SM482PLUS_Admin(Eng_Ver2.8).pdf - 第227页
7-55 Part Registration Cross 4P Used for QFP and PLCC types, Selected when recognizing the part four times in both the diagonal directi ons of the part. Linear H Used for connectors. Checks the left an d right surfac…
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SM PLUS Administrator’s Guide
<Sampling level for body recognition> edit box
Enabled when the <Use Edge Matching> check button is selected. Set the
sampling accuracy when recognizing the body. (0~10, 0: auto)
Use the default value.
<Sampling level for lead recognition> edit box
Enabled when the <Use Edge Matching> check button is selected. When
recognizing the lead, set the sampling accuracy. (0~10, 0: auto)
Use the default value.
Memo Of the connector parts, if a part cannot be registered as a User-IC, it
can be registered using this function.
In the case of a connector whose various lead lengths and lead pitches
exist in one direction, using this function after registering all lead
lengths and lead pitches will allow a part to be easily recognized.
<MFOV Type> Select Box
In the case of a large part that cannot be recognized at a time using the fix camera,
the vision system performs split recognition several times.
Selectable types of split recognition are as follows:
None
Selected when not using the 'Split Recognition ' function (MFOV).
Cross 2P
Used for QFP and PLCC types, Selected when recognizing the part twice in
the diagonal direction of the part.
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Part Registration
Cross 4P
Used for QFP and PLCC types, Selected when recognizing the part four times
in both the diagonal directions of the part.
Linear H
Used for connectors. Checks the left and right surfaces twice in the horizontal
direction.
Linear V
Used for connectors. Checks the upper and lower surfaces twice in the vertical
direction.
<MFOV Length (mm)> View Field
Inputs the distance through which the head is to move for split recognition.
<Heat Sink> check box
Selected when a radiator is attached on the part body. If this function is selected,
when there are more than two upper leads, only the lower lead is recognized
without recognizing the upper leads.
Memo This 'Heat Sink' function is applied only to TR and small SOP.
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SM PLUS Administrator’s Guide
Ball Parts (BGA, Flip Chip)
Describes the recognition option applied to most of ball parts. For more detailed
description, refer to the description on the MFOV of a leaded part (IC).
MFOV Type
In the case of a large part that cannot be recognized at once using the fix camera,
the vision system performs split recognition several times. Applied to both BGA
and flip chip.
MFOV Length
Enter the distance through which the head is to move for split recognition. Applied
only to BGA.