YV180X_Ope_E.pdf - 第100页

5 -24 EPD8008100 Operation Chapter 5 5 Creating the PCB data 1. BASIC INFO . parameters For descriptions of the B ASIC INFO. parameters other than “ 3 Required Nozzle ” , refer to “ 3.3.1 Standard chip components ” in th…

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5
-23
EPD8008100
Operation
Chapter 5
5
Creating the PCB data
3.3.2 Melf components (cylindrical components)
Melf components are registered with the parameters shown below.
MELF component parameters
27511-D8-00
6. SHAPE INFO.
Body Size X
Body Size Y
Body Size Z
Ruler Offset
LeadWidth
:
:
:
:
:
1.25
2.00
1.25
3
0.40
5. VISION INFO.
Alignment Group
Alignment Type
AlignmentModule
Light Selection
Lighting Level
Comp. Threshold
Comp. Tolerance
Search Area mm
Datum Angle
Comp. Intensity
MultiCam. Marker
:
:
:
:
:
:
:
:
:
:
:
Chip
Melf Chip
Fore&Back&Las
Main + Coax
6/8
Normal
NotUse
55
30
1.50
0
1. BASIC INFO.
Database No.
Comp. Package
Feeder Type
Required Nozzle
Feeder Set No.
Pos. Definition
Feeder Pos_X mm
:
:
:
:
:
:
:
Tape
8mm Tape
ForMELF S 72
Automatic
521
10
39.79
2. OPTION INFO.
FixCmpRef.
AIt.Cmp
Use feeder opt.
Comp. Group No.
Correct Pickpos
:
:
:
:
:
Yes
Not Use
0
0
0
3. PICK AND MOUNT INFO.
Pick Angle deg
Pick Timer
Mount Timer
Pick Height
Mnt Height
Pick Sequence
Mount Action
Mount Speed
PickupSpeed
XY Speed
Vacuum Check
Pick Vacuum
Mount Vacuum
Conv. Y Speed
:
:
:
:
:
:
:
:
:
:
:
:
:
:
4. DUMP INFO.
Dump Way
Retry Times
:
:
Dump POS
2
s
s
mm
mm
%
%
%
%
%
0
0.00
0.00
Normal
NORMAL
100
100
100
NORMAL CHK
FAST
0.5
0.5
50
50
1
2
3
4
5
6
41
42
43
44
45
46
47
48
49
50
51
11
12
13
14
15
31
32
61
62
63
64
21
22
23
24
25
26
27
28
29
n
NOTE
When setting the parameters shown in the sub-windows above, use the number keys to set
the parameters aligned on the right, while using the [INS], [DEL] or [Space] key to set
the parameters aligned on the left. However, there are some parameters which should be
set or optimized with the Adjust Assistant commands described later in 3.7 in this
chapter.
The displayed parameters differ slightly depending on the <3/1/A1 OPTION CONFIG>
settings.
5
-24
EPD8008100
Operation
Chapter 5
5
Creating the PCB data
1. BASIC INFO. parameters
For descriptions of the BASIC INFO. parameters other than 3 Required
Nozzle, refer to 3.3.1 Standard chip components in this chapter.
1. Comp. Package
2. Feeder Type
3. Required Nozzle
4. Feeder Set No.
5. Pos. Definition
6. Feeder Pos_X
2. OPTION INFO. parameters
For descriptions of the following OPTION INFO. parameters, refer to
3.3.1 Standard chip components in this chapter.
11. FixCmpRef.
12. Alt. Comp.
13. Use feeder opt.
14. Comp. Group No.
15. Correct Pickpos.
3. PICK & MOUNT INFO. parameters
21. Pick Angle deg
This parameter specifies the angle through which the mounter head rotates
to pick up a component on the feeder. This setting determines the orienta-
tion of the component (recognition reference) when it is recognized and
displayed on the vision monitor. Normally, set this parameter to 0° for
horizontally long components in the loading position, and set to 90° for
vertically long components. Select the correct pickup angle referring to the
table below.
Melf component pickup angle
25504-C0-00
0 deg. 90 deg.
Loading position
Pickup angle
NS
E
W
N
S
WE
c
CAUTION
Pickup angle setting directly affects the recognition reference and mounting angle. Be
careful not to mistake 0° for 180° for horizontally long components in the loading
position and 90° for -90° for vertically long components.
5
-25
EPD8008100
Operation
Chapter 5
5
Creating the PCB data
For descriptions of the following PICK & MOUNT INFO. parameters,
refer to 3.3.1 Standard chip components in this chapter.
22. Pick Timer, Mount Timer
23. Pick Height, Mount Height
24. Pick Sequence
25. Mount Action
26. Vacuum Check
27. Pick Vacuum, Mount Vacuum
These are reference vacuum pressures used for checking the pickup and
mount vacuum levels. For more details, see 3.7 Adjust Assistant com-
mands and 3.9 Pickup and mount vacuum pressures in this chapter.
28. Conv. Y Speed
4. DUMP INFO. parameters
31. Dump Way
Set to Dump POS. Refer to the Discard point parameter explained in the
mounter service manual.
32. Retry Times
See the description of 3.3.1 Standard chip components.
5. VISION INFO. parameters
41. Alignment Group
Set this parameter to Chip.
42. Alignment Type
Set this parameter to Melf Chip.
43. AlignmentModule
This parameter specifies the lighting method for recognizing a component.
Use the default setting (Fore&Back&Laser) in most cases. Refer to the
description in 3.3.1 Standard chip components for more details.
For descriptions of the following VISION INFO. parameters, refer to
3.3.1 Standard chip components.
44. Light Selection
45. Lighting Level
46. Comp. Threshold
47. Comp. Tolerance
48. Search Area
49. Datum Angle
50. Comp. Intensity
51. MultiCam Marker