IPC-TM-650 EN 2022 试验方法--.pdf - 第691页

1 Scope and Purpose 1.1 Sco pe This m ethod subjects unpopulated test speci- mens (samples) to sudden, extreme changes in tempera tur e in order to evaluate the qu ality of interconnects formed during the manufacturing p…

IPC-CC-830

Class Low Temperature High Temperature

Figure 1 IPC-B-25A Test Board

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

Page 1 of 1

ASSOCIATION

CONNECTING

ELECTRONICS

INDUSTRIES

221

Sanders

Road

Northbrook,

60062-61

IPC-TM-650

TEST

METHODS

MANUAL

Scope

This

test

method

determine

the

physical

endurance

applied

conformal

coating

sudden

changes

high

and

low

temperature

excursions

that

cause

physical

fatigue.

Applicable

Documents

Qualification

and

Performance

Electrical

Insu¬

lating

Compound

for

Printed

Board

Assemblies

Test

Specimens

Five

IPC-B-25A

boards

(see

Figure

coated

with

conformal

coating

per

coating

supplier's

recom¬

mendations.

Apparatus

Test

chamber

automatically

controlled

dual

temperature

environmental

test

equipment

two

separate

chambers

capable

maintaining

-65°

℃

[-85°

9°F]

and

250°

土

℃

[482°

土

9°F]

respectively.

Please

note,

while

most

requests

state

125°

℃

[257。

9°F]

the

high

side,

there

are

cases

(such

polyimide

board

applications)

where

higher

temperature

will

required.

Test

conditions,

not

otherwise

stated

below,

shall

-65℃

[-85°F]

and

125℃

[257°F].

N/A N/A

-40℃

[-40°F]

125℃

[257°F]

-65℃

[-85°F]

125℃

[257°F]

-65℃

[-85°F]

250℃

[482°F]

Procedure

5.1

Specimen

Preparation

Operate

the

chamber(s)

high

and

low

temperatures

and

stabilize.

Clamp

suspend

the

five

conformal

coated

IPC-B-25A

boards

the

thermal

shock

chamber.

5.1.1

Set

the

cold

portion

chamber

-65℃

[-85°F]

and

the

hot

portion

chamber

125℃

[257°F].

Number

2.6.7.1

(Supersedes

2.6.7.

for

Conformal

Coating

Tests)

Subject

Thermal

Shock

Conformal

Coating

Date

07/00

Revision

Originating

Task

Group

Conformal

Coating

Task

Group

(5-33a)

5.1.2

Set

the

dwell

time

for

minutes.

5.1.3

Set

the

temperature

recovery

time

for

less

than

two

minutes.

5.1.4

Set

the

chamber

for

100

cycles.

5.1.5

Activate

the

test

chamber

and

begin

testing.

5.2

Evaluation

5.2.1

Upon

completion

the

thermal

shock

test,

the

speci¬

mens

shall

meet

the

requirements

appearance

and

dielec¬

tric

withstanding

voltage

accordance

with

IPC-CC-830.

1 Scope and Purpose

1.1 Scope

This method subjects unpopulated test speci-

mens (samples) to sudden, extreme changes in temperature

in order to evaluate the quality of interconnects formed during

the manufacturing processes.

1.2 Purpose

This method be used to simulate the

thermodynamic effects of extreme temperature variations. The

use of this method is intended to be able to capture ‘‘infant

mortality’’ types of manufacturing defects.

1.2.1

This method may provide for qualification, quality con-

formance testing and lot acceptance.

2 Applicable Documents

Terms and Definitions

Generic Standard on Printed Board Design

Acceptability of Printed Boards

Standard for Printed Board Handling and Storage

Specification for Base Materials for Rigid and Mul-

tilayer Printed Boards

Specification for Base Materials for High Speed/

High Frequency Applications

Qualification and Performance Specification for

Rigid Printed Boards

Qualification and Performance Specification for

Flexible Printed Boards

Qualification and Performance Specification for

High Frequency (Microwave) Printed Boards

Guidelines for Microsection Preparation

Test Methods Manual

2.1.1 Microsectioning - Microsectioning, Manual and Semi

or Automatic Method

2.6.27 Assembly Simulation - Thermal Stress, Convection

Reflow Assembly Simulation

3 Terms and Definitions

3.1 Thermal Shock (Unpopulated Printed Board)

A tem-

perature cycle with a change rate of 1 °C or more per second

as measured on the surface of the test specimen, for at least

the center 60% of each transition, during the heating and

cooling portions.

3.2 Thermal Cycle (Unpopulated Printed Board)

A tem-

perature cycle that has a sample change rate of less than 1 °C

per second as measured on the surface of the test specimen,

for at least the center 60% of each transition, during the heat-

ing and cooling portions. While no minimum temperature

change rate is specified, a change rate of at least 10 °C per

minute is expected for qualification testing.

4 Test Specimen

4.1 Design/Construction Criteria

4.1.1

The test specimen be the D coupon in accor-

dance with the requirements of IPC-2221 Appendix A, or

alternate coupon(s) AABUS.

4.1.2

The test specimen(s) be constructed with holes

contained in the printed board it represents as follows:

• Through holes: D coupons

be constructed with both

the largest plated-through holes (PTHs) and the smallest

plated-through vias.

