IPC-TM-650 EN 2022 试验方法--.pdf - 第770页

t1 186 ± 15 – Target pre heat time t2 239 ± 10 – Target peak r eflow time t3 292 ± 15 – Target cool-d own start ti me t3 - t 1 106 ± 30 – Target time above T1 T1 – 203 Maximum preheat temperature T2 – 230 ± 5 Ta rget ref…

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IPC-2627-5-1
Number
2.6.27
Subject
Thermal Stress, Convection Reflow Assembly Simulation
Date
2/2020
Revision
B
IPC-TM-650
260
Reflow
Profile
Specifications
Figure
5-1
260
Nominal
Reflow
Profile
Chart
(Default)*
6
o
JnlB-l
Q
dE
Page
4
of
10
t1 186 ± 15 – Target preheat time
t2 239 ± 10 – Target peak reflow time
t3 292 ± 15 – Target cool-down start time
t3 - t1 106 ± 30 – Target time above T1
T1 – 203 Maximum preheat temperature
T2 – 230 ± 5 Target reflow temperature
A 0 30
Upper specification limit values
B 88 203
C 172 203
D 226 235
E 252 235
F 305 203
G 487 30
H 30 30
Lower specification limit values
I 139 83
J 199 203
K 230 225
L 248 225
M 279 203
N 339 30
A-B & I-J 2.0 Maximum preheat rate
H-I 0.5 Minimum preheat rate
F-G -1.0 Minimum cool-down rate
M-N -3.0 Maximum cool-down rate
Number
2.6.27
Subject
Thermal Stress, Convection Reflow Assembly Simulation
Date
2/2020
Revision
B
IPC-TM-650
—
Table
5-2
230
Nominal
Reflow
Profile
Specifications
(Low
Temperature
Profile)*
Value
Time
(Seconds)
Temperature
(
℃)
Description
Point
Time
(Seconds)
Temperature
(
℃)
Description
Segment
Slope
(
℃
/
second)
Description
Page
5
of
10
IPC-2627-5-2
Number
2.6.27
Subject
Thermal Stress, Convection Reflow Assembly Simulation
Date
2/2020
Revision
B
230
Reflow
Profile
Specifications
Figure
5-2
230
Nominal
Reflow
Profile
Chart
(Low
Temperature
Profile)*
IPC-TM-650
—
(9)
dE
Page
6
of
10