operation-cp45.pdf - 第43页

Features and Scope of Equipment 1-5 1.2.4.1. General features  Speed The optimum condition for the tact tim e is specified.  The placed Component : 1608 chip  T ime Measurement The measured time from the first pickups…

Samsung Component Placer CP-45F(V)/FS Operations Manual

1-4

1.2.2.2. Stage vision recognition system(For CP-45FV /45FS)

Table 1-3. Applicable Component Sizes (Vision Recognition System)

CP-45FV / 45FS

Option

Classification

Standard

FOV35mm

FOV20mm FOV45mm

IC , Connector

~ □ 17mm: 0.3 mm pitch

~ □ 32mm: 0.4 mm pitch

~ □ 40mm: 0.5 mm pitch

( MFOV for more than

32mm)

Chips 1005~

~ □ 17mm: 0.3 mm

pitch

~ □ 32mm: 0.4 mm pitch

~ □ 42mm: 0.5 mm pitch

BGA

~ □ 32mm: 1.0mm pitch

~ □ 17mm: 0.5mm

pitch

~ □ 42mm: 1.0mm pitch

1.2.3. The placement precision

The placement precision for applicable components type is shown in Table 1-4, and is

applicable to general components usage as well.

Table 1-4. The placement Precision

Classification

Placement

precision

Remarks

Chip 0603

Chip 1005

± 0.08

± 0.1

FOV15mm Flying vision (CP-45FS)

± 0.065 FOV25mm Flying Vision(□ 25mm: 0.5 pitch)

QFP

± 0.040 FOV35mm Stage Vision(□ 17mm: 0.3 pitch)

± 0.065 FOV25mm Flying Vision(□ 17mm: 0.75 pitch)

BGA

± 0.080 FOV35mm Stage Vision(□ 32mm: 1.0 pitch)

± 0.065 FOV22mm flying Vision(□ 22mm: 0.5mm pitch)

Connector

± 0.05 FOV35mm Stage Vision(□ 32mm: 0.65mm pitch)

1.2.4. The pick & place cycle time

The descriptions given below refer to the best performance that can be obtained from the

pick & place cycle time. The actual cycle time can vary depending on the size of PCB,

frequency of the nozzle replacement, etc.

Features and Scope of Equipment

1-5

1.2.4.1. General features

 Speed

The optimum condition for the tact time is specified.

 The placed Component : 1608 chip

 Time Measurement

The measured time from the first pickups to return of the machine to the original

position following the final placement.(Off-line time, i.e., the time for recognizing the

fiducial mark, or PCB feed time, is excluded.)

Figure 1-2. The Summary for Measuring the Tact Time (6 Heads Simultaneous Pickups, Each

heads place)

The above speed is for the pick & place cycle time under the optimum conditions

(rounded off to 1msec). The experimental conditions is under using a very new

equipment with a taped PCB at the factory site, therefore, in actual placement, it can vary

according to the placement conditions.

Memo

Samsung Component Placer CP-45F(V)/FS Operations Manual

1-6

1.2.4.2. The pick & place cycle time for each model

Table 1-5. The pick & place Cycle Time for Each Model

Classification CP-45FV Remarks

Chip

0.197sec / component

(1608)

QFP

0.75 sec / component

(Flying Vision)

1.6 sec / component

(Stage Vision)

Connector

0.5 sec / component

(Flying Vision)

1.6 sec / component

(Stage Vision)

Simultaneous pickups under the optimum

conditions

Note) In the case of micro chips, lower it to

a proper speed by reducing the speed or

adjusting the delay variable according to the

placement status.

.Based on the optimum condition of QFP 80

(Y100mm, 100mm)

. Based on the optimum condition of black,

same interval, symmetrical type,

(Y 100mm , X 100mm)

The above are for the pick & place cycle time under the optimum conditions (rounded-off

to 1msec). In actual placement, the conditions that determine the cycle time may vary

depending on many factors such as the type of components, size of PCB, placement

position, etc. For more detailed information, please contact our Business Department or

C/S Center.

Memo