• Propagated structures: D coupons

be constructed

with and represent all applicable blind, buried, or filled

through hole (propagated) via structures as defined in IPC-

2221 Appendix A. D coupons contain two nets (structures).

Multiple D coupons are used for designs with more than two

structures.

4.1.2.1

The test specimen(s) contain the representa-

tive ground and power planes of the printed board design.

4.1.3

The test specimen(s) allow for microsection

evaluation of all the applicable, representative PTHs and vias

defined in 4.1.2 after exposure to the conditions of this Test

Method. IPC-9241 provides guidance on the proper prepara-

tion of a metallographic sample (microsection) of a printed

board.

3000 Lakeside Drive, Suite 105N

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.6.7.2

Subject

Thermal Shock, Thermal Cycle and Continuity

Date

3/2020

Revision

Originating Task Group

Thermal Stress Test Methodology Subcommittee

(D-32)

Association

Connecting

Electronics

Industries

shall

IPC-T-50

IPC-2221

IPC-A-600

IPC-1601

IPC-4101

IPC-4103

IPC-6012

IPC-6013

IPC-6018

IPC-9241

IPC-TM-650

shall

Material

this

Test

Methods

Manual

was

voluntarily

established

Technical

Committees

PC.

This

material

advisory

only

and

use

adaptation

，

entirely

voluntary.

IPC

disclaims

all

liability

any

kind

the

use,

application,

adaptation

this

material.

Users

are

also

wholly

responsible

for

protecting

themselves

against

all

claims

liabilities

for

patent

infringement.

Equipment

referenced

for

the

convenience

the

user

and

does

not

imply

endorsement

IPC.

Page

4.1.4

Deviations to the test specimen design/construction

or use of an alternate test specimen

be AABUS.

5 Apparatus

5.1 Drying Oven

The oven be capable of maintaining

a uniform set temperature within the 105 to 125 °C range.

5.2

Environmental Test Chamber

5.2.1 Dual Chamber Option

An automatically controlled

dual temperature environmental test chamber or other

apparatus capable of maintaining the upper and lower

temperatures.

5.2.2 Single Chamber Option

An automatically controlled

environmental test chamber or other apparatus capable of

maintaining the upper and lower temperatures.

5.2.3

The system have adequate environmental con-

trols to maintain the tolerance range and limits listed in

6.5.1.3.

5.2.4

The system should accommodate verifiable calibration

compliance. See note 7.1 for additional considerations.

5.2.5

Deviations to the equipment requirements and

acceptability of the alternative methods

be AABUS.

5.3 Microscope

The magnification used for defect recogni-

tion

be in agreement with the inspection requirements/

capabilities defined in the applicable performance specifica-

tion (e.g., IPC-6012, IPC-6013, IPC-6018, etc.) and the IPC-

A-600 visual workmanship standard.

5.4 Resistance Measurements

5.4.1

The resistance measurement have enough pre-

cision to clearly determine the resistance percent change as

required by the user for the resistance level of each test speci-

men’s nets.

5.4.2

The total system uncertainty from resistance, tem-

perature and time/cycle variations

be less than 10% of

the failure criteria required by the user. For example, if the

required failure criteria is 5% then the total system uncertainty

be no greater than 0.50%.

5.4.3

The resistance measurement system be capable

of recording resistances at least once per cycle, at or near the

end of the peak temperature dwell, after the coupon has

reached temperature stabilization.

5.5 Temperature Measurements

5.5.1

The temperature measurement system should be

capable of recording temperatures at least once per second

throughout a complete cycle for both a representative test

specimen and the heating/cooling medium. The system

be capable of demonstrating the change rate defined in 3.1

and 3.2 and documenting a representative cycle.

6 Procedure

6.1 Conditioning

6.1.1

The test specimen(s) be conditioned by drying in

an oven to remove moisture for a minimum of six (6) hours at

105 to 125 °C. This conditioning process is mandatory if this

method is used for qualification purposes.

This method

replicate the assembly process. The

requirement for conditioning (bake/drying)

be in accor-

dance with product/process lot Quality Conformance criteria.

If conditioning of the printed board is not part of the normal

assembly process, and this method is being used for quality

conformance testing, then conditioning is not a requirement.

6.1.2

Test specimens that are thicker or more complex may

require longer baking times to achieve acceptable moisture

levels. Record the bake times and temperature if different than

those stated in 6.1.1. See IPC-1602 for additional guidance

on baking to achieve acceptable moisture levels.

6.1.3

Deviations to the conditioning requirements in 6.1.1

such as when used for quality conformance criteria and/or any

changes to the time and temperature

be AABUS.

6.2 Reflow Simulation

6.2.1

The test specimen(s) be subjected to six (6)

reflow simulation cycles in accordance with IPC-TM-650,

Method 2.6.27 prior to Thermal Shock or Thermal Cycling.

6.2.2

The reflow profile be in accordance with IPC-

TM-650, Method 2.6.27, as specified.

6.2.3

Other profiles or reflow simulation testing for other

than 6 cycles are AABUS.

6.3 Interconnect Resistance Measurements

Intercon-

nect resistance measurements

be taken at the following

times:

• Prior to the test (initial ambient after reflow simulation).

Number

2.6.7.2

Subject

Thermal Shock, Thermal Cycle and Continuity

Date

3/2020

Revision

IPC-TM-650

—

shall

Page