IPC-TM-650 EN 2022 试验方法--.pdf - 第678页

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100%1 / 824
IPC-J-STD-004
IPC-A-600
GR-78-CORE
ASTM D-257
IPC-A-25A
IPC-A-50
Figure 1
Figure 2
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
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Page 1 of 3
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ASSOCIATION
CONNECTING
/
ELECTRONICS
INDUSTRIES
®
221
5
Sanders
Road
Northbrook,
IL
60062-6135
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
method
is
used
to
characterize
the
effects
of
flux
residues
on
electrical
performance
by
determin¬
ing
the
degradation
of
electrical
insulation
resistance
under
conditions
of
high
temperature
and
humidity.
This
method,
in
conjunction
with
the
supporting
documenta¬
tion
in
IPC-J-STD-004,
is
intended
to
be
equivalent
to
Telcor¬
dia
Technologies
GR-78-CORE,
Section
13.1,
(Corrosiveness
of
Soldering
Fluxes)
and
is
used
primarily
by
telecommunica¬
tions
companies
to
qualify
the
candidate
flux
or
solder
paste.
2
Applicable
Documents
Requirements
for
Soldering
Fluxes
Acceptability
of
Printed
Board
Physical
Design
and
Manufacture
of
Telecom¬
munications
Product
-
Telcordia
Technologies
(Formerly
Bellcore)
Standard
Test
Methods
for
DC
Resistance
or
Conductance
of
Insulating
Materials
2.1
Master
Drawings
Telcordia
Technologies
Test
Pattern
(GR-78-CORE,
Figures
14.1
and
14.2)
Multipurpose
1
-sided
Test
Pattern
Surface
Insulation
Resistance
Phoenix
Board
3
Test
Specimens
The
test
specimens
for
this
test
method
may
be
either
of
the
interdigitated
comb
pattern
shown
in
Fig¬
ures
1
or
2.
These
test
patterns
can
be
produced
in
a
number
of
formats.
Both
of
these
patterns
can
be
found
on
the
IPC-B-50
Stan¬
dard
Test
Board.
The
pattern
shown
in
Figure
2
can
be
found
on
the
IPC-B-25A
test
board
(pattern
D).
Artwork
for
manu¬
facturing
these
boards
is
available
through
the
master
draw¬
ings
listed
in
2.1.
Contact
IPG
for
a
listing
of
vendors
provid¬
ing
prefabricated
test
boards.
The
comb
pattern
in
Figure
1
has
0.65
mm
[0.025
in]
lines
and
1
.27
mm
[0.050
in]
spacings.
This
test
pattern
is
also
com¬
monly
referred
to
as
the
Bellcore
pattern.
The
comb
pattern
in
Figure
2
has
0.32
mm
[0.0125
in]
lines
and
spaces
(see
Note
6.4).
Number
2.6.3.6
Subject
Surface
Insulation
Resistance
-
Fluxes
-
Telecommunications
Date
Revision
01/04
Originating
Task
Group
Surface
Insulation
Resistance
Task
Group,
5-32b
IPC
3491 Eagle Way
Chicago, IL 60678-1349
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn
IL. 60015 1249
Tel: 847-615
7100
Fax: 847-615
7105
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