IPC-TM-650 EN 2022 试验方法--.pdf - 第119页
The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was vol untaril y establis hed by T echni cal Committees of the …
shall
shall
†
NOTE:
shall
shall
IPC-TM-650
Page 3 of 3
Number
2.3.2
Subject
Chemical
Resistance
of
Flexible
Printed
Board
Materials
Date
12/07
Revision
G
continuously
recorded,
and
the
recorded
load
for
the
entire
length
of
peeled
conductor
be
evaluated
by
averaging
the
chart
recording
values
for
each
segment
(immersed
and
non-immersed)
of
each
test
specimen.
A
minimum
of
57.2
mm
[approximately
2.25
in]
be
peeled
for
each
seg¬
ment,
with
the
first
6.4
mm
[approximately
0.25
in]
to
be
dis¬
regarded.
Compare
the
average
peel
strengths
of
the
immersed
segments
of
the
three
(3)
test
traces
with
those
of
the
non-immersed
segments
of
the
same
three
(3)
test
traces,
in
accordance
with
the
following
formula:
[Average
Peel
Strengths
of
three
(3)
immersed
test
trace
segments]
x
1
00
=
%
of
Originalt
[Average
Peel
Strengths
of
three
(3)
non-immersed
test
trace
segments]
Values
may
be
higher
than
100%,
which
may
indicate
chemical
absorption.
5.2
Method
B
-
Bare
Dielectric
5.2.1
Test
Specimen
Preparation
Cut
twelve
(12)
test
specimens,
as
per
3.2.
This
allows
for
at
least
one
full
repeti¬
tion
of
tests,
if
needed.
5.2.2
Conditioning
Condition
each
specimen
for
24
hours
at
23
±
2
[73.4
°F
土
3.6
°F]
and
50%
土
5%
relative
humidity
prior
to
testing.
5.2.3
Test
Procedure
5.2.3.
1
Sequential
Chemical
Exposure
Test
Fully
immerse
three
(3)
test
specimens
for
one
minute
[+10
seconds/-。
seconds]
into
each
of
the
specified
chemicals
on
a
sequential
basis.
After
immersion
in
each
chemical,
rinse
the
specimen
in
the
appropriate
dedicated
immersion
DI
water
rinse
which
is
maintained
at
55
±
5
[131
°F
±
9
°F]
for
one
(1)
minute
minimum
and
five
(5)
minutes
maximum.
Use
the
sequence
as
follows:
1.
Etchant
Solution
2.
Dedicated
Etchant
DI
Immersion
Rinse
3.
Stripper
Solution
4.
Dedicated
Stripper
DI
Immersion
Rinse
5.
Acid
Cleaner
6.
Dedicated
Acid
Cleaner
DI
Immersion
Rinse
7.
Organic
Cleaner
8.
Dedicated
Organic
Cleaner
DI
Immersion
Rinse
Within
fifteen
(15)
to
thirty
(30)
minutes
after
completion
of
the
sequential
chemical
exposure,
observe
for
tackiness,
blister¬
ing,
bubbles,
delamination,
or
swelling
within
the
dielectric
or
change
in
color
of
dielectric.
After
sixteen
(16)
to
twenty-four
(24)
hours,
repeat
the
observations
and
determine
the
tensile
strength
and
elongation
using
the
procedure
as
described
in
IPC-TM-650,
Method
2.4.18.3.
5.2.4
Data
Evaluation
Record
and
report
all
discrepancies
noted
during
the
observation
periods.
The
evaluation
is
con¬
sidered
to
have
passed
when
the
immersed
specimens
meet
or
exceed
the
minimum
tensile
strength
and
elongation
requirements
for
the
material
under
test.
If
the
immersed
test
specimens
do
not
pass,
then
the
non-immersed
specimens
be
tested
for
both
tensile
strength
and
elongation
to
verify
that
these
parameters
pass
the
requirements
for
the
material
under
test.
