IPC-TM-650 EN 2022 试验方法--.pdf - 第325页

Figure 1 TM A Expansion Curves : First Heat Cycle and Second Heat Cycle IPC-TM-650 Number Subject Date Revision Page 2 of 5 Second heat cycle expansion curve First heat cycle expansion curve _ Temperature ( ℃) IPC-24245-…

100%1 / 824
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Page 1 of 5
IPC-TM-650
TEST
METHODS
MANUAL
1
Scope
This
test
is
designed
to
determine
the
glass
tran¬
sition
temperature
(Tg)
and
coefficient
of
thermal
expansion
(GTE)
of
dielectric
materials
used
in
high
density
interconnect
(HDI)
and
microvias
by
the
use
of
thermal
mechanical
analysis
(TMA).
For
isotropic
(unreinforced)
materials,
either
method
(A
=
thick
specimen;
B
=
thin
specimen)
may
be
used.
For
aniso¬
tropic
materials
(reinforced),
both
methods
shall
be
used,
since
the
z
axis
expansion
(Method
A)
is
not
the
same
as
the
x-y
axis
expansion
(Method
B).
2
Applicable
Documents
None
3
Test
Specimens
3.1
Size
Method
A
Volumetric
or
Z-axis
expansion
-
thick
specimens
(>0.50
mm):
Specimens
shall
be
approximately
6.5
mm
x
6.5
mm.
The
thickness
shall
be
a
minimum
of
0.5
mm;
for
thick¬
nesses
<0.5
mm,
use
Method
B.
Exact
specimen
dimensions
may
be
determined
by
the
apparatus
used.
Method
B
In-plane
(x-y)
expansion
-
thin
specimens
(<0.5
mm):
Specimens
shall
be
approximately
15
mm
to
20
mm
long
and
2
mm
wide,
with
a
minimum
thickness
of
1
0
pm
and
a
maximum
thickness
of
0.75
mm.
Exact
specimen
dimen¬
sions
may
be
determined
by
the
apparatus
used.
3.2
All
specimens
should
be
fully
cured
according
to
manu¬
facturer's
recommendations.
Thick
specimens
may
be
made
by
use
of
multiple
lamination/cure
cycles
if
required.
3.3
For
Method
B,
two
samples
are
to
be
measured,
taken
at
90°
to
each
other
and
labeled
in
the
x
and
y
directions.
Iso¬
tropic
materials
are
anticipated
to
have
the
same
CTE
for
x
and
y,
and
reinforced
materials
are
likely
to
have
differing
x
and
y
CTE.
4
Equipment/Apparatus
4.1
A
TMA
capable
of
determination
of
dimensional
change
to
within
0.0025
mm
over
the
specified
temperature
range.
Preferably
the
TMA
will
have
computer
data
acquisition
and
analysis.
The
TMA
must
have
an
environmental
chamber
capable
of
having
nitrogen
flush
gas
and
heating
of
the
speci¬
men
to
31
0
℃.
Number
2.4.24.5
Subject
Glass
Transition
Temperature
and
Thermal
Expansion
of
Materials
Used
in
High
Density
Interconnection
(HDI)
and
Microvias
-
TMA
Method
Date
Revision
11/98
Originating
Task
Group
HDI
Test
Methods
Task
Group
(D-42a)
4.2
Diamond
blade
or
saw,
sanding
equipment,
or
equiva¬
lent
to
provide
specimens
of
the
size
and
edge
quality
required
for
Method
A
4.3
Scissors
or
razor
blades
or
equivalent
to
provide
speci¬
mens
of
size
and
edge
quality
for
Method
B
4.4
Air
circulating
oven
capable
of
maintaining
105℃
±
2
℃
4.5
Dessicator
capable
of
an
atmosphere
less
than
30%
RH
at
23℃
4.6
Etching
system
capable
of
complete
removal
of
metallic
cladding
5
Procedure
5.1.1
Metallic
clad
specimens
shall
be
tested
without
the
cladding.
Etch
and
dry
using
appropriate procedures
and
equipment.
5.1.2
Specimens
shall
be
cut
to
the
specified
size
using
appropriate
procedures
and
equipment
to
minimize
thermal
shock
and
mechanical
stress.
Method
A
specimens
shall
have
their
edges
smooth
and
burr-free
by
means
of
sanding
or
equivalent
(to
allow
the
specimen
to
rest
flat
on
the
mounting
stage).
Method
B
specimens
shall
be
rectangular,
with
their
long
edges
parallel
(to
ensure
good
mounting
in
the
film
fix¬
ture).
Method
B
specimens
shall
have
smooth
edges
without
nicks
or
tears.
5.1.3
Specimens
shall
be
preconditioned
by
baking
for
one
hour
±
1
5
minutes
at
1
05℃,
then
cooled
to
room
temperature
in
a
dessicator.
