Smart Gui - Algorithm Training Material_rev1.pdf - 第218页
Copyright © ViT rox All Rights Reserved . U-type Algorithm - 3D Multijoint (Base Reference) 218 Base Reference a. Joint Size & Joint Offset ● T o adjust the sizes and the offset for joint inspection boxes b. Joint Im…
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U-type Algorithm - 3D Multijoint
217
1. Solder Inspection
● Solder Inspection consists of 3 mode. Which are:
Terminal Reference: Solder height qualification are based on the
height (%) between lead terminal & PCB surface
Base Reference: Solder height qualification are based on the height
(um) measured from PCB surface
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U-type Algorithm - 3D Multijoint (Base Reference)
218
Base Reference
a. Joint Size & Joint Offset
● To adjust the sizes and the offset for joint inspection boxes
b. Joint Image Plane
● These are the types of 2D Lighting. Select the one with having highest
contrast among interested inspection region and the background.
● Usually choose angle 2+3
c. Joint Grey Thres
● Usually set to 160
d. Joint Height Thres
e. Joint Coverage Thres(%)
● To set the percentage to pass the joint inspection.
Grey Thres
Measured Grey Thres
PASS FAIL
Height Thres (um)
Measured Height (um)
Fail Pass
Pass Criteria for single pixel:
a. Measured Grayscale < Joint Grey Thres
b. Solder Height (%) > Joint Height Thres (%).
The overall pass criteria depends on:
Joint Coverage (%) > Joint Coverage Thres (%)
where,
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219
Terminal Reference
● Using 2D (Grayscale) and 3D(Height)
● OR Relation between 2D and 3D as pass criteria for single pixel
● Pass Criteria for single pixel:
a. Measured Grayscale < Joint Grey Thres
b. Solder Height (%) > Joint Height Thres (%).
● The overall pass criteria depends on:
Joint Coverage (%) > Joint Coverage Thres (%)
where,
U-type Algorithm - 3D Multijoint (Terminal Reference)