectangular,
with
their
long
edges
parallel
(to
ensure
good
mounting
in
the
film
fix¬
ture).
Method
B
specimens
shall
have
smooth
edges
without
nicks
or
tears.
5.1.3
Specimens
shall
be
preconditioned
by
baking
for
one
hour
±
1
5
minutes
at
1
05℃,
then
cooled
to
room
temperature
in
a
dessicator.
5.2
Measurement
5.2.1
Apparatus
Set-up
5.2.1.
1
Install
the
Required
DMA
Clamp
Method
A
Install
and
calibrate
the
DMA
with
a
bending
geometry
fixture/clamp.
Method
B
Install
and
calibrate
the
DMA
with
a
thin
film
fixture/clamp.
5.2.1.
2
Start
the
Experiment
Method
A
Measure
the
length,
width,
and
thickness
of
the
specimen
to
within
at
least
+0.01
mm
or
preferably
+0.005
mm.
Clamp
the
specimen
in
the
DMA
fixture.
Set
the
sample
strain
amplitude
to
operate
within
the
linear
viscoelastic
range
of
the
material.
Strains
<1
%
are
recommended
and
are
typi¬
cally
0.1
%.
Program
the
sample
temperature
range.
Enclose
the
specimen
and
fixture
in
the
environmental
chamber
(fur¬
nace).
Method
B
Measure
the
length,
width,
and
thickness
of
the
specimen
to
within
at
least
+0.01
mm
or
preferably
+0.005
mm.
Sample
lengths
of
10
mm
to
20
mm
are
typical.
Mount
the
specimen
in
the
clamps
of
the
film
fixture
according
to
the
manufacturer's
instructions.
Apply
tension
force
between
10
g
and
50
g.
A
typical
base
force
would
be
20
g
(see
6.5
for
an
explanation
of
the
load
criteria).
Enclose
the
specimen
and
probe
in
the
environmental
chamber.
5.2.1.
3
Provide
an
inert
gas
purge
(helium
or
nitrogen)
to
the
environmental
chamber.
Temperature
calibration
of
the
DMA
must
be
performed
under
the
same
gas
conditions.
5.2.2
Running
the
DMA
Temperature
Scan
5.2.2.1
Initial
Temperature
(Tinitia|)
a.
For
specimens
with
Tg
below
or
near
room
temperature,
start
the
scan
at
least
20℃
below
the
anticipated
transi¬
tion.
This
may
require
a
DMA
with
subambitent
cooling
control
of
the
environmental
chamber.
b.
For
specimens
with
Tg
greater
than
room
temperature,
start
the
scan
at
30℃.
5.2.
2.
2
Sample
Heating
and
Deformation
Rate
The
specimen
shall
be
run
at
2
℃/min
and
an
oscillation
frequency
of
1
Hz.
5.2.2.3
Temperature
Excursion
Heat
the
specimen
to
at
least
20℃
greater
than
the
Tg.
This
test
is
general
in
nature
and
data
may
be
taken
above
Tg
if
required.
There
is
no
required
upper
temperature.
5.3
Evaluation
5.3.1
The
DMA
storage
modulus
should
resemble
the
plot
shown
in
Figure
1
.
5.3.2
An
idealized
DMA
curve
has
a
linear
section
below
the
transition
(glassy
region
below
the
temperature
of
Tg)
and
a
stepwise
drop
through
the
glass
transition
region.
These
linear
sections
are
used
in
calculating
Tg
by
onset
of
the
modulus
drop
(see
Figure
1).
2.4.24.4
Glass
Transition
and
Modulus
of
Materials
Used
in
High
Density
Interconnection
(HDI)
and
Microvias
-
DMA
Method
11/98
ASTM D 3386
Figure 1
T
emperature (
C)
A
0
B
200
Extension
The Institute for Interconnecting and Packaging Electronic Circuits
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Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
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Page 1 of 2
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
test
method
establishes
a
procedure
for
determining
the
in-plane
coefficient
of
linear
thermal
expan¬
sion
of
organic
films
from
0-200℃
using
thermal
mechanical
analysis
(TMA).
2
.0
Applicable
Documents
ASTM
D
618
Standard
Practice
for
Conditioning
Plastics
and
Electrical
Insulating
Materials
for
Testing
Standard
Test
Method
for
Coefficient
of
Lin¬
ear
Thermal
Expansion
of
Electrical
Insulating
Materials
3
.0
Test
Specimen
The
test
specimen
shall
consist
of
a
strip
15-20
mm
long
and
2
mm
wide
with
a
minimum
thick¬
ness
of
1
0
pm
and
maximum
thickness
of
200
pm.
