2OM-1104-001.pdf - 第39页

T able 3B3 A through hole or a pad mark should have only one lead which is di- rected in increments of 45 . Consult our marketing department for details such as dimensions, etc. 0009-002 Chapter 1 2 16 AFU01EDTP 1.2 Oper…

(8) Fiducial Marks

P.E.C. Fiducial Marks

Material

• Copper Leaf (Au and Ni plating possible but mirror surfaces cannot be used.)

• Solder-Plated Marks (Consult our marketing department for details.)

• Solder Leveler (Consult our marketing department for details.)

Type and Size

Table 3B2

0004-001 Chapter 1 2 15 AFU01EDTP

1.2 Operation Data

Table 3B3

A through hole or a pad mark should have only one lead which is di-

rected in increments of 45 .

Consult our marketing department for details such as dimensions, etc.

0009-002 Chapter 1 2 16 AFU01EDTP

1.2 Operation Data

Regulations regarding Mark Surroundings

• A fiducial mark should make ample contrast with the surroundings. (Preven-

tion of False Recognition)

• The shape of P.C.B. (a cutout, a punched hole), the external elements (light

reflected from a structure, light emitted from an external device, etc.,) may

sometimes interfere with recognition.

(Consult our marketing department for details.)

• A copper leaf, a resist, a coating, a silk print, and a punched hole should not

exist in the range of 1.0 mm in both X and Y directions from the outermost

edges of a fiducial mark. They may cause false recognition.

Fig. 3B50

• Anything resembling a pattern similar to a fiducial mark should not exist in

the designated recognition area. If one exists, it may cause false recogni-

tion.

Refer to "Chapter 2" in "Volume 1" for the material of the screen

plate and the settings of screen fiducial marks.

Specification of Lines extended from a Pad Mark or a Through Hole

Unit: mm

Fig. 3B52

0009-002 Chapter 1 2 17 AFU01EDTP

1.2 Operation Data