IPC-TM-650 EN 2022 试验方法--.pdf - 第127页

IPC-TM-650 The Institute for Int erconnecting and Packaging E lectronic Circuits 2215 S anders Road • Northbrook, IL 60062-6135 Material in this T est M ethods Manual was vol untaril y establis hed by T echni cal Committ…

100%1 / 824
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 1
IPC-TM-650
TEST
METHODS
MANUAL
Number
2.3.7
Subject
Etching,
Ferric
Chloride
Method
Date
Revision
7/75
A
Originating
Task
Group
N/A
1
.0
Scope
To
determine
the
quality
of
the
dielectric
mate¬
rial
after
etching
with
ferric
chloride.
2
.0
Applicable
Documents
None.
3
.0
Test
Specimen
Specimen
2
in.
x
2
in.
X
thickness
of
one
ounce
or
two
ounces
copper
clad.
4
.0
Apparatus
4.1
Heated
Electrical
Equipment
for
etching
the
speci¬
men.
4.2
Air
Circulating
Chamber
capable
of
maintaining
80℃
±
3°
(1
76°F).
4.3
Equipment
and
Chemicals
needed
to
perform
this
test
are
as
follows:
Rubber
or
polyethylene
gloves,
lint
free
cloth,
grade
FFF
pumice
and
plastic
scrubbing
brushes,
distilled
water,
10%
solution
oxalic
acid,
ferric
chloride
solution,
meth¬
ylethyl
ketone,
toluol,
and
trichlorethylene.
5
.0
Procedure
5.1
Preparation
of
Specimen
Remove
rough
edges
from
the
specimen
by
sanding
or
other
suitable
means.
5.2
Etching
Etch
specimens
with
vigorous
agitation
for
the
minimum
time
in
42°
BAUME
ferric
chloride
solution
moni¬
tored
at
30℃
±
6°
(86°
F).
After
removal
of
the
copper,
imme¬
diately
wash
the
specimen
with
running
tap
water
for
2
to
5
minutes
and
keep
the
specimen
from
drying
until
the
speci¬
men
is
placed
in
the
chamber.
Immerse
specimens
in
a
10%
solution
of
oxalic
acid
in
distilled
water
at
25℃
±
8°
(77°F)
for
1
5
to
20
minutes
providing
gentle
circulation
of
the
oxalic
acid
solution
during
this
period.
Flush
the
specimens
with
tap
water
for
2
to
5
minutes,
then
scrub
the
specimens
with
pum¬
ice
to
remove
resist.
Wipe
the
resist
off
with
a
lint
free
cloth
moistened
with
a
suitable
solvent.
Scrub
the
specimen
with
a
plastic
bristled
brush
under
running
tap
water
for
2
to
5
min¬
utes,
then
rinse
for
30
minutes.
Rinse
the
specimen
again
in
distilled
water.
5.3
Condition
Dry
the
specimens
for
1
hour
in
a
chamber
maintained
at
80℃
(1
76°F).
If
specimens
are
for
electrical
tests,
handle
only
with
rubber
or
polyethylene
gloves.
5.4
Evaluation
of
Test
Examine
specimens
for
white
deposits
or
other
surface
contaminants,
loss
of
surface
resin
softness,
delamination,
blistering
or
measling.
Clad
specimens
also
should
be
evaluated
for
blisters
or
delamination
of
the
copper
foil.
6
.0
Notes
6.1
If
the
etching
time
exceeds
1
5
minutes
for
1
ounce
cop¬
per
or
30
minutes
for
2
ounces
copper,
renew
the
etching
solution.
6.2
Oxalic
acid
is
very
toxic
and
extreme
caution
should
be
exercised.
6.3
The
time
to
produce
a
clean
pattern
with
a
minimum
undercutting
is
approximately
7
minutes
for
1
ounce
copper,
and
15
minutes
for
2
ounce
copper
using
a
fresh
solution.
IPC-TM-650
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 2
IPC-TM-650
TEST
METHODS
MANUAL
1
.0
Scope
This
method
is
a
means
for
preparation
of
test
specimens
for
determination
of
bare
dielectric
material
quality
and
properties,
using
cupric
chloride
as
the
etching
solution
for
removal
of
copper
cladding.
2
.0
Applicable
Documents
Method
2.3.1
.1
,
Chemical
Cleaning
of
Metal
Clad
Laminate
3
.0
Test
Specimens
The
size
of
lot
samples
or
test
speci¬
mens
shall
be
determined
by
the
inspections
or
tests
to
be
performed
after
etching
and
the
capabilities
of
the
etching
equipment.
