IPC-TM-650 EN 2022 试验方法--.pdf - 第692页

4.1.4 Deviations to the t est specimen design/construction or use of an alternate test specimen be AABUS. 5 Apparatus 5.1 Dry ing Oven The oven be capable of maintaining a uniform set temperature within the 105 to 1 25 °…

1 Scope and Purpose

1.1 Scope

This method subjects unpopulated test speci-

mens (samples) to sudden, extreme changes in temperature

in order to evaluate the quality of interconnects formed during

the manufacturing processes.

1.2 Purpose

This method be used to simulate the

thermodynamic effects of extreme temperature variations. The

use of this method is intended to be able to capture ‘‘infant

mortality’’ types of manufacturing defects.

1.2.1

This method may provide for qualification, quality con-

formance testing and lot acceptance.

2 Applicable Documents

Terms and Definitions

Generic Standard on Printed Board Design

Acceptability of Printed Boards

Standard for Printed Board Handling and Storage

Specification for Base Materials for Rigid and Mul-

tilayer Printed Boards

Specification for Base Materials for High Speed/

High Frequency Applications

Qualification and Performance Specification for

Rigid Printed Boards

Qualification and Performance Specification for

Flexible Printed Boards

Qualification and Performance Specification for

High Frequency (Microwave) Printed Boards

Guidelines for Microsection Preparation

Test Methods Manual

2.1.1 Microsectioning - Microsectioning, Manual and Semi

or Automatic Method

2.6.27 Assembly Simulation - Thermal Stress, Convection

Reflow Assembly Simulation

3 Terms and Definitions

3.1 Thermal Shock (Unpopulated Printed Board)

A tem-

perature cycle with a change rate of 1 °C or more per second

as measured on the surface of the test specimen, for at least

the center 60% of each transition, during the heating and

cooling portions.

3.2 Thermal Cycle (Unpopulated Printed Board)

A tem-

perature cycle that has a sample change rate of less than 1 °C

per second as measured on the surface of the test specimen,

for at least the center 60% of each transition, during the heat-

ing and cooling portions. While no minimum temperature

change rate is specified, a change rate of at least 10 °C per

minute is expected for qualification testing.

4 Test Specimen

4.1 Design/Construction Criteria

4.1.1

The test specimen be the D coupon in accor-

dance with the requirements of IPC-2221 Appendix A, or

alternate coupon(s) AABUS.

4.1.2

The test specimen(s) be constructed with holes

contained in the printed board it represents as follows:

• Through holes: D coupons

be constructed with both

the largest plated-through holes (PTHs) and the smallest

plated-through vias.

• Propagated structures: D coupons

be constructed

with and represent all applicable blind, buried, or filled

through hole (propagated) via structures as defined in IPC-

2221 Appendix A. D coupons contain two nets (structures).

Multiple D coupons are used for designs with more than two

structures.

4.1.2.1

The test specimen(s) contain the representa-

tive ground and power planes of the printed board design.

4.1.3

The test specimen(s) allow for microsection

evaluation of all the applicable, representative PTHs and vias

defined in 4.1.2 after exposure to the conditions of this Test

Method. IPC-9241 provides guidance on the proper prepara-

tion of a metallographic sample (microsection) of a printed

board.

3000 Lakeside Drive, Suite 105N

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.6.7.2

Subject

Thermal Shock, Thermal Cycle and Continuity

Date

3/2020

Revision

Originating Task Group

Thermal Stress Test Methodology Subcommittee

(D-32)

Association

Connecting

Electronics

Industries

shall

IPC-T-50

IPC-2221

IPC-A-600

IPC-1601

IPC-4101

IPC-4103

IPC-6012

IPC-6013

IPC-6018

IPC-9241

IPC-TM-650

shall

Material

this

Test

Methods

Manual

was

voluntarily

established

Technical

Committees

PC.

This

material

advisory

only

and

use

adaptation

，

entirely

voluntary.

IPC

disclaims

all

liability

any

kind

the

use,

application,

adaptation

this

material.

Users

are

also

wholly

responsible

for

protecting

themselves

against

all

claims

liabilities

for

patent

infringement.

Equipment

referenced

for

the

convenience

the

user

and

does

not

imply

endorsement

IPC.

Page

4.1.4

Deviations to the test specimen design/construction

or use of an alternate test specimen

be AABUS.

5 Apparatus

5.1 Drying Oven

The oven be capable of maintaining

a uniform set temperature within the 105 to 125 °C range.

5.2

Environmental Test Chamber

5.2.1 Dual Chamber Option

An automatically controlled

dual temperature environmental test chamber or other

apparatus capable of maintaining the upper and lower

temperatures.

5.2.2 Single Chamber Option

An automatically controlled

environmental test chamber or other apparatus capable of

maintaining the upper and lower temperatures.

5.2.3

The system have adequate environmental con-

trols to maintain the tolerance range and limits listed in

6.5.1.3.

5.2.4

The system should accommodate verifiable calibration

compliance. See note 7.1 for additional considerations.

5.2.5

Deviations to the equipment requirements and

acceptability of the alternative methods

be AABUS.

5.3 Microscope

The magnification used for defect recogni-

tion

be in agreement with the inspection requirements/

capabilities defined in the applicable performance specifica-

tion (e.g., IPC-6012, IPC-6013, IPC-6018, etc.) and the IPC-

A-600 visual workmanship standard.

5.4 Resistance Measurements

5.4.1

The resistance measurement have enough pre-

cision to clearly determine the resistance percent change as

required by the user for the resistance level of each test speci-

men’s nets.

5.4.2

The total system uncertainty from resistance, tem-

perature and time/cycle variations

be less than 10% of

the failure criteria required by the user. For example, if the

required failure criteria is 5% then the total system uncertainty

be no greater than 0.50%.

