IPC-TM-650 EN 2022 试验方法--.pdf - 第362页

Figure 1 Laminate Dielectric The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was voluntarily establis hed by T e…

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IPC-TM-650
Number Subject Date
Revision
Page 2 of 7
2.4.54
TestMethodforThermalTransmissionPropertiesof
09/2022
MetalBasedPrintedBoards(MBPB)
N/A
2 Applicable Documents
2.1 IPC Documents
1
IPC-4101C
Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-TM-650
Test Methods Manual
2.1.1 Microsectioning, Manual and Semi or Automatic
2.1.1.2 Microsectioning—Semi or Automatic Technique Microsection Equipment
2.2 International Organization of Legal Metrology
2
OIMLG14
Density measurement
2.3 ASTM
3
ASTME1461
Standard Test Method for Thermal Diffusivity by the Flash Method
ASTME1269
Standard Test Method for Determining Specific Heat Capacity by Differential Scanning Calorimetry
3 Test Specimens
3.1
The sample thickness can be measured within the machine or before and after measurement. In both cases the accuracy
should be smaller than 10 µm.
3.2
Prepare specimens from its original, treated or aged condition. Clean the surfaces from any kind of dirt. The solvents
have to be chosen carefully as possible adverse reactions with the surface of the sample could occur (see IPC-TM-650
Test Method 2.1.1).
3.3
The specimen has to be manufactured e.g., by milling or other kind of processing. Remove burrs and flashes on the edge
of the specimen.
3.4
Create three specimens from one raw laminate panel. Ensure a distance from the border of about 50 mm to avoid tolerance
deviations of the dielectric material.
3.5
Ensure that the surface of the specimen is free of scratches, waviness or any kind of damage. Photos should be included
into the test report.
4 Apparatus or Material
4.1
Figures 1 and 3 shows parts for an apparatus, which fulfills the requirements for this test method.
4.2
Ensure that the surfaces of the aluminum bars are free from scratches or other damages. The surface has to be smooth
(Ra≤1µm).
4.3
Use a method to measure the total thickness of the specimen like contactless with laser, LED detector or before and after
measurement with a micrometer screw according to IPC-4101C.
4.4
Use insulated heat flow meter bars on both sides, hot and cold in order to prevent heat losses to the environment and thus
improve the measurement accuracy.
4.5
Due to the forced heat flow, the apparatus needs both a heat as well as a cooling source. There are several options for
heating and cooling. The recommended method of heating is the usage of an electrical heater which is embedded in a copper
block. Other options can be liquid heaters. Regardless of the method. It is important to use constant temperatures at heat and
cooling side.
4.6
The heat flow meter bars of the apparatus need to be constructed out of well-known and thermally characterized (see
ASTM E1461 for thermal diffusivity, ASTM E1269 for specific heat capacity, and OIML G 14 for density) material in the
1 www.ipc.org
2 www.oiml.org
3 www.astm.org
―
Figure 1 Laminate Dielectric
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
method
is
used
to
determine
the
inner
layer
bond
strength
of
either
a
metal
conductor
or
an
individual
dielectric.
2
Applicable
Documents
None
3
Test
Specimen
Laminate
dielectric
with
or
without
cop¬
per
foil,
prepared
in
accordance
with
Figure
1
.
4
Equipment/Apparatus
4.1
Unite-O-Matic
tensile
tester
Model
#FM
10
or
equivalent
4.2
Scalpel
5
Procedure
Number
2.4.40
Subject
Inner
Layer
Bond
Strength
of
Multilayer
Printed
Circuit
Boards
Date
Revision
10/87
Originating
Task
Group
N/A
release
sheets
that
will
disallow
lamination
at
one
end
of
each
specimen,
providing
a
13
mm
x
25
mm
non-bonded
tab.
The
tabs
can
then
be
used
as
gripping
areas
to
perform
bond
strength
testing.
One
can
then
evaluate
the
laminate-to-
laminate
bonds
and
the
laminate-to-copper
foil
bond
through¬
out
the
finished
panel
thickness.
5.1.1
Place
an
equal
number
of
release
sheets
on
the
outer
surface
of
the
layup,
covering
all
surfaces,
except
where
inter¬
nal
release
sheets
have
been
placed.
This
is
essential
to
pro¬
vide
proper
and
uniform
lamination
pressure.
5.1.2
After
lamination
and
cure,
cut
the
panel
into
25
mm
strips,
as
shown
in
Figure
1
,
and
remove
internal
release
sheets.
5.1.3
If
steps
5.1.1
and
5.1
.2
are
not
used,
it
will
be
neces¬
sary
to
chemically
or
thermally
remove
resins
from
the
outer
25
mm,
in
order
to
provide
a
tab
to
initiate
testing.
5.2
After
cutting
the
samples
to
the
designated
size
and
lift¬
ing
the
25
mm
strip
for
testing,
the
layer
to
be
tested
shall
be
fastened
into
the
clamping
device
of
the
tensile
tester,
allow¬
ing
the
wire
connecting
the
clamp
to
the
tensile
tester
to
pull
the
specimen
vertically
within
±
5°
angle.
