SM482PLUS_Admin(Eng_Ver2.8).pdf - 第228页
7-56 SM PLUS Administrator’s Guide Ball Parts (BGA, Flip Chip) Describes the recognition option applied to most of ball parts. F o r more detailed description, refer to the description on the MFOV of a leaded part (IC)…
7-55
Part Registration
Cross 4P
Used for QFP and PLCC types, Selected when recognizing the part four times
in both the diagonal directions of the part.
Linear H
Used for connectors. Checks the left and right surfaces twice in the horizontal
direction.
Linear V
Used for connectors. Checks the upper and lower surfaces twice in the vertical
direction.
<MFOV Length (mm)> View Field
Inputs the distance through which the head is to move for split recognition.
<Heat Sink> check box
Selected when a radiator is attached on the part body. If this function is selected,
when there are more than two upper leads, only the lower lead is recognized
without recognizing the upper leads.
Memo This 'Heat Sink' function is applied only to TR and small SOP.
7-56
SM PLUS Administrator’s Guide
Ball Parts (BGA, Flip Chip)
Describes the recognition option applied to most of ball parts. For more detailed
description, refer to the description on the MFOV of a leaded part (IC).
MFOV Type
In the case of a large part that cannot be recognized at once using the fix camera,
the vision system performs split recognition several times. Applied to both BGA
and flip chip.
MFOV Length
Enter the distance through which the head is to move for split recognition. Applied
only to BGA.
7-57
Part Registration
Description All
Leadless (Chip)
Circl
e
Mel
f
Tant
al
Alumin
um
Chip-
C
Chip
-R
LE
D
Re
ct
Trimm
er
Recognition
Area Margin
OOOO O O OOO O
Recognition
Threshold
OOOO O O OOO O
Polarity O O O O O O O O O O
Polarity
Direction
OOOO O O OOO O
Center Offset
Check
OOOO O O OOO O
Inspection in
only 0°
OOOO O O OOO O
Over-
tolerance
OOOO O O OOO O
Under-
tolerance
OOOO O O OOO O
Ignore
Center Offset
OOOO O O OO
Accuracy
Option
MFOV Type
MFOV
Length
R Flip Auto
Check
O
Rank O
Rough
Check
OO
Heat Sink