SM482PLUS_Admin(Eng_Ver2.8).pdf - 第27页

Preface xiii Upward vision MEGA FOV 35 mm IC, Connector Less than □ 16 mm, Lead pitch: More than 0.3 mm Less than □ 32 mm, Lead pitch: More than 0.4 mm □ 32~ □ 42mm: Segmentation recognition (Ball Dia. More than 0.5mm, M…

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Multi-Functional Placer SM482(L) PLUS Administrator’s Guide
xii
Flying vision
FOV 16 mm
Chips
0603~□14 mm
IC,
Connector
Less than □14 mm,
Lead pitch: More than
0.5 mm
BGA, CSP
Less than □14 mm,
Ball Dia.: More than
0.325mm,
Ball pitch: More than
0.65 mm
Maximum
Height
12 mm
Flying vision
FOV 25 mm
Chips
1005~□22 mm
IC,
Connector
Less than □22 mm,
Lead pitch: More than
0.5 mm
BGA, CSP
Less than □17 mm,
Ball Dia.: More than
0.375mm,
Ball pitch: More than
0.75 mm
Maximum
Height
12 mm
Preface
xiii
Upward vision
MEGA FOV 35
mm
IC,
Connector
Less than □16 mm,
Lead pitch: More than
0.3 mm
Less than □32 mm,
Lead pitch: More than
0.4 mm
□32~□42mm:
Segmentation recognition
(Ball Dia. More than
0.5mm, More than Ball
pitch 1.0 mm, More than
Lead pitch 0.5 mm)
□42~□55mm:
Segmentation recognition
(Ball Dia. More than
0.5mm, More than Ball
pitch 1.0 mm, More than
Lead pitch 0.65 mm)
BGA, CSP
Less than □16 mm,
Ball Dia.: More than 0.2
mm, Lead pitch: More
than 0.4 mm
Less than □32 mm,
Ball Dia.: More than 0.25
mm, Lead pitch: More
than 0.5 mm
Maximum
Height
15 mm
Multi-Functional Placer SM482(L) PLUS Administrator’s Guide
xiv
Upward vision
MEGA FOV 45
mm
IC,
Connector
Less than □16 mm,
Lead pitch: More than
0.3 mm
Less than □32 mm,
Lead pitch: More than
0.4 mm
Less than □42 mm,
Lead pitch: More than
0.5 mm
□42~□55mm:
Segmentation recognition
(Ball Dia. More than
0.5mm, Ball pitch More
than 1.0 mm, Lead pitch
More than 0.8 mm)
Connector diagonal
length 55~75mm:
Segmentation recognition
(Lead pitch More than 1.0
mm)
BGA, CSP
Less than □16 mm,
Ball Dia.: More than 0.2
mm,
Lead pitch: More than
0.4 mm
Less than □32 mm,
Ball Dia.: More than 0.25
mm,
Lead pitch: More than
0.5 mm
Less than □42 mm,
Ball Dia.: More than 0.4
mm,
Lead pitch: More than
1.0 mm
Maximum
Height
15 mm
Upward vision
FOV 35 mm
IC,
Connector
Less than □32 mm,
Lead pitch: More than
0.4 mm
□32~□42mm:
Segmentation recognition
(Ball Dia. More than
0.5mm, More than Ball
pitch 1.0 mm, More than
Lead pitch 0.5 mm)
□42~□55mm:
Segmentation recognition
(Ball Dia. More than
0.5mm, More than Ball
pitch 1.0 mm, More than
Lead pitch 0.65 mm)
BGA, CSP
Less than □32 mm,
Ball Dia.: More than
0.375 mm,
Lead pitch: More than
0.75 mm
Maximum
Height
15 mm