IPC-TM-650 EN 2022 试验方法--.pdf - 第680页
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During the remainder of the preparation, handle boards by the
edges only and use noncontaminating gloves.
3.1.3
Dry the cleaned boards for two hours at 50 °C.
3.1.4
If boards are to be stored before treatment, place the
boards in Kapak™ bags or other contamination-free contain-
ers (do not heat seal) in a desiccator. (Kapak™ bags are avail-
able from Fischer, VWR and other distributors.)
3.1.5
When measured as described in Sections 4 and 5, if
the control board readings are less than 1000 MΩ at any point
after the initial 24 hours of SIR exposure, a new set of test
coupons shall be obtained and the entire test repeated.
3.2 Blank Process Controls
If performing process valida-
tion testing, two samples from an unprocessed blank should
be run with the samples taken from the processed boards.
Values obtained from unprocessed board samples are useful
when failure is observed within the processed board sample.
Failure of the unprocessed samples may indicate a problem
with the incoming bare board rather than an assembly pro-
cess.
4 Equipment/Apparatus
It is the responsibility of the user
of this method to verify equipment suitability. This method
intends for all tolerances to be interpreted as uncertainties
with a confidence interval of 95% as referenced in ANSI/NCSL
Z540-1 and ANSI/NCSL Z540-2. Quantitative, qualitative and
default information follow in the paragraphs below.
4.1 Electrometer
Electrometer, High Resistance Meter,
Picoammeter or equivalent as described by ASTM D 257.
a) System must be capable of taking measurements and
controlling the switching automatically (unattended).
b) Minimum resistance measurement accuracy (not only
meter, but as implemented)
5% of full scale up to 10
10
Ω @ 5V
10% of full scale up to 10
11
Ω @ 5V
20% of full scale above 10
11
Ω @ 5V
c) Accuracy with respect to the ‘‘true’’ value requires assess-
ment of stability of the measurement system (after switch-
ing from bias voltage to the measurement voltage). There-
fore, if the system does not automatically assess stability
before logging, use an arbitrary time of one minute.
d) The system described in this section must be able to make
all measurements required within a 20 minute period and
meet the requirements of 5.3.
It is preferred that the resistance reading be stable before
acquiring the readings or data. If after one minute the signal
remains unstable, a measurement should still be recorded.
4.2 Switching System
a) Must have a channel-to-channel isolation resistance ten
times greater than the resistance of typical SIR require-
ments, or a default channel-to-channel isolation resistance
of 10
12
Ω.
b) <20-minute cycle while obtaining measurements as
described above.
c) Unique 10
6
Ω current limiting capability per channel.
4.3 Wire Attachments
a) Single solid copper wire with PTFE insulation.
b) Preferred solid wire solders (no flux), or nominally 1% by
weight rosin nonactivated. See wire attach section of this
document for more information.
c) Electrical (EMI) shielding to guard cabling from stray cur-
rents.
4.3.2 Alternative
Wire attachments such as stranded wire,
non-PTFE insulation, edge connectors rather than hard wiring,
and guarding techniques may be used provided the system
accuracy is not compromised.
4.4 Controlled Temperature and Humidity Chamber
a) Produce 40 ± 1 °C at 90 ± 3% R.H.
b) Continuous or semicontinuous recording of this environ-
ment. ± 2 °C and ± 3% R.H.
c) Samples should not significantly impede airflow.
d) Adequate mixing of water vapor and air is imperative to
ensure condensation does not occur anywhere in the
chamber except on/around cooling or dehumidification
coils. If any part of interior of the chamber is below the dew
point (possibly due to insulation or control issues), conden-
sation will occur. This is not necessarily a problem as long
as the samples are kept above the dew point and are
shielded from dripping or flying condensate.
4.5 Camera
Camera capable of recording color image.
5 Test Procedure
5.1 Interconnect Samples
Number
2.6.3.7
Subject
Surface Insulation Resistance
Date
03/07
Revision
IPC-TM-650
Page
2
of
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