4
.0
Apparatus
or
Material
Perkin-Elmer
TMA-7
with
a
film
fixture
in
extension
mode
or
equivalent
equipment
capable
of
handling
films
less
than
25
pm
thick.
5
.0
Procedure
5.1
The
test
specimens
should
be
conditioned
at
23
土
2
℃
and
50
±
5%
relative
humidity
for
not
less
than
24
hours
prior
to
testing.
Refer
to
ASTM
D
618.
5.2
Follow
the
manufacturer's
recommendations
for
equip¬
ment
startup
and
calibration.
5.2
Mount
the
test
specimen
in
the
film
holder.
The
sample
length
(between
the
grips)
should
be
between
11-13
mm.
Refer
to
ASTM
D
3386.
5.3
Set
the
force
at
30
mN.
5.4
Perform
a
prescan
by
heating
a
rate
of
20℃/min.
Under
inert
atmosphere
from
-10℃
to
either
10℃
above
the
mate¬
rial
glass
transition
temperature,
Tg,
or
10℃
below
the
mate¬
rial
decomposition
limit,
Tmax,
determined
using
nitrogen.
Tg
may
be
determined
using
IPC
Test
Methods
2.4.24.2,
2.4.24.3,
or
2.4.25.
5.5
Hold
the
temperature
for
60
min.
Number
2.4.41.3
Subject
In-Plane
Coefficient
of
Thermal
Expansion,
Organic
Films
Date
Revision
7/95
Originating
Task
Group
Deposited
Dielectric
Task
Group
(C-13a)
5.7
Hold
the
temperature
for
10
min.
5.8
Reheat
the
specimen
at
a
rate
of
5
℃/min
to
a
maximum
temperature
of
25℃
below
the
glass
transition
temperature
of
the
polymer
or
10℃
below
the
material
decomposition
limit,
Tmax,
determined
under
nitrogen.
Ar
least
two
temperature
scans
of
the
test
specimen
should
be
conducted
without
dis¬
turbing
the
specimen
in
the
TMA
to
confirm
repeatability
of
observed
test
results.
5.9
Calculate
the
average
coefficient
of
thermal
expansion,
over
the
temperature
intervals
of
interest
as
follows:
a
二
(AUAT)/L
where
L
is
the
length
of
the
test
specimen
between
the
grips,
AL
is
the
change
in
the
length
of
the
specimen
(in
the
same
units)
over
the
temperature
interval
AT,
and
AT
is
the
tempera¬
ture
interval
(normally
200℃)
as
illustrated
in
Figure
1.
The
units
are℃-1
.
5.10
The
coefficient
of
linear
thermal
expansion
from
0
200℃
(below
the
glass
transition)
is
(Length
B
-
Length
A)
-
(Length
A)
(Temperature
B
-
Temperature
A)
5.6
Cool
at
a
rate
of
5
℃/min
to
-10℃.
Figure 4 DMA Plot for Storage Modulus, Loss Modulus, and Tan Delta on One Plot
Storage Modulus (MPa)
Loss Modulus (MPa)
Tan Delta
200
150100
500
-50
-100
10.0
100.0
1000.0
10000.0
0.90
0.75
0.60
0.45
0.30
0.15
0.0
Temperature (
˚
C)
Storage Modulus (MPa)
Tan Delta
IPC-TM-650
Number
Subject Date
Revision
Page 4 of 5
2.4.24.4
Glass
Transition
and
Modulus
of
Materials
Used
in
High
Density
Interconnection
(HDI)
and
Microvias
-
DMA
Method
11/98
and
measurement
start
and
end
points
and
computer
gener¬
ated
lines
(see
Figure
1).
5.6.2
Optionally
plot
the
storage
modulus,
loss
modulus,
and
tan
3
vs.
temperature
(
℃)
for
the
specimen
(see
Figure
4).
6
Notes
6.1
Calibration
of
the
DMA
must
be
carried
out
according
to
the
manufacturer's
instructions
for
the
relevant
sample
geom¬
etry
and
thermocouple
temperature.
6.2
There
are
several
methods
for
determining
the
Tg
of
organic
materials:
•
Differential
scanning
calorimetry
(DSC)
•TMA
•
DMA
Tg
in
organic
materials
is
a
broad
transition,
which
arises
when
molecular
mobility
greatly
increases
in
the
specimen
as
a
result
of
heating.
No
one
method
is
superior
to
another;
they
each
measure
different
physical
changes
that
occur
in
a
specimen
near
and
around
Tg.
IPC-24244-4