YV180X_Ope_E.pdf - 第104页

5 -28 EPD8008100 Operation Chapter 5 5 Creating the PCB data 1. BASIC INFO . parameters For descriptions of the following BASIC INFO. parameters, refer to “ 3.3.1 Standard chip components ” in this chapter . 1. Comp. Pac…

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5
-27
EPD8008100
Operation
Chapter 5
5
Creating the PCB data
3.4 IC components
3.4.1 Mini-mold transistor/SOT
Mini-mold transistors and SOT components are registered with the param-
eters shown below.
Mini-mold transistor parameters
27512-D8-00
6. SHAPE INFO.
Body Size X mm
Body Size Y mm
Body Size Z mm
Ruler Offset
Ruler Width
Lead Number N
Lead Number S
ReflectLL. mm
LeadWidth mm
LeadPitch N mm
LeadPitch S mm
:
:
:
:
:
:
:
:
:
:
:
2.90
2.80
1.10
3
2
2
1
0.30
0.50
1.75
1.75
5. VISION INFO.
Alignment Group
Alignment Type
AlignmentModule
Light Selection
Lighting Level
Comp. Threshold
Comp. Tolerance
Search Area mm
Datum Angle
Comp. Intensity
MultiCam. marker
:
:
:
:
:
:
:
:
:
:
:
IC
Mini-Tr/SOT
Fore&Back&Las
Main + Coax
6/8
Normal
NotUse
30
30
1.50
0
1. BASIC INFO.
Database No.
Comp. Package
Feeder Type
Required Nozzle
Feeder Set No.
Pos. Definition
Feeder Pos_X mm
:
:
:
:
:
:
:
Tape
32mmEmboss
For2125Chp72
Automatic
602
12
71.79
2. OPTION INFO.
FixCmpRef.
AIt.Cmp
Use feeder opt.
Comp. Group No.
Correct Pickpos
:
:
:
:
:
Yes
Not Use
0
0
0
3. PICK AND MOUNT INFO.
Pick Angle deg
Pick Timer
Mount Timer
Pick Height
Mnt Height
Pick Sequence
Mount Action
Mount Speed
PickupSpeed
XY Speed
Vacuum Check
Pick Vacuum
Mount Vacuum
Conv. Y Speed
:
:
:
:
:
:
:
:
:
:
:
:
:
:
4. DUMP INFO.
Dump Way
Retry Times
:
:
Dump POS
2
s
s
mm
mm
%
%
%
%
%
0
0.00
0.00
Normal
NORMAL
100
100
100
NORMAL CHK
FAST
0.0
0.2
30
30
1
2
3
4
5
6
41
42
43
44
45
46
47
48
49
50
51
11
12
13
14
15
31
32
61
62
63
64
64
65
66
67
21
22
23
24
25
26
27
28
29
n
NOTE
When setting the parameters shown in the sub-windows above, use the number keys to set
the parameters aligned on the right, while using the [INS], [DEL] or [Space] key to set
the parameters aligned on the left. However, there are some parameters which should be
set or optimized with the Adjust Assistant commands described later in “3.7” in this
chapter.
The displayed parameters differ slightly depending on the <3/1/A1 OPTION CONFIG>
settings.
5
-28
EPD8008100
Operation
Chapter 5
5
Creating the PCB data
1. BASIC INFO. parameters
For descriptions of the following BASIC INFO. parameters, refer to “3.3.1
Standard chip components” in this chapter.
1. Comp. Package
2. Feeder Type
3. Required Nozzle
4. Feeder Set No.
5. Pos. Definition
6. Feeder Pos_X
2. OPTION INFO. parameters
For descriptions of the following OPTION INFO. parameters, refer to
“3.3.1 Standard chip components” in this chapter.
11. FixCmpRef.
12. Alt. Comp.
13. Use feeder opt.
14. Comp. Group No.
15. Correct Pickpos.
3. PICK & MOUNT INFO. parameters
21. Pick Angle deg
This parameter specifies the angle through which the mounter head rotates
to pick up a component on the feeder. This setting determines the orienta-
tion of the component (recognition reference) when it is recognized and
displayed on the vision monitor. The pickup angle for transistors must be
specified so that their leads face the NS directions. Set this parameter to 0°
for vertically long components in the loading position on the feeder, and
set to 90° for horizontally long components. Select the correct pickup
angle referring to the table below.
Mini-mold transistor pickup angle
25505-C0-00
0 deg. 90 deg. 0 deg. 90 deg.
Loading
position
Recognition
reference
Pickup angle
NS
E
W
N
S
EW
N
S
WE
NS
E
W
N
S
WE
N
S
EW
c
CAUTION
Pickup angle setting directly affects the recognition reference and mounting angle. Be
careful not to mistake 90° for -90° for horizontally long components in the loading
position and 0° for 180° for vertically long components.
5
-29
EPD8008100
Operation
Chapter 5
5
Creating the PCB data
For descriptions of the following PICK & MOUNT INFO. parameters,
refer to “3.3.1 Standard chip components” in this chapter.
22. Pick Timer, Mount Timer
23. Pick Height, Mount Height
24. Pick Sequence
25. Mount Action
26. Vacuum Check
27. Pick Vacuum, Mount Vacuum
28. Conv. Y Speed
4. DUMP INFO. parameters
31. Dump Way
Set to “Dump POS”. Refer to the Discard point parameter explained in the
mounter service manual.
32. Retry Times
See the description of “3.3.1 Standard chip components”.
5. VISION INFO. parameters
41. Alignment Group
Set this parameter to “IC”.
42. Alignment Type
Set to “Mini-Tr/SOT” when the diagonally (oppositely) located lead shape
is the same, and set to “P-Tr” if not.
Alignment Type setting for transistors
23510-C0-00
Mini Tr/SOT
P-Tr
43. AlignmentModule
This parameter specifies the lighting method for recognizing a component.
Use the default setting (Fore&Back&Laser) in most cases. See the
description in “3.3.1 Standard chip components” for more details.