SM482PLUS_Admin(Eng_Ver2.8).pdf - 第229页

7-57 Part Registration Description All Leadless (Chip) Circl e Mel f T ant al Alumin um Chip- C Chip -R LE D Re ct Tr i m m er Recognition Area Margin OO OO O O OO O O Recognition Threshold OO OO O O OO O O Polarity O O …

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7-56
SM PLUS Administrator’s Guide
Ball Parts (BGA, Flip Chip)
Describes the recognition option applied to most of ball parts. For more detailed
description, refer to the description on the MFOV of a leaded part (IC).
MFOV Type
In the case of a large part that cannot be recognized at once using the fix camera,
the vision system performs split recognition several times. Applied to both BGA
and flip chip.
MFOV Length
Enter the distance through which the head is to move for split recognition. Applied
only to BGA.
7-57
Part Registration
Description All
Leadless (Chip)
Circl
e
Mel
f
Tant
al
Alumin
um
Chip-
C
Chip
-R
LE
D
Re
ct
Trimm
er
Recognition
Area Margin
OOOO O O OOO O
Recognition
Threshold
OOOO O O OOO O
Polarity O O O O O O O O O O
Polarity
Direction
OOOO O O OOO O
Center Offset
Check
OOOO O O OOO O
Inspection in
only 0°
OOOO O O OOO O
Over-
tolerance
OOOO O O OOO O
Under-
tolerance
OOOO O O OOO O
Ignore
Center Offset
OOOO O O OO
Accuracy
Option
MFOV Type
MFOV
Length
R Flip Auto
Check
O
Rank O
Rough
Check
OO
Heat Sink
7-58
SM PLUS Administrator’s Guide
Description All
Leaded Ball
T
R
S
O
P
S
OJ
QF
P
PL
CC
He
mt
Conne
ctor
User
-IC
Ins
ert
BG
A
Flip
Chip
Recognition
Area Margin
O OOOOO O O O O OO
Recognition
Threshold
O OOOOO O O O O OO
Polarity O OOOOO O O O O OO
Polarity
Direction
O OOOOO O O O O OO
Center Offset
Check
O OOOOO O O O O OO
Inspection in
only 0°
O OOOO O O O O
Over-
tolerance
OO
Under-
tolerance
OO
Ignore Center
Offset
O
Accuracy
Option
OOOO O O O O
MFOV Type OOOO O O O O OO
MFOV Length O O O O O O O O O
R Flip Auto
Check
Rank
Rough Check
Heat Sink O