5.4.3

The resistance measurement system be capable

of recording resistances at least once per cycle, at or near the

end of the peak temperature dwell, after the coupon has

reached temperature stabilization.

5.5 Temperature Measurements

5.5.1

The temperature measurement system should be

capable of recording temperatures at least once per second

throughout a complete cycle for both a representative test

specimen and the heating/cooling medium. The system

be capable of demonstrating the change rate defined in 3.1

and 3.2 and documenting a representative cycle.

6 Procedure

6.1 Conditioning

6.1.1

The test specimen(s) be conditioned by drying in

an oven to remove moisture for a minimum of six (6) hours at

105 to 125 °C. This conditioning process is mandatory if this

method is used for qualification purposes.

This method

replicate the assembly process. The

requirement for conditioning (bake/drying)

be in accor-

dance with product/process lot Quality Conformance criteria.

If conditioning of the printed board is not part of the normal

assembly process, and this method is being used for quality

conformance testing, then conditioning is not a requirement.

6.1.2

Test specimens that are thicker or more complex may

require longer baking times to achieve acceptable moisture

levels. Record the bake times and temperature if different than

those stated in 6.1.1. See IPC-1602 for additional guidance

on baking to achieve acceptable moisture levels.

6.1.3

Deviations to the conditioning requirements in 6.1.1

such as when used for quality conformance criteria and/or any

changes to the time and temperature

be AABUS.

6.2 Reflow Simulation

6.2.1

The test specimen(s) be subjected to six (6)

reflow simulation cycles in accordance with IPC-TM-650,

Method 2.6.27 prior to Thermal Shock or Thermal Cycling.

6.2.2

The reflow profile be in accordance with IPC-

TM-650, Method 2.6.27, as specified.

6.2.3

Other profiles or reflow simulation testing for other

than 6 cycles are AABUS.

6.3 Interconnect Resistance Measurements

Intercon-

nect resistance measurements

be taken at the following

times:

• Prior to the test (initial ambient after reflow simulation).

Number

2.6.7.2

Subject

Thermal Shock, Thermal Cycle and Continuity

Date

3/2020

Revision

IPC-TM-650

—

shall

Page

• During the initial cycle after the high temperature dwell. Peak

resistance during this cycle

be the reference

resistance.

• At or near the end of the peak temperature dwell, after the

coupon has reached temperature stabilization, peak resis-

tance during the cycle

be recorded.

6.4 Qualification (also see 6.6 and Table 6-2)

For quali-

fication testing, the product environment and life expectancy

should be taken into consideration to determine the tempera-

ture extremes and number of cycles. Qualification testing

parameters

be AABUS.

6.4.1 Historical Examples

Historical examples as

described in Table 6-1 were not product focused.

6.4.2 Cycles

The test specimen(s) be subjected to

the specified number of cycles between the specified tem-

perature extremes.

6.4.2.1 Tolerances

The tolerance associated with the hot

cycle is +/-5 °C. The tolerance associated with the cold cycle

is +/-5 °C.

6.4.3 Dwell Time at Extremes

During each cycle, the test

specimen(s)

be subjected to each temperature extreme

for the time required for stabilization and resistance measure-

ment (15 minutes when a dual chamber is used).

6.4.4 Temperature Change Rate

The rate of change

between temperature extremes, both high to low and low to

high,

be as high as possible. The temperature change

be at least 10 °C per minute for at least the center 60%

of each transition period, hot to cold and cold to hot.

6.4.5 Temperature Documentation

6.4.5.1

The temperature of a representative test specimen

be recorded at the end of the dwell at each temperature

extreme, for every cycle.

6.4.5.2

A temperature profile from at least one complete

cycle

be recorded during each test in accordance with

5.5.1 and 6.4.2.1 and included in the test report. This

include the temperatures of a representative test specimen

and the hot/cold media. Recording data every second for this

purpose is recommended.

6.4.6 Dual Chamber Systems

For dual chamber systems:

• The transfer time between chambers

be less than two

(2) minutes.

• The thermal capacity of each chamber

be such that

the ambient temperature

reach the specified tempera-

ture within two (2) minutes after the test specimens have

been transferred to the appropriate chamber.

6.5 Quality Conformance (see also 6.6 and Table 6-2)

6.5.1 Temperature Cycling

The test specimen(s) be

subjected to one hundred (100) cycles of temperature cycling

to the extremes defined below:

6.5.1.1

The high temperature extreme be the of

the following:

• Material T

– 10 °C (lowest T

of the materials used in the

specimen, but not lower than 125 °C)

• Reflow peak temperature – 25 °C

• 210 °C

The originating subcommittee for this Test Method

was not able to obtain industry consensus on a default

method for determining T

. Therefore, methods to determine

(as specified in the procurement documentation or AABUS)

may include:

• Lowest T

listed on the Material Data Sheet

• T

(from TMA) listed on the Specification Slash sheet

• Actual T

of the material, determined after reflow simulation

6.5.1.2

The low temperature extreme be one of the

following:

100 -40 to +85 B

Generic for IPC-4103,

RT/duroid® materials

100 -55 to +105 C

Generic for IPC-4101,

G10 materials

100 -55 to +125 D

Generic for IPC-4101,

Epoxy materials

100 -65 to +150 E

Generic for IPC-4101,

FR-5 materials

100 -65 to +170 F

Generic for IPC-4101,

Polyimide materials

Test Conditions B through F are from the previous revision to this

test method.

Number

2.6.7.2

Subject

Thermal Shock, Thermal Cycle and Continuity

Date

3/2020

Revision

IPC-TM-650

—

shall

Table

6-1

Historical

Qualification

Temperature

Extremes

Note

Cycles

Temperature

Range

Test

Condition1

Use

shall

least

Note

shall

Page