00198661-02_UM_SX12-V3_EN.pdf - 第139页

Instruction manual SIPLACE SX1/SX2 Edition V2 and V3 3 Technical data and assemblies From software version SC.713.1 Edition 12/2020 3.7 Placement head 139 3.7.6.1 T echnical dat a SIPLACE T winS tar with compo nent camer…

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3 Technical data and assemblies Instruction manual SIPLACE SX1/SX2 Edition V2 and V3
3.7 Placement head From software version SC.713.1 Edition 12/2020
138
3.7.6 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.7 - 11 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
Instruction manual SIPLACE SX1/SX2 Edition V2 and V3 3 Technical data and assemblies
From software version SC.713.1 Edition 12/2020 3.7 Placement head
139
3.7.6.1 Technical data
SIPLACE TwinStar
with component camera type 33
(fine pitch camera)
with component camera type 25
(flip chip camera)
Component range
*a
0402 to SO, PLCC, QFP, BGA, special compo-
nents, bare dies, flip-chips
0201 to SO, PLCC, QFP, sockets,
plugs, BGA, special components, bare
dies, flip-chips, shields
Component specs
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*b
25 mm / 40 mm
*c
300 µm
150 µm
350 µm
200 µm
1.0mm x 0.5mm
55 mm x 45 mm (single measurement)
Up to
200 mm x 125 mm (multiple measurement)
*d
100 g to 160 g
*e
25 mm / 40 mm*
c
250 µm
100 µm
140 µm
80 µm
0.6mm x 0.3mm
16 mm x 16 mm (single measurement)
Up to
55 mm x 55 mm (multiple measure-
ment)*
d
100 g to 160 g*
e
Set-down force 1.0 N - 15 N
1.0 N - 30 N with OSC package
2.0 N - 70 N*
c
2.0 N -100 N
*f
1.0 N - 15 N
1.0 N - 30 N with OSC package
2.0 N - 70 N*
c
2.0 N -100 N*
f
Nozzle types
*g
5xx (standard)
20xx/28xx + adapter
4xx + adapter
9xx + adapter
gripper
5xx (standard)
20xx/28xx + adapter
4xx + adapter
9xx + adapter
gripper
Nozzle spacing for P&P
heads
70.8 mm 70.8 mm
X/Y accuracy
*h
± 26 µm/3σ ± 22 µm/3σ
Angular accuracy ± 0.05° / 3σ ± 0.05° / 3σ
Illumination level 6 6
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
*)b Component plus nozzle or gripper.
*)c Maximum height up to 50 mm with SIPLACE Very High Force Twin Star (VHF TH) and OSC package. possible.
*)d Depending on the component dimensions and component infeed, other restrictions may also apply, which SIPLACE Pro will
automatically take into account.
*)e Up to 100 g is standard. Over 100 g available with reduced acceleration. From 160 g only with SIPLACE Very High Force Twin
Star (VHF TH). See also SIPLACE Very High Force TwinStar (VHF TH) on page 326.
*)f Only with SIPLACE Very High Force Twin Star (VHF TH) and OSC package
*)g Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available online.
*)h The accuracy values fulfill the conditions in the SIPLACE scope of supply and services.
3 Technical data and assemblies Instruction manual SIPLACE SX1/SX2 Edition V2 and V3
3.8 Gantry system From software version SC.713.1 Edition 12/2020
140
3.8 Gantry system
3
3.8.1 Gantry positions
3
Fig. 3.8 - 1 Position of gantries in the SX2 placement machines
(1) Gantry 1
(2) Y axis, gantry 1 and gantry 2
(3) Y axis, gantry 1 and gantry 2 (concealed)
(4) Gantry 2
(T) Direction of PCB transport
CAUTION
Always take hold of the handle to push the gantry - only for SIPLACE SX1/SX2 V3
The handle for pushing the gantry is only present on the SIPLACE SX1/SX2 V3. To avoid
damage to the gantry, always use the handle provided to manually move the gantry on the
SIPLACE SX1/SX2 V3. See item (3) in fig. 3.8 - 2
, page 141 or item (4) in fig. 3.8 - 3, page
142
.
(1)
(2)
(4)
(3)