IPC-TM-650 EN 2022 试验方法--.pdf - 第432页
Figure 1 IPC-TM-650 Number Subject Date Revision Page 4 of 4 12/87 2.5.5.3 Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method) 7.1 Report the minimum, maximum and…
IPC-TM-650
Number
Subject Date
Revision
Page 3 of 4
2.5.5.3
Permittivity
(Dielectric
Constant)
and
Loss
Tangent
(Dissipation
Factor)
of
Materials
(Two
Fluid
Cell
Method)
12/87
C
5.4.2
Record
the
capacitance
of
the
air
filled
cell
as
g
to
the
nearest
.01
pf
(or
nearest
.001
pf
if
the
0-20
pf
scale
is
used).
5.4.3
Remove
the
specimen
from
the
humidity
controlled
environment.
5.4.4
Insert
the
first
specimen
to
be
tested
with
the
marked
corner
remaining
in
the
upper
left
and
the
right
side
of
the
test
specimen
against
one
side
of
the
test
cell.
Note:
This
will
ensure
that
subsequent
measurements
are
taken
using
the
same
area
of
the
specimen.
5.4.5
Read
and
record
the
value
of
capacitance
with
the
specimen
in
the
cell
as
C3.
5.4.6
Remove
the
first
specimen
and
obtain
C3
for
any
other
specimens
to
be
measured
with
same
cell
spacing.
5.4.7
After
removing
the
last
specimen
from
the
cell,
fill
the
cell
with
Dow
Corning
200
Fluid
using
the
funnel
and
a
filter
to
remove
any
small
particles
from
the
fluid
and
collect
any
excess
fluid
from
the
overflow
pipe
on
the
cell
with
the
small
beaker.
5.4.8
Allow
a
few
seconds
for
the
temperature
of
the
cell
and
fluid
to
equilibrate
and
record
the
capacitance
of
the
liq¬
uid
filled
cell
as
C2.
Note:
If
the
capacitance
is
drifting
consistently
in
one
direc¬
tion,
the
fluid
is
not
at
equilibrium.
5.4.9
Record
the
conductance
of
the
fluid
filled
as
cell
.
Note:
The
value
obtained
will
vary
somewhat
with
cell
spacing
and
humidity
but
should
not
exceed
500
microsiemen
(200
microsiemen
if
low
loss
material,
with
a
loss
tangent
under
.001
is
being
tested).
Values
beyond
this
are
generally
indica¬
tive
of
problems
with
the
leads,
contamination
of
the
fluid
or
bridge
error
and
must
be
corrected
if
correct
dissipation
fac¬
tor
is
to
be
determined.
5.4.10
Insert
the
first
specimen
in
the
fluid
filled
cell
exactly
as
in
the
dry
reading
and
record
the
value
of
the
capacitance
as
C4
and
the
value
of
the
conductance
as
G2-
Note:
Values
should
stabilize
within
a
few
seconds
after
speci¬
men
insertion.
If
they
do
not
there
is
very
likely
air
trapped
in
the
cell.
This
is
quite
common
if
multiple
thin
specimens
are
used
to
form
one
test
specimen.
If
this
occurs
presoaking
the
specimen
with
fluid
before
immersion
and
inserting
one
ply
at
a
time
should
eliminate
the
problem.
5.4.11
Remove
the
first
specimen
and
insert
each
subse¬
quent
specimen
in
the
same
order
as
the
dry
values
were
obtained
and
record
the
C4
and
G2
values
for
each.
5.4.12
After
the
last
specimen
is
measured
and
removed
from
fluid,
check
and
record
the
values
of
the
capacitance
and
conductance.
Note:
If
the
level
of
the
fluid
with
the
specimen
removed
does
not
cover
the
electrodes,
fill
the
cell
before
checking
the
final
values.
This
check
on
C2
will
be
used
to
verify
the
amount
of
influence
that
changes
in
ambient
temperature
have
had
on
the
values
obtained.
6
.0
Calculation
6.1
Calculate
the
value
of
the
permittivity
(dielectric
constant)
of
each
specimen
tested
using
the
equation:
Round
the
value
obtained
to
the
nearest
.01.
ci/
1
.00058
/L
(C3-C1) (C2-C1)
C4
(
+
(03-01)04-(04-02)
03
6.2
Calculate
the
value
of
the
loss
tangent
(dissipation
fac¬
tor)
of
each
specimen
tested
using
the
equation:
=
6.2832
C4
+
(
C4-C2
)
(
6.2832
C4
-
6.2832
C2)
Round
the
value
to
the
nearest
.0001
.
Note:
Values
should
be
calculated
using
a
computer
and
must
not
be
rounded
prematurely.
6.3
If
the
value
of
C2
changed
during
the
course
of
the
mea¬
surements,
use
the
final
values
of
C2
and
G2>
the
value
of
，
and
the
values
on
the
last
specimen
for
C3
and
C4
to
recalcu¬
late
the
DK
and
Df
of
the
final
specimen.
If
the
difference
in
DK
values
is
significant,
the
temperature
of
the
cell
must
be
con¬
trolled
more
precisely
during
the
measurement
period.
6.4
Calculate
the
average
permittivity
(dielectric
constant)
(if
more
than
one
specimen
was
tested).
6.5
Calculate
the
average
loss
tangent
(dissipation
factor)
(if
more
than
one
specimen
was
tested).
7
.0
Report
Figure 1
IPC-TM-650
Number
Subject Date
Revision
Page 4 of 4
12/87
2.5.5.3
Permittivity
(Dielectric
Constant)
and
Loss
Tangent
(Dissipation
Factor)
of
Materials
(Two
Fluid
Cell
Method)
7.1
Report
the
minimum,
maximum
and
average
values
of
the
permittivity
(dielectric
constant).