5.3
The
tester
is
then
started.
A
force
is
applied
in
the
verti¬
cal
direction
at
a
rate
of
51
mm
per
minute
until
delamination
(bond
strength)
is
completed
or
the
inner
layer
tears.
The
minimum
load
is
then
recorded
using
the
following
for¬
mula:
Bond
strength
of
the
conductor
width
二
25mm
sample
width
x
total
load
5.1
Preparation
for
Testing
During
layup
of
the
test
specimen
panel,
place
llTEDLAR"
(or
other
suitable
material)
ASTM D-618
ASTM-D-696
Note 1—
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 3
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
1.1
This
method
covers
determination
of
the
coefficient
of
linear
thermal
expansion
of
electrical
insulating
materials1
by
use
of
a
thermomechanical
analyzer.
1
.2
This
method
is
applicable
to
materials
that
are
solid
over
the
entire
range
of
temperature
used,
and
that
retain
sufficient
hardness
and
rigidity
over
the
temperature
range
so
that
irre¬
versible
indentation
of
the
specimen
by
the
sensing
probe
does
not
occur.
1.3
Transition
temperatures
also
may
be
obtained
by
this
method.
2
.0
Applicable
Documents
Conditioning
Plastics
and
Electrical
Insulating
Materials
for
Testing2
Test
for
Coefficient
of
Linear
Thermal
Expan¬
sion
of
Plastics3
3
.0
Summary
of
Method
3.1
This
method
used
a
thermomechanical
analyzer
with
an
X-Y
recorder
to
graph
the
change
of
dimension
as
a
function
of
temperature
of
a
small
specimen
of
a
solid
electrical
insu¬
lating
material.
Coefficients
of
linear
thermal
expansion
can
be
calculated
from
the
graph.
Other
thermal
observations
may
also
be
made.
-Other
rapid
thermal
analysis
methods
are
being
studied
by
ASTM
Subcommittees
D09.17
and
D20.30.
4
.0
Significance
4.1
Measurements
of
coefficient
of
linear
thermal
expansion
are
useful
in
evaluating
the
suitability
of
solid
insulating
mate¬
rials
for
use
in
combination
with
other
materials
where
mechanical
stresses
may
develop
as
a
result
of
differences
in
coefficients.
Number
2.4.41
Subject
Coefficient
of
Linear
Thermal
Expansion
of
Electrical
Insulating
Materials1
Date
Revision
3/86
Originating
Task
Group
N/A
4.2
This
method
may
be
compared
with
Method
D-696,
but
tests
made
with
this
method
use
much
smaller
specimens.
This
eliminates
the
need
for
large
liquid
baths
and
greatly
reduces
the
time
required
to
reach
temperature
equilibrium.
As
a
result,
the
time
required
for
making
a
test
is
less
than
for
Method
D-696,
and
the
method
can
conveniently
be
used
over
a
wider
temperature
range
than
for
Method
D-696.
5
.0
Apparatus
5.1
The
thermomechanical
analyzer
shall
include:
5.1.1
A
specimen
holder
and
probe,
into
which
the
speci¬
men
can
be
placed.
Changes
in
height
of
the
specimen
are
sensed
by
movement
of
the
probe.
The
shape
and
size
of
the
probe
shall
be
such
that
for
the
material
tested
the
load
applied
to
the
specimen
by
the
probe
shall
not
cause
inden¬
tation
of
the
specimen
within
the
range
of
temperatures
of
interest.
5.1.2
Means
for
sensing
movement
of
the
probe
resulting
from
changes
in
height
of
the
specimen
and
for
translating
these
movements
into
a
signal
suitable
for
input
to
the
recorder.
The
sensing
element
should
be
capable
of
produc¬
ing
a
movement
of
the
recorder
pen
of
at
least
1
000
times
the
change
in
height
of
the
test
specimen,
with
provisions
for
less
sensitive
ranges
when
needed.
5.1.3
Means
for
uniformly
heating
the
specimen
holder
at
a
predetermined
rate
over
the
range
of
temperatures
of
interest.
This
will
consist
of
a
furnace
and
temperature
controller
with
provisions
for
precooking
the
furnace
and
specimen
holder
when
measurements
at
subambient
temperatures
are
to
be
made.
5.1.4
Means
for
measuring
temperature
in
immediate
prox¬
imity
to
the
test
specimen.
5.1.5
An
X-Y
recorder
for
recording
changes
in
specimen
height
as
a
function
of
specimen
temperature.
1
.
This
method
is
under
the
jurisdiction
of
ASTM
Committee
D-9
on
Electrical
Insulating
Materials
and
is
the
direct
responsibility
of
Subcommittee
D09.01
on
Electri¬
cal
Insulating
Varnishes,
Powders,
and
Encapsulating
Compounds.
2.
Annual
Book
of
ASTM
Standards,
Part
39.
3.
Annual
Book
of
ASTM
Standards,
Part
35.