4
.0
Apparatus
or
Material
4.1
Standard
chemical
etching
chamber
or
laboratory
equipment
suitable
to
the
etchant
chemistry.
4.2
Air
circulating
oven
capable
of
maintaining
the
specified
temperatures
and
tolerances.
4.3
Personal
safety
equipment
shall
include:
rubber
or
poly¬
ethylene
gloves,
plastic
or
coated
apron
and
safety
goggles.
4.4
Chemicals
Chemical
Cupric
Chloride,
CuCI2-2H20
Hydrochloric
Acid,
HCI
Distilled/Deionized
Water
Sodium
Hydroxide,
NaOH
Concentration
0.54
kg/l
4.5
Ib/gal
9.3%
by
weight
(3N)
25%
by
volume
As
required
1
0%
by
weight
Reagent
grade
isopropyl
alcohol
(IPA)
As
required
4.5
Pattern
Developing
Materials
Etch
resist
system
or
materials
capable
of
producing
the
applicable
conductor
pat¬
terns.
5
.0
Procedure
5.1
Preparation
of
Specimen
Number
2.3.7.1
Subject
Cupric
Chloride
Etching
Method
Date
12/94
Revision
A
Originating
Task
Group
MIL-P-13949
Test
Methods
Task
Group
(7-1
1b)
5.1
.1
Shear
the
material
to
the
appropriate
sample
or
speci¬
men
size
and
if
necessary
remove
the
rough
edges
from
the
specimen
by
sanding
or
other
suitable
means.
Specimens
may
be
chemically
cleaned
in
accordance
with
IPC-TM-650,
Method
2.3.1
.1
.
Specimens
may
also
be
mechanically
cleaned.
5.1.2
If
a
conductor
pattern
is
required,
prepare
the
material
by
applying
etch
resist
according
to
standard
industry
prac¬
tices.
5.2
Etching
5.2.1
Remove
the
metal
cladding
by
etching
in
a
spray
chamber
or
other
suitable
container
containing
30-32*
BAUME
cupric
chloride
solution
maintained
at
51
.7
±
5.6℃
[1
25
±
10°F].
Etching
time
shall
be
minimized
to
prevent
over-
exposure
of
the
bare
laminate
material
to
the
etching
solution
and
yet
allow
for
complete
removal
of
the
exposed
metal
clad¬
ding.
If
the
specimens
are
etched
in
a
laboratory
environment,
vigorous
agitation
may
be
required.
5.2.2
Rinse
the
specimens
thoroughly.
5.2.3
For
referee
purposes,
neutralize
any
residual
etchant
by
quickly
dipping
in
a
10%
solution
of
NaOH
solution
and
then
rinse
thoroughly
with
distilled
or
deionized
water.
Note:
If
this
step
is
not
followed,
undercutting
of
the
circuitry
is
pos¬
sible,
which
in
time
could
lead
to
inaccurate
test
data,
such
as
low
peel
strength.
5.3
Cleaning
5.3.1
If
etch
resist
has
been
used,
samples
shall
have
the
resist
or
tape
removed
by
standard
industry
practices.
5.3.2
When
electrical
testing
is
required
on
the
material,
do
not
allow
the
etched
specimens
to
dry
before
they
go
through
the
cleaning
process.
For
general
testing,
scrubbing
with
a
soft
natural
bristle
brush
under
running
tap
water
and
rinsing
with
distilled
water
or
deionized
water
may
be
adequate.
For
critical
testing
and
for
referee
testing,
laminates
shall
be
soaked
for
10
minutes
in
reagent
grade
IPA
followed
immedi¬
ately
by
a
10
minute
rinse
in
flowing
16
megaohm
deionized
water.
IPC-TM-650
Number
Subject Date
Revision
Page 2 of 2
2.3.7.1
Cupric
Chloride
Etching
Method
12/94
A
5.4
Drying
Samples
may
be
air
dryed
for
subsequent
mate¬
rial
evaluations.
For
referee
testing,
an
oven
bake
for
1
hour
at
80
±
5.6℃
[176
±
10°F]
is
required.
5.5
Evaluation
Determine
and
record
whether
the
etching
procedure
resulted
in
any
unusual
events,
such
as:
a.
Dwell
time
in
etcher
necessary
for
complete
copper
removal,
if
longer
than
normal.
b.
Warpage
or
distortion
of
the
material.
c.
Discoloration
or
other
visual
changes
to
the
material.
6.0
Notes
None