5.2
Measurement
5.2.1
Apparatus
Set-up
5.2.1.
1
Install
the
Correct
TMA
Probe
Method
A
Set
up
the
TMA
with
a
non-penetrating
quartz
expansion
probe.
Method
B
Set
up
the
TMA
with
a
thin
film
fixture/clamp.
Figure 1 TMA Expansion Curves: First Heat Cycle and
Second Heat Cycle
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 5
Second
heat
cycle
expansion
curve
First
heat
cycle
expansion
curve
_
Temperature
(
℃)
IPC-24245-1
5.2.1.
2
Apply
the
Load
Method
A
Mount
the
specimen
on
the
stage
of
the
TMA
and
apply
load
at
5
g
(see
6.5
for
an
explanation
of
load
cri¬
teria).
Enclose
the
specimen
and
probe
in
the
environmental
chamber.
Method
B
Mount
the
specimen
in
the
clamps
of
the
film
fix¬
ture
according
to
the
manufacturer's
instructions
and
apply
2
g
tension
force
(see
6.5
for
an
explanation
of
the
load
criteria).
Enclose
the
specimen
and
probe
in
the
environmental
cham¬
ber.
5.2.1.
3
Provide
an
inert
gas
purge
(helium
or
nitrogen)
at
a
rate
of
30
ml/min
to
150
ml/min
to
the
environmental
cham¬
ber.
Temperature
calibration
of
the
TMA
must
be
performed
under
the
same
gas
conditions.
5.2.1.
4
Measure
the
inital
specimen
thickness
(Method
A)
or
length
(Method
B)
prior
to
each
heat
cycle
(Lq).
5.2.2
Many
specimens
have
built
in
thermal
stresses
from
the
curing
step,
which
relaxes
during
the
specimen
heating
during
a
TMA
test.
This
relaxation
results
in
TMA
scans,
which
make
determination
of
Tg
and
CTE
impossible
(see
Figure
1).
Two
heat
cycles
are
required
to
obtain
valid
Tg
and
CTE
val¬
ues.
5.2.3
Running
the
TMA
Temperature
Scan
5.2.3.
1
Initial
Temperature
a.
For
specimens
with
Tg
below
or
near
room
temperature,
start
the
scan
at
least
20℃
below
the
anticipated
transi¬
tion.
This
may
require
a
TMA
with
refrigeration
control
of
the
environmental
chamber.
b.
For
specimens
with
Tg
greater
than
room
temperature,
start
the
scan
at
30℃.
S.2.3.2
Temperature
Rate
Depending
on
sample
prepa¬
ration,
two
heating
cycles
may
be
required
to
obtain
accurate
Tg
and
CTE
above
Tg.
If
the
sample
shows
unexpected
shrinkage
above
Tg
(see
Figure
1),
the
two
heat
test
method
is
required.
If
the
sample
does
not
show
anomalous
behavior,
only
one
heat
cycle
(the
second
heat
cycle
at
5
℃/min)
is
required.
a.
First
heat:
The
first
heat
cycle
of
the
specimen
shall
be
run
at
10℃/min.
b.
Second
heat
(reportable
data
heat
cycle):
The
second
heat
cycle
of
the
specimen
shall
be
run
at
5a0/min.
5.2.3.3
Temperature
Excursion
a.
First
heat:
Continue
heating
the
specimen
to
a
tempera¬
ture
20℃
greater
than
the
anticipated
Tg
or
until
the
anomalous
thermal
relaxation
has
stopped.
See
Figure
1
for
an
example
of
anomalous
first
heat
behavior.
Hold
the
specimen
at
this
temperature
for
a
minimum
of
five
min¬
utes.
Avoid
holding
the
sample
at
this
temperature
for
too
long；
sample
degradation
might
occur.
Cool
the
specimen
to
the
initial
temperature
under
temperature
control
at
5
℃/min
to
10℃/min.
This
should
prevent
reestablishment
of
thermal
stresses.
b.
Second
heat
(reportable
data
heat
cycle):
The
second
heat
cycle
of
the
specimen
shall
continue
to
31
0
℃
(to
ensure
good
data
at
300℃).
5.3
Evaluation
5.3.1
The
TMA
expansion
curve
should
resemble
the
plot
shown
in
Figure
2.
2.4.24.5
Glass
Transition
Temperature
and
Thermal
Expansion
of
Materials
Used
in
High
Density
Interconnection
(HDI)
and
Microvias
-
TMA
Method
11/98
uo_suedx
Figure 1 Solder ball test standards
Preferred Acceptable
Unacceptable; Clusters Unacceptable
IPC-TM-650
Number
Subject Date
Revision
Page 3 of 3
2.4.43
Solder
Paste
―
Solder
Ball
Test
1/95