7.2
Report
the
average
value
of
the
loss
tangent
(dissipation
factor).
7.3
Report
the
specimen
preconditioning,
e.g.,
C-24/23/50.
7.4
Report
the
actual
test
conditions
for
temperature
and
humidity.
7.5
Report
if
the
specimen
was
built
up.
7.6
Report
the
approximate
cell
spacing.
7.7
Report
any
anomalies
in
the
test
or
variations
from
the
prescribed
procedures
or
tolerances.
B. Gore, J. Loyer, R. Mellitz, M. Gaudion, J. Burnikell, P.
Carre, ‘‘Towards a PB Production Floor Metric for Go/No Go
Testing of Lossy High Speed Transmission Lines,’’ from IPC
Expo 2008.
A. Deutsch, G. Arjavalingam, and G. Kopcsay, ‘‘Characteriza-
tion of Resistive Transmission Lines by Short Pulse Propaga-
tion,’’ in IEEE Microwave and Guided Wave Letters, vol. 2,
no.1, January 1992.
A. Deutsch, G. Arjavalingam, G. Kopcsay, and M. Deger-
strom, ‘‘Short-Pulse Propagation Technique for Characteriz-
ing Resistive Package Interconnections,’’ in IEEE Transactions
on Components, Hybrids, and Manufacturing Technology, vol.
15, no. 6, December 1992.
A. Deutsch, T. M. Winkel, G. Kopcsay, C. Surovic, B. Rubin,
G. Katopis, B. Chamberlin, R. Krabbenhoft, ‘‘Extraction of ε
r
(f)
and tanδ(f) for Printed Circuit Board Insulators Up to 30 GHz
Using the Short Pulse Propagation Technique’’ in IEEE Trans-
actions on Advanced Packaging, vol. 20, no. 1, February
2005.
A. Deutsch, C. W. Surovic, R. S. Krabbenhoft, G. V. Kopcsay,
B. J. Chamberlin, ‘‘Prediction of Losses Caused by Rough-
ness of Metallization in Printed-Circuit Boards,’’ IEEE Transac-
tions on Advanced Packaging, vol. 30, no.2, pp.279-287,
May 2007.
A. Deutsch, Roger Krabbenhoft, C. W. Surovic, B. Rubin,
T-M. Winkel, ‘‘Use of the SPP Technique to Account for Inho-
mogeneities in Differential Printed-Circuit-Board Wiring’’
Digest of SPI’08, Signal Propagation on Interconnects, May
12-15, Avignon, France, 2008 pp. 12-16.
G. Arjavalingam, A. Deutsch, G. V. Kopcsay, J. K. Tam,
‘‘Methods for the Measurement of the Frequency Dependent
Complex Propagation Matrix, Impedance Matrix, and Admit-
tance Matrix of Coupled Transmission Lines,’’ U.S. Patent,
patent 5,502,392, March 26, 1996.
J. Loyer, R. Kunze, ‘‘SET2DIL: Method to Derive Differential
Insertion Loss from Single-Ended TDR/TDT Measurements,’’
DesignCon 2010.
3 Test Coupons (Specimens)
3.1 Common Characteristics
The coupons for all the
methods contain transmission lines. The SPP coupon also
includes a small disc structure. The following are general
guidelines for designing transmission line test structures for
test methods within this document. These transmission line
test structures or interconnects may be placed within the
functional area of the printed board or within test coupons. A
coupon is a section of the printed board that is designated for
test structures and is removed from the panel after printed
board fabrication is completed. Differences between the char-
acteristics of test and functional interconnects may exist. The
relative merit of test structure placement relation to functional
circuit is beyond the scope of this document.
3.1.1 General Nomenclature – Coupons
It is recom-
mended that coupons have labels that contain information
about the associated test line signal layer; for example, L1,
S3, etc. Labeling of the contact land for differential conductors
clearly indicate the matched pair.
It is recommended that test coupons include a printed board
serial number, part number, and date code.
3.1.2 Ground and Reference Planes
All reference planes
in the coupon
be connected together within the coupon
area and be independent of those planes in the functional cir-
cuit area. Ground and reference plane dispensation within the
functional area is beyond the scope of this document.
3.1.3 Differential Coupons
The differential line is also
known as a balanced transmission line. The probing area
should contain four contact lands: one contact land for each
of the two signal conductors in the differential pair and two
contact lands connected to the reference plane(s).
3.1.4 Probe Launch
The probe launch is comprised of a
PTH or other via structure and ground contact rectangular
pad and an example is depicted in Figure 3-1. The hole diam-
eter is recommended to be the smallest hole that is appropri-
ate for the respective technology. Some printed boards may
employ blind and buried vias. The recommended pitch
between ground and signal pad for high volume testing is
1.016 mm [0.040 in] or 2.54 mm [0.100 in]. Higher accuracy
can be achieved with smaller ground pad to signal pad spac-
ing and use of multiple ground vias.
3.1.5 Connector Launch
A high bandwidth connector
launch may be used instead of probe launch as show in Fig-
ure 3-2.
Figure 3-3 provides an example of high bandwidth connector
launch.
3.1.6 General Surface Condition
The panel test coupons
have the same surface plating and use the same solder
mask requirements as the functional printed board.
Number
2.5.5.12
Subject
Test Methods to Determine the Amount of Signal Loss on
Printed Boards
Date
07/12
Revision
A
IPC-TM-650
shall
shall
shall
Page
4
of
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