00198661-02_UM_SX12-V3_EN.pdf - 第102页
2 Operational safety Instruction manual SIPLACE SX1/SX2 Edition V2 and V3 2.10 ESD guidelines From software version SC.713.1 Edition 12/202 0 102
Instruction manual SIPLACE SX1/SX2 Edition V2 and V3 2 Operational safety
From software version SC.713.1 Edition 12/2020 2.10 ESD guidelines
101
Do not move the assemblies near to data view devices, monitors or television units. Keep a min-
imum distance of > 10 cm to monitors.
2.10.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
Always use an earthed soldering iron if you carry out any soldering work.
2.10.5 Dispatching ESD modules
Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film.
2
If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
2 Operational safety Instruction manual SIPLACE SX1/SX2 Edition V2 and V3
2.10 ESD guidelines From software version SC.713.1 Edition 12/2020
102

Instruction manual SIPLACE SX1/SX2 Edition V2 and V3 3 Technical data and assemblies
From software version SC.713.1 Edition 12/2020 3.1 Performance data for the SIPLACE SX1/SX2 V3
103
3 Technical data and assemblies
3.1 Performance data for the SIPLACE SX1/SX2 V3
3.1.1 Machine performance
3
Placement head types SIPLACE SpeedStar (C&P20 P2)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
Placement performance
The placement performance is influenced by the different head combinations and head positions, plus the conveyor
configurations. Individual options and customized applications also influence the placement performance. On request,
SIPLACE can calculate the actual performance of your product on your machine configuration.
IPC value [components/h]
According to the vendor-neutral conditions of the IPC 9850 standard published by the Association of Connecting Elec-
tronics Industries.
SIPLACE benchmark value [components/h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set
out in the SIPLACE scope of service and supply.
SIPLACE SX2 placement
machine
Placement area IPC value Benchmark value
C&P20 P2 / C&P20 P2 66,000 86,500
C&P20 P2 / CPP
*a
52,500 66,000
CPP
b
/ CPP
b
38,000 46,000
*b
CPP / TH 23,100 27,000
TH / TH 10,200 11,000
SIPLACE SX1 placement
machine
Placement area IPC value Benchmark value
C&P20 P2 33,000 43,000
CPP
a
19,000 23,000
TH 5,100 5,500
*)a MultiStar CPP: low installation position
*)b MultiStar CPP: high installation position