IPC-TM-650 EN 2022 试验方法--.pdf - 第412页

IPC-2-4-53-22 1 A a b B C D E F G H J K L M N O P Q R T U V W 2 3 4 5 6 7 8 9 10 11 12 13 14 1 5 16 17 18 19 20 Number 2.4.53 Subject Dye and Pull Test Method (Formerly Known as Dye and Pry) Date 8/2017 Revision Page 1 1…

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IPC-2-4-53-21
B
A
= 0 %
= 1 to 25 %
= 26 to 50 %
= 51 to 75 %
= 76 to 100 %
B
C
D
E
C D E
1
A X
X X
X
B
C
D
E
F
G
H
J
K
L
M
N
O
P
Q
R
T
U
V
W
2 3 4 5 6 7 8 9 10 11 12 13
2B 4B 3D
3D
2D
3E
3B
3B
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2B
14 15 16 17 18 19 20
Number
2.4.53
Subject
Dye and Pull Test Method (Formerly Known as Dye and Pry)
Date
8/2017
Revision
Page 10 of 11
IPC-TM-650
―
Figure
21
Example
of
Dye
and
Pull
Location
Type
Coverage
Mapping
IPC-2-4-53-22
1
A
a
b
B
C
D
E
F
G
H
J
K
L
M
N
O
P
Q
R
T
U
V
W
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Number
2.4.53
Subject
Dye and Pull Test Method (Formerly Known as Dye and Pry)
Date
8/2017
Revision
Page 11 of 11
IPC-TM-650
—
Complete
dye
indication
Partial
dye
indication
Partial
dye
indication
at
two
interfaces
Complete
dye
indications
at
two
interfaces
Partial
and
complete
dye
indication
at
two
interfaces
No
dye
indication
Separation
between
board
laminate
and
board
pad
Separation
between
solder
and
board
pad
Separation
through
solder
joint
Separation
between
solder
and
component
pad
Separation
between
component
substrate
and
component
pad
Other
=
Double
separation
between
board
laminate/board
pad
and
solder/board
pad
Figure
22
Second
Example
of
Dye
and
Pull
Location
Type
Coverage
Mapping
a.
Dye
indication
type
b.
Separation
mode
Note:
The
style
of
mapping
in
Figure
22
depicts
every
solder
joint
within
the
component
by
a
color-coding
system.
Dye
indications
are
then
additionally
indicated
by
a
red
slash
or
"X"
at
each
joint
location
as
needed.
Mapping
components
in
this
manner
allows
for
quick
evaluation
of
the
weakest
interface
of
every
solder
joint
and
the
location
of
any
dye
indications.
Number
Subject
Date Revision
Originating Task Group
MaterialinthisTestMethodsManualwasvoluntarilyestablishedbyTechnicalCommitteesofIPC.Thismaterialisadvisoryonly
anditsuseoradaptationisentirelyvoluntary.IPCdisclaimsallliabilityofanykindastotheuse,application,oradaptationofthis
material.Usersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsorliabilitiesforpatientinfringement.
EquipmentreferencedisfortheconvenienceoftheuseranddoesnotimplyendorsementbyIPC.
3000 Lakeside Drive, Suite 105 N
Bannockburn, Illinois 60015-1249
IPC-TM-650
TEST METHODS MANUAL
Page 1 of 7
2.4.54
09/2022 N/A
D-33AAIPC-6012AutomotiveAddendumTaskGroup
TestMethodforThermalTransmissionPropertiesof
MetalBasedPrintedBoards(MBPB)
1 Scope
1.1
The scope of the test method is to describe a procedure for measurement of thermal resistance and calculation of an apparent
thermal conductivity for single layer Metal Based Printed Boards (MBPB). This test method has been created to address the
issue of measurement uncertainty for materials with low thermal resistance (high thermal conductivity and/or thin thicknesses).
1.2
Precise measured values of thermal resistance are very important, for multiple applications, especially within automotive
sector, but also in other areas. For materials with a low thermal resistance, the measurement uncertainty increases significantly
when using the steady state measuring method. The target for this test method is to provide good repeatability and reproducibility
in the test result. A certified reference material must be used to guarantee the measurement quality.
The test method shall show a validity of different thermal resistance values represented by different thicknesses and materials
used for the MBPB. The test method shall also describe a reliable thickness measurement.
1.3 Terms and Definitions
Other than those terms listed below, the definitions of terms used in this test method are in accordance
with IPC-T-50.
1.3.1 Thermal Conductivity
Thermalconductivityapplies inthis caseto the bulk valueofthe metallayers(λ
base
orλ
top
see
Table1Equations12and13)orthealuminumbarsforhotorcoldside(λ
h
orλ
c
see Table 1 Equations 1 and 2) and the dielectric
materialfilledwithoxideparticlesofdifferentkindoffillerdegree(λ
die
) (Figure 5).
1.3.2 Apparent Thermal Conductivity
Apparent thermal conductivity includes the bulk thermal conductivity of the dielectric
material filled with oxide particles, the treatment or adhesive layer and the thermal contact resistances (see 1.3.5) to the upper
andlowermetallayers(λ
app.,die
see Table 1 Equation 16).
1.3.3 Total Thermal Resistance
Total thermal resistance R
th,total
applies to the measured thermal resistance of the MBPB and the
contact liquid (R
th,total
see Table 1 Equation 10).
1.3.4 Apparent Thermal Resistance Specimen
Apparent thermal resistance specimen R
th, app,specimen
applies to the measured thermal
resistance of the MBPB. This has an upper and lower metal layer. In-between it has a dielectric layer with the two contact
resistances to the metal layers (R
th, app,specimen
see Table 1 Equation 11).
1.3.5 Thermal Contact Resistance
Thermal contact resistance applies to a contact phenomenon between two bodies. A contact
resistance can arise due to suboptimal surface wetting, high surface roughness or influenced heat flow density at the boundary
layer due to the following parameters: the filler concentration, particle percolation path, particle distribution and particle size.
This contact resistance leads to a variance in measurement results.
1.3.6 Surface Area
Surface area is calculated from the diameter of the meter bars in the dimension mm².
1.4
Technical safety requirements are not defined in this test method. The user must take measures to fulfil all statutory health,
safety and environmental protection requirements.
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