1OM-1064-002.pdf - 第37页

2. Specifications 9910-001 1-7 Tg0246-PM-OP 8. Vacuum Nozz le Change Time Approx. 1 second/point (under optimum conditions) 9. PCB Transition Tim e Approx. 4.5 seconds (under optimum conditions) 10. Minimum Uni t of X/Y …

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2. Specifications
9910-001 1-6 Tg0246-PM-OP
5. Conditions of PCB
before Placement
Max. 30
　
3.5
PCB
φ
3
φ
2
PCB Support Pin
(The figure is based on the assumption that
the PCB is being transferred.)
Range (Shadowed Area) where
previously-placed components
should not be placed
Component
2.8
PCB Support Pin (Several Places)
Notes :
3.5
Max. 25.4
3.5 3.5
(a) The pin can be shifted at "40 mm" pitch.
(The shifting is partly possible at "10 mm" or "20 mm" pitch.)
(b) Set the Support pins such that they do not touch the already placed
components.
(c) The figure shows that the PCB is being supported.
Note :
The dimensions are those for design reference. Leave some room for
the actual setting.
6. Component
Placeable Range
Glue
SOP
Cream Solder
QFP
Min. 3.5
Min. 3.8
Min. 3.5
Reference Plane
Upper Surface of
P.C.B.
QFP
PCB
Max. 25.4
Reference Plane
11
PCB Stopper
(either one of the right and left stoppers)
6
19
19
PCB Stopper
(either one of the right and left stoppers)
Notes : (a) The above figure shows that the vacuum nozzles are not
protruding from the outer shapes of components.
Consult our sales personnel for details.
(b) Components cannot be placed in the shadowed area.
(c) Components cannot be placed in the range
(0.5 mm) around the opening such as a hole.
(d) The center of the mark is the reference point.
The reference point and plane differ depending on the contents
of the specifications. There is no change in the distance between
the reference point and the PCB stopper. Consult our sales
personnel for details.
7. Placement Time
Chip-Type Components : Approx. 0.46 sec/pc. (Highest Speed)
ICs (SOP/QFP) : Approx. 0.46 sec/pc. (Highest Speed)
BGA/CSP/FC : Approx. 0.9 sec/pc. (Highest Speed)
Notes : (a) PCB transition time is not included in the placement time under
optimum conditions.
(b) The placement time changes depending on feeder types and
requirements for component placement.
Consult our sales personnel for details.
Unit : mm
Unit : mm
2. Specifications
9910-001 1-7 Tg0246-PM-OP
8. Vacuum Nozzle
Change Time
Approx. 1 second/point (under optimum conditions)
9.
PCB Transition
Time
Approx. 4.5 seconds (under optimum conditions)
10. Minimum Unit of
X/Y Beam
Movement
0.01 mm (Designation of Placement coordinates)
(Resolution : 0.0025 mm/pulse)
11. Placement Angle
and Unit
0°
to 359°
59′ (1′
pitch)
(Rotational Resolution : 0.007° /pulse)
12. Placement
Accuracy
Chip-Type Component : ±
0.07 mm
IC (SOP, QFP, PLCC) : ±
0.04 mm
13. Applicable Feeders
• Tape Feeders
• Stick Feeders (Vibratory)
• Multi-Layer Tray Feeders (Option)
Notes : (a) Use the feeders especially prepared for the TIM-5000 series. The
feeders for another machine cannot be used.
(b) Refer to the specifications of each feeder for details.
14. Feeder Allocation Feeders can be installed on
“1 to 6” positions. Consult
our sales personnel for feeder
installation and combination.
Note : Stick feeders (vibratory) can be installed on only Feeder Base #1, #2
(Standard Specifications). Installation on a feeder base other than
Feeder Base #1, #2 is optional.
(Front Side of Machine)
6
Only Tray
Feeder
5
Only Tray
Feeder
12
34
PCB
2. Specifications
0004-002 1-8 Tg0246-PM-OP
15. Applicable
Components
(1) Applicable Components
Size : 1.0 × 0.5 to 55 × 55 (150 × 26) mm
Thickness : Max. 25.4 mm
Lead Pitch : 0.3 mm or more
Ball Size : φ 0.19 mm or more
Ball Pitch : 0.27 mm or more
Connector : Max. 150 × 26 mm
Note :
Some components cannot be used due to the mechanical characteristics
and shapes, etc.
Consult our sales personnel for details.
Applicable Components
•
Square Components
Resistors, Laminated Capacitors, Coils,
Chip Ceramic Filters, Other similar-shaped components
•
Leaded Components
Mini-Mold Transistors, Mini-Power Transistors, Filters, LEDs,
Diodes, Coils,
Other similar-shaped components
•
Deform Components
Tantalum Capacitors, Semi-Fixed Potentiometers, Aluminum Electrolytic
Capacitors, Trimmer Capacitors, Other similar-shaped components
•
Cylindrical Components
Resistors, Capacitors, Diodes,
Other similar-shaped components
•
ICs
Mini-Flat ICs, Plastic Chip Carrier with Leads,
Other similar-shaped components
•
Others
BGA, CSP, FC, Other similar-shaped components
(2)
Packaged Posture Standards
Tapes and Reels : JIS/EIAJ or its equivalent
•
Paper Tapes (Width : 8 mm)
•
Embossed Tapes (Width : 8 to 72 mm)
•
Adhesive Tapes (Width : 32 mm)
Reel Outer Diameter : φ 382 mm or less
Stick Feeder : 3.5 to 16 × 14 to 33 × 270 to 600 mm
Tray Feeder : 100 to 230 × 100 to 360 mm
Note :
Some taping sizes are limited. Some taped components, stick
components, or tray components cannot be used due to the mechanical
characteristics. Consult our sales personnel for details.