If
the
non-immersed
test
specimens
do
not
pass,
then
the
lot
of
bare
dielectric,
represented
by
the
test
specimens,
be
rejected.
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
test
method
is
used
for
determining
that
marking
inks
and/or
color
coding
will
not
become
illegible
or
discolored
when
subjected
to
solutions
that
are
normally
used
as
cleaning
agents
for
printed
boards
or
printed
board
assem¬
blies.
2
.0
Applicable
Documents
None
3
.0
Test
Specimens
Test
specimens
may
consist
of
test
coupons
or
production
printed
boards
with
the
appropriate
markings.
The
amount
or
size
of
the
marking
on
the
test
specimen
shall
be
sufficient
enough
to
satisfactorily
perform
the
procedure
of
section
5.
4
.0
Apparatus
or
Material
4.1
Vessel
for
each
solution
used.
4.2
Toothbrush
or
suitable
applicator
for
each
solution
used.
4.3
Optical
Aid
capable
of
a
3X
magnification.
4.4
Solution
A:
Mixture
of
one
part
isopropyl
alcohol
and
three
parts
by
volume
of
mineral
spirits
at
25
±
5
℃.
4.5
Solution
B:
Terpene
defluxer
consisting
of
a
minimum
of
90%
d-limonene
and
1
0%
surfactant
at
25
±
5
℃.
4.6
Solution
C:
Mixture
of
42
parts
by
volume
of
water
(1
megohm
resistivity),
one
part
by
volume
of
propylene
glycol
monmethyl
ether,
and
one
part
by
volume
of
monoethanola¬
mine
at
63
to
70℃.
5
.0
Procedure
5.1
The
following
procedure
shall
be
using
solutions
A,
B,
and
C
individually.
Number
2.3.4
Subject
Chemical
Resistance,
Marking
Paints
and
Inks
Date
Revision
8/97
B
Originating
Task
Group
Rigid
Board
T.M.
Task
Group,
7-1
1d
5.1.2
The
test
specimens
shall
be
removed
from
the
vessel
and
with
a
toothbrush
(wetted
with
solution)
the
specimen
shall
be
brushed
for
a
minimum
of
10
strokes
on
the
area
where
the
marking
is
present.
5.1.3
Steps
5.1.1
and
5.1.2
shall
be
repeated
on
the
test
specimen
two
additional
times.
5.1.4
After
the
third
submersion
and
brushing,
the
test
specimens
shall
be
air
or
blown
dry.
5.1.5
The
test
specimens
shall
be
evaluated
in
accordance
with
5.2.
5.2
Evaluation
After
the
test
has
been
performed,
the
test
specimens
shall
be
examined
for
any
markings
that
are
miss¬
ing
in
whole
or
part,
faded,
smeared,
blurred
or
shifted
to
the
extent
that
they
cannot
be
identified
from
a
distance
of
150
mm
[6.0
in]
or
by
examining
with
a
optical
aid
using
a
magni¬
fication
of
no
more
than
3X
shall
constitute
a
failure.
6
.0
Notes
6.1
If
test
solutions
other
than
those
described
herein
are
to
be
used,
then
the
solutions
should
be
agreed
upon
between
the
vendor
and
customer
prior
to
testing.
6.2
The
three
solutions
being
used
to
perform
this
test
exhibit
some
potential
for
health
and
safety
hazards.
Safety
precautions
shall
be
observed.
6.3
It
is
the
intent
of
this
test
method
to
subject
a
different
set
of
test
samples
to
each
test
solutions.
It
is
at
the
option
of
the
tester
to
subject
the
samples
through
the
test
solutions
consecutively.
If
the
samples
fail
after
consecutive
solutions
the
test
should
be
performed
with
individual
test
solutions.
5.1.1
The
test
specimens
shall
be
submerged
for
a
mini¬
mum
of
3
minutes
(+
.5
minutes/
-
0.0
minutes)
in
a
vessel
containing
the
solution.
