SM482PLUS_Admin(Eng_Ver2.8).pdf - 第30页

Multi-Functional Placer SM482( L) PLUS Administrator’s Guide xvi Placement Accuracy The placement precision for applicable componen ts type is shown in the following table, and is applicable to genera l components usage …

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Preface
xv
The placement Speed
The following data concerns the speed of placement for each part. The actual cycle time
can vary depending on the size of PCB, frequency of the nozzle replacement, etc.
The pick and place cycle time
Tablei.2The pick and place speed
Memo In actual placement, the conditions that determine the cycle time may
vary depending on many factors such as the type of components, size
of PCB, placement position, etc. For more detailed information,
please contact our business department or the local agent.
Upward vision
FOV 45 mm
IC,
Connector
Less than □42 mm,
Lead pitch: More than
0.5 mm
□42~□55mm:
Segmentation recognition
(Ball Dia. More than
0.5mm, Ball pitch More
than 1.0 mm, Lead pitch
More than 0.8 mm)
Connector diagonal
length 55~75mm:
Segmentation recognition
(Lead pitch More than 1.0
mm)
BGA, CSP
Less than □42 mm,
Ball Dia.: More than 0.4
mm,
Lead pitch: More than
1.0 mm
Maximum
Height
15 mm
Classifi
cation
Speed Remarks
Chip
30,000 CPH(1608)
Simultaneous Pickup Standard Fly Vision
Multi-Functional Placer SM482(L) PLUS Administrator’s Guide
xvi
Placement Accuracy
The placement precision for applicable components type is shown in the following table,
and is applicable to general components usage as well.
The degree of placement may be different according to the composition of options for the
camera used for recognition of parts.
Classification XY R Cpk Remarks
Chip 0402 ± 0.04
mm
± 5.00 ° 1.0 Flying Vision MEGA FOV16
mm, Mount Offset
Chip 0603 ± 0.08
mm
± 5.00 ° 1.0 Flying Vision(Mega-
FOV25mm, Non-Mega-
FOV16mm)
Chip 1005 ± 0.10
mm
± 5.00 ° 1.0 Flying Vision(FOV16mm,
FOV25mm)
QFP100 0.5 P ± 0.06
mm
± 0.25 ° 1.0 Flying Vision(FOV25mm),
Upward Vision(FOV35mm,
FOV45mm)
QFP168 0.3 P ± 0.03
mm
± 0.20 ° 1.0 Upward Vision(Mega-
FOV35mm)
QFP256 0.4 P ± 0.05
mm
± 0.10 ° 1.0 Upward Vision(Mega-
FOV35mm, Mega-FOV45mm)
QFP304 0.5 P ± 0.06
mm
± 0.10 ° 1.0 Upward Vision(Mega-
FOV35mm(4 divisions),
FOV45mm)
BGA256 1.0 P ± 0.10
mm
± 0.40 ° 1.0 Flying Vision(FOV25mm),
Upward Vision(FOV35mm,
FOV45mm)
BGA □12 0.5 P
± 0.06
mm
± 0.30 ° 1.0 Upward Vision(Mega-
FOV35mm, Mega-FOV45mm)
BGA □17 0.75 P
± 0.10
mm
± 0.40 ° 1.0 Flying Vision(FOV25mm),
Upward Vision(FOV35mm,
FOV45mm)
BGA □52 1.27 P
± 0.10
mm
± 0.30 ° 1.0 Upward Vision(Mega-
FOV35mm(4 divisions),
FOV45mm)
Connector 75 mm
1.27 P
± 0.18
mm
± 0.25 ° 1.0 Upward Vision(Mega-
FOV45mm(2 divisions)
Preface
xvii
Mechanical Specifications
Size and mass of the machine
Height (Under the condition that the height of the PCB upper surface is 900 mm)
1: Up to the upper surface of signal light (2,090 mm)
2: Length (1,650 mm_L460 mm Conv., 1,990mm_L610 Conv., 2,140mm_L660 Conv., 1,850mm_L1,200
Conv.)
3: Width (1,680mm_Including front/rear cover, 2,030mm_Including operation unit)
4: Up to the upper surface of cover (1,530 mm)