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V- 38 Programming Manual Part V Other Function 3.3 Advanced In case inspection data is not appropriately extracted or there is not enough memory , use Advance . Press Advance in Figure 3-1 1 and the dialog shown in Figur…

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Programming Manual

Part V Other Function

Step9: Press Deploy. The inspection data is automatically extracted.

CAUTION

Delete unnecessary inspection data.

NOTE

Images can be retaken by pressing Scan2 until Deploy is pressed.

Figure 3-10 Deploy

Step10: Press OK to conﬁ rm the inspection data.

NOTE

If Fresh Start is pressed, the screen goes back to Step2 after deleting inspection data

without deleting area windows.

NOTE

If Cancel is pressed, THD Window Creator will close after deleting area windows and

inspection data.

Figure 3-11 Conﬁ rm the component

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Programming Manual

Part V Other Function

3.3 Advanced

In case inspection data is not appropriately extracted or there is not enough memory, use Advance.

Press Advance in Figure 3-11 and the dialog shown in Figure 3-12 appears. After all the settings are

completed, press OK.

Figure 3-12 Advanced

Item Description

Lighting

Select the lighting for detecting the difference between the images of the bare PCB and

assembled PCB. Default is LowLight.

Reduction(pix)

Set the image compression rate. This is effective when reducing the memory usage on a PC.

However, images become grainy.

If set to 1, images are not compressed.

If set to 2, images are compressed to 1/4.

If set to 3, images are compressed to 1/9.

Default is 2.

Minimum size(pix)

The minimum sizes of the length and width of the inspection target. If the inspection target

size is smaller than Minimum size, the inspection data cannot be extracted. Default is 30.

Table 3-1 Advanced

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Programming Manual

Part V Inspection Data

4 FUJIYAMA

FUJIYAMA is the algorithm for a solder side inspection of discrete components.

FUJIYAMA can be used in fare-paying software.

Figure 4-1 FUJIYAMA

4.1 Inspection Overview

FUJIYAMA is the algorithm to inspect copper, hole, pin, ﬁ llet, and bridge in one inspection window.

Inspection Item Defect

Copper Inspection Pad exposure

Pin Hole Inspection Hole in solder part

Straight Pin Inspection No pin

Clinch Pin Inspection No pin

Fillet Inspection Too much solder, Too little solder

Bridge Inspection Bridge

Table 4-1 Inspection Item and Defect