IPC-TM-650
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 4
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
method
is
designed
to
evaluate
the
resis¬
tance
of
dielectric
materials
to
organic
chemicals
representa¬
tive
of
those
used
in
printed
board
fabrication
and
assembly.
It
is
intended
to
provide
a
distinction
between
materials
of
varying
chemical
resistance
and,
when
applicable,
an
indica¬
tion
of
the
degree
of
cure.
2
.0
Applicable
Documents
Method
2.2.18,
Determination
of
Thickness
of
Laminates
by
Mechanical
Measurement
Weast,
R.C.,
ORC
Handbook
of
Chemistry
and
Physics,
65th
Edition,
E-37,
1984
3
.0
Test
Specimens
3.1
Number
Unless
otherwise
specified,
three
specimens
shall
be
used.
3.2
Size
Unless
otherwise
specified,
specimen
shall
be
50.8
x
50.8
mm
±
0.5
mm
[2.0
x
2.0
±
0.02
in]
by
the
thick¬
ness
of
the
material
(see
5.1
,
Preparation).
Edges
shall
be
smooth,
whether
by
the
cutting
procedure,
or
by
sanding,
or
other
means.
3.3
Location
Specimen
may
be
cut
from
anywhere
in
the
sheet
of
material,
except
no
specimens
shall
be
taken
closer
than
25.4
mm
[1.0
in]
from
any
edge
as
laminated.
4
.0
Apparatus
or
Material
4.1
Analytical
balance
with
a
draft
shield
and
.001
gram
or
better
resolution.
4.2
Air
circulating
oven,
capable
of
1
05
±
2
℃
[221
±
3.6°F].
4.3
Desiccator
capable
of
maintaining
an
atmosphere
of
less
than
30%
relative
humidity
at
23℃
[73°F].
See
6.2.5
4.4
Cutting
apparatus
such
as
diamond
saw,
shear
paper
cutter
or
router.
4.5
Edge
smoothing
apparatus
such
as
400
grit
or
finer
sandpaper.
Number
2.3.4.2
Subject
Chemical
Resistance
of
Laminates,
Prepreg,
and
Coated
Foil
Products,
by
Solvent
Exposure
Date
Revision
12/94
A
Originating
Task
Group
MIL-P-13949
Test
Methods
Task
Group
(7-1
1b)
4.6
One
liter
battery
jar,
with
cover.
4.7
Metal
tongs
or
forceps.
4.8
Metal
rack
(to
support
specimens
vertically).
4.9
Metal
support
(e.g.,
mounting
clip
used
for
microsec¬
tioning).
4.10
Laminating
press
capable
of
the
specified
temperature
and
pressure.
4.1
1
Timer:
1
hour
with
1
second
resolution.
4.12
Timer:
60
seconds,
1
second
resolution.
4.13
Solvent:
Methylene
Chloride,
Reagent
Grade
or
HPLC
Grade.
MC
recovered
by
distillation
back
to
reagent
grade
may
be
used.
HPLC
Grade
shall
be
used
for
referee
pur¬
poses.
4.14
Prepreg
(for
single
sided
laminate
and
coated
foil
test
only).
4.15
Copper
foil,
1
oz./ft2
treated
(for
prepreg
tests
only).
4.16
Ventilation
hood
4.17
Micrometer,
capable
of
measuring
to
within
0.025
mm
[0.001
in]
4.18
Water
bath
at
23
±
0.5℃
[73
±
0.9°F]-
4.19
Thermometer
capable
of
measuring
to
within
0.1
resolution.
4.20
Etching
system
capable
of
metallic
cladding
removal.
5
.0
Procedure
5.1
Sample
Preparation
5.1.1
Single-sided
Laminate
Single-sided
laminate
less
than
0.5
mm
[0.020
in]
shall
be
laminated
together
with
the
clad
surfaces
facing
out.
Two
plies
minimum
of
prepreg
shall
be
used.
The
prepreg
shall
be
of
the
same
basic
resin
type