YV180X_Ope_E.pdf - 第3页

iii E PD8013110 Contents 4. Creating the mark information ............................................ 5-72 4.1 Creating procedure ..................................................... 5-74 4.2 V arious parameter setting…

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Contents
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PD8013110
3. Starting the machine ............................................................. 4-6
3.1 Turning the power ON ................................................. 4-7
3.2 Return to origin ............................................................ 4-9
4. Warm-up ............................................................................. 4-10
5. Starting PCB production ..................................................... 4-13
6. Finishing PCB production.................................................... 4-22
7. Turning the power OFF ....................................................... 4-24
8. Changing the conveyor unit setup....................................... 4-26
8.1 Conveyor unit setup flow ........................................... 4-27
8.2 Conveyor width .......................................................... 4-29
8.3 Locate pins ................................................................. 4-30
8.4 PCB support plates ..................................................... 4-31
8.5 Transfer hook .............................................................. 4-32
8.6 Push-up pins .............................................................. 4-33
8.7 Edge clamp (option) ................................................... 4-34
9. HALFWAY CONTINUE command....................................... 4-35
9.1 Loading the saved data ............................................... 4-36
9.2 Editing mount flags ..................................................... 4-37
Chapter 5 Creating the PCB data
1. Overview .............................................................................. 5-3
2. Registering and selecting the PCB name ............................... 5-5
2.1 Registering PCB names ................................................. 5-6
2.2 Selecting the PCB name ............................................... 5-8
3. Creating the component information .................................. 5-10
3.1 Creating procedure ..................................................... 5-12
3.2 Various parameter settings .......................................... 5-15
3.3 Chip components ....................................................... 5-16
3.3.1 Standard chip components
(box type chip resistors and capacitors) ........... 5-16
3.3.2 Melf components (cylindrical components) ..... 5-23
3.4 IC components ........................................................... 5-27
3.4.1 Mini-mold transistor/SOT ................................ 5-27
3.4.2 SOP components ............................................ 5-32
3.4.3 QFP components ............................................ 5-37
3.5 Ball lead components ................................................. 5-42
3.5.1 Simple BGA .................................................... 5-42
3.5.2 BGA components (BGA setting)....................... 5-46
3.6 Connector components .............................................. 5-54
3.6.1 Connectors...................................................... 5-54
3.7 Adjust Assistant commands ........................................ 5-58
3.8 Setting the stick feeder component data ..................... 5-65
3.8.1 When optimizing the feeder set positions ........ 5-65
3.8.2 When not optimizing the feeder set positions .. 5-69
3.9 Registration location of component data .................... 5-71
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PD8013110
Contents
4. Creating the mark information............................................ 5-72
4.1 Creating procedure ..................................................... 5-74
4.2 Various parameter settings .......................................... 5-76
4.3 Adjust Assistant commands ........................................ 5-82
5. Clamping the PCB ............................................................... 5-86
6. Creating the PCB information ............................................. 5-89
6.1 Creating procedure ..................................................... 5-91
6.2 PCB origin .................................................................. 5-96
6.2.1 Normal PCB origin position setting ................. 5-97
6.2.2 Setting the PCB origin at a position other than the
locate pin ........................................................ 5-98
6.2.3 Setting the PCB origin for multi-block PCB ...... 5-99
7. Creating the mount information ....................................... 5-100
8. Checking the data ............................................................. 5-106
8.1 Checking the component information ...................... 5-106
8.2 Checking the mount information .............................. 5-107
9. Data optimization ..............................................................5-111
9.1 Selecting the data ......................................................5-112
9.2 Setting optimization conditions .................................5-113
9.3 Optimizing the data ..................................................5-116
10. Mounting test and data correction .................................... 5-117
10.1 Making setups for mounting test ................................5-118
10.2 Starting the test mount .............................................. 5-121
10.3 Error countermeasures during mounting test ............. 5-124
10.3.1 PCB data error............................................... 5-125
10.3.2 Fiducial mark recognition error ..................... 5-126
10.3.3 Component pickup error ............................... 5-128
10.3.4 Component recognition error ........................ 5-130
10.3.5 Component mount error................................ 5-131
10.4 Correcting the data after mounting test ..................... 5-133
11. Data backup...................................................................... 5-136
11.1 Creating a PCB data disk .......................................... 5-137
11.2 Data backup ............................................................. 5-139
12. Teaching and trace ............................................................ 5-140
12.1 Trace ........................................................................ 5-140
12.2 Teaching ................................................................... 5-142
12.2.1 Point teaching ............................................... 5-142
12.2.2 Vision cursor teaching ................................... 5-143
12.3 Automatic trace ........................................................ 5-147
13. Data editing for production PCB....................................... 5-148
13.1 Data editing ............................................................. 5-148
13.1.1 Copying the specified range .......................... 5-148
13.1.2 Deleting the specified range .......................... 5-150
13.1.3 Inserting one line .......................................... 5-151
13.1.4 Deleting one line .......................................... 5-152
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13.2 Data replace ............................................................. 5-153
13.2.1 Data replace in mount information ............... 5-153
13.2.2 Data replace in component information ........ 5-156
13.3 Data sort .................................................................. 5-159
Chapter 6 Using various functions
1. Overview .............................................................................. 6-3
2. Using the block repeat function ............................................ 6-4
2.1 Creating the block repeat data ...................................... 6-5
2.2 Block conversion .......................................................... 6-9
2.2.1 Executing the block conversion ....................... 6-10
2.2.2 Reconverting to the block repeat data ............. 6-12
3. Creating the user database .................................................. 6-14
3.1 Copying from the component or mark information ..... 6-15
3.2 Copying from the YAMAHA database ......................... 6-17
4. Static component information ............................................ 6-20
4.1 Registering the static component information ............. 6-21
4.2 Static component matching ........................................ 6-22
5. Using the fiducial functions ................................................ 6-24
5.1 PCB fiducial and block fiducial functions ................... 6-25
5.2 Local fiducial functions .............................................. 6-27
5.2.1 Point fiducial and local fiducial functions ....... 6-29
5.2.2 4-point fiducial ............................................... 6-32
6. Using the badmark functions .............................................. 6-36
6.1 PCB badmark and block badmark .............................. 6-37
6.1.1 Operation flow................................................ 6-38
6.1.2 Registering the badmark information ............... 6-39
6.2 Local badmark ........................................................... 6-40
6.3 Creating the badmark information .............................. 6-43
7. Self production control ....................................................... 6-47
8. Alternative component function ......................................... 6-51
8.1 Multiplying the component data ................................. 6-52
8.2 Optimizing the feeder set positions ............................ 6-54
8.3 Alternative component number .................................. 6-55
8.4 Component switching flow ......................................... 6-56
9. Pattern matching................................................................. 6-57
9.1 Pattern registration ..................................................... 6-58
9.2 Using the pattern matching data ................................. 6-65
Supplement
1. Nozzle table...........................................